Nonvolatile semiconductor memory device
View Patent ↗A memory cell array is included which is constituted by arranging the plurality of nonvolatile memory cells in a row direction and column direction respectively and arranging the plurality of word lines (WL) and the plurality of bit lines (BL) in the row direction and the column direction respectively in order to select a predetermined memory cell or a memory cell group out of the arranged nonvolatile memory cells, in which the memory cells are respectively constituted by connecting one end of a variable resistive element for storing information in accordance with a change of electrical resistances with the source of a selection transistor while in the memory cell array, the drain of the selection transistor is connected with a common bit line (BL) along the column direction, the other end of the variable resistive element is connected with a source line (SL), and the gate of the selection transistor is connected with the common word line (WL) along the row direction. According to the above memory cell configuration, it is possible to provide a nonvolatile semiconductor memory device capable of reducing voltage stresses applied to the variable resistive element of an unselected memory cell at the time of the reading and programming operations and securing a higher-reliability data holding characteristic.
1. A nonvolatile semiconductor memory device comprising:
a memory cell array constituted by arranging a plurality of nonvolatile memory cells in a row direction and a column direction respectively and arranging the plurality of word lines and the plurality of bit lines in the row direction and the column direction respectively in order to select a predetermined memory cell or a memory cell group out of the arranged nonvolatile memory cells; wherein;
the memory cells are respectively constituted by connecting one end of a variable resistive element for storing information in accordance with a change of electrical resistances with the source of a selection transistor,
in the memory cell array, the drain of the selection transistor is connected with a common bit line along the column direction, the other end of the variable resistive element is connected with a source line, and the gate of the selection transistor is connected with a common word line along the row direction, and
the variable resistive element is a variable resistive element whose electrical resistance is changed due to an electrical stress.
2. The nonvolatile semiconductor memory device according to claim 1 , wherein the variable resistive element is formed by a perovskite structural oxide containing manganese.
3. A nonvolatile semiconductor memory device comprising:
a memory cell array constituted by arranging the plurality of nonvolatile memory cells in a row direction and a column direction respectively and arranging the plurality of word lines and the plurality of bit lines in the row direction and the column direction respectively in order to select a predetermined memory cell or a memory cell group out of the arranged nonvolatile memory cells; wherein
the memory cells are respectively constituted by connecting one end of a variable resistive element for storing information in accordance with a change of electrical resistances with the source of a first selection transistor and moreover connecting the other end of the variable resistive element with the drain of a second selection transistor, and
in the memory cell array, the drain of the first selection transistor is connected with a common bit line along the column direction, the source of the second selection transistor is connected with a source line, and gates of the first and second selection transistors are connected with a common word line along the row direction.
4. The nonvolatile semiconductor memory device according to claim 3 , wherein the variable resistive element is a variable resistive element whose electrical resistances are changed due to an electrical stress.
5. The nonvolatile semiconductor memory device according to claim 4 , wherein the variable resistive element is formed by a perovskite-structural oxide containing manganese.