Surface mounted electrical components and method for mounting and retaining same
View Patent ↗Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.
1. An electronic assembly, comprising:
a printed circuit substrate including a retentive through hole, a plurality of lands, and
an electrical connector, comprising:
a housing;
a plurality of solder masses extending from a surface of the housing for electrically connecting the electrical connector to the lands of the circuit substrate; and
a retentive structure extending from the surface of the housing, spaced apart from the plurality of solder masses, and positioned within the through hole, the retentive structure comprising a base material and a plating material disposed over at least a portion of the base material, the retentive structure having a cross-sectional area smaller than an area of the through hole so that a clearance exists between the retentive structure and a periphery of the through hole;
wherein at least some of the plating material is for separating from the base material at a reflow temperature of the plurality of solder masses and combining with a solder composition within the through hole so that the solder composition and the plating material, upon cooling, form a bond between the printed circuit substrate and the retentive structure and the combination of the base material and the solder composition has a melting temperature that is higher than the melting temperature of the plurality of solder masses.
2. The electronic assembly of claim 1 , wherein the reflow temperature is about 180 degrees Celsius.
3. The electronic assembly of claim 1 , wherein the plating material is selected from the group comprising gold, palladium, platinum, silver, rhodium, iridium, osmium, ruthenium, and rhenium.
4. The electronic assembly of claim 1 , wherein the plating material comprises gold.
5. The electronic assembly of claim 1 , wherein the plating material comprises palladium.
6. The electronic assembly of claim 1 , wherein at least about 40% by volume of the plating material separates from the base material.
7. The electronic assembly of claim 1 , wherein at least about 60% by volume of the plating material separates from the base material.
8. The electronic assembly of claim 1 , further comprising a second electrical connector affixed to an opposite side of the printed circuit substrate than the electrical connector.
9. An electronic assembly, comprising:
a printed circuit substrate including a retentive through hole, a plurality of lands, and
an electrical connector, comprising:
a housing;
a plurality of solder masses extending from a surface of the housing for electrically connecting the electrical connector to a circuit substrate; and
a retentive structure extending from the surface of the housing, spaced apart from the plurality of solder masses, and positioned within the through hole, the retentive structure having a cross-sectional area smaller than an area of the through hole so that a clearance exists between the retentive structure and a periphery of the through hole, and being made with a material configured to separate from the retentive structure and combine with a solder composition within the through hole to affix the electrical connector to the circuit substrate at temperatures that initiate reflow of the plurality of solder masses.
10. The electronic assembly of claim 9 , wherein the combination of the material and the solder composition has a higher melting temperature than the melting temperature of the plurality of solder masses.
11. An electronic assembly, comprising:
a printed circuit substrate including a retentive through hole, a plurality of lands, and
an electrical connector, the electrical connector comprising:
a housing;
a retentive structure extending from a surface of the housing and being received by a through hole formed in the substrate for effecting a non-electrical connection with a circuit substrate, the retentive structure being made with a material that separates from the retentive structure and combines with a solder composition and alters a physical property of the solder composition in contact with the retentive structure within the through hole.
12. The electronic assembly of claim 11 , wherein the physical property is a melting temperature.
13. The electronic assembly of claim 12 , wherein the melting temperature is increased by at least about 10 degrees Celsius.
14. The electronic assembly of claim 12 , wherein the melting temperature of the material that combines with the solder composition is greater than the melting temperature of a solder mass that extends from the substrate.
15. The electronic assembly of claim 11 , wherein the retentive structure is made with a base material and a plating material disposed over at least a portion of the base material.
16. The electronic assembly of claim 15 , wherein the plating material is selected from the group comprising gold, palladium, platinum, silver, rhodium, iridium, osmium, ruthenium, and rhenium.
17. The electronic assembly of claim 11 , wherein the plating material includes gold.
18. The electronic assembly of claim 11 , wherein the plating material includes palladium.
19. The electronic assembly of claim 11 , further comprising a plurality of solder masses extending from the surface of the housing for effecting an electrical connection with a circuit substrate.
20. An electrical connector, comprising:
a housing;
solder masses extending from a surface of the housing for electrically connecting the electrical connector to a circuit substrate; and
a retentive structure extending from the surface of the housing, spaced apart from the plurality of solder masses, and being for positioning within a circuit substrate through hole, the retentive structure comprising a material that is for combining with a solder composition within the through hole such that the melting temperature of the combination of the material and the solder composition is greater than the melting temperature of the solder masses.
21. The electrical connector of claim 20 , wherein the material separates from the retention member so as to combine with the solder composition.