Pressure sensor containing fluorine-based adhesive
View Patent ↗A pressure sensor is provided with a semiconductor device that is capable of detecting a pressure, a terminal that is connected to the semiconductor device by a bonding wire, a housing having an accommodation space for the semiconductor device, the bonding wire, and the terminal, a diaphragm for sealing the accommodation space, and working fluid that is sealed in the accommodation space and transmits a pressure applied to the diaphragm to the semiconductor device. The working fluid is silicone-based oil, and the terminal and the housing are sealed by fluorine-based adhesive.
1. A pressure sensor including
a semiconductor device capable of detecting pressure;
a bonding wire;
a terminal that is connected to the semiconductor device by the bonding wire;
a housing having an accommodation space accommodating the semiconductor device, the bonding wire and the terminal;
a diaphragm sealing the accommodation space; and
a working fluid that is sealed in the accommodation space and transmits pressure applied to the diaphragm to the semiconductor device, wherein
the working fluid is a silicone-based oil; and
the terminal and the housing are sealed by a fluorine-based adhesive to prevent swelling of the adhesive.
2. A pressure sensor including
a semiconductor device capable of detecting pressure and in direct contact with the environment outside of the sensor;
a bonding wire;
a terminal that is connected to the semiconductor device by the bonding wire; and
a housing having an accommodation space accommodating the semiconductor device, the bonding wire and the terminal, wherein
the terminal and the housing are sealed by a fluorine-based adhesive.
3. The pressure sensor according to claim 1 , wherein the fluorine-based adhesive is a perfluoro polyether resin composition.
4. The pressure sensor according to claim 2 , wherein the fluorine-based adhesive is a perfluoro polyether resin composition.
5. The pressure sensor according to claim 2 , wherein the pressure sensor does not include a working fluid.
6. A method of making a pressure sensor including a semiconductor device capable of detecting pressure; a bonding wire; a terminal that is connected to the semiconductor device by the bonding wire; a housing having an accommodation space accommodating the semiconductor device, the bonding wire and the terminal; a diaphragm sealing the accommodation space; and a working fluid that is sealed in the accommodation space and transmits pressure applied to the diaphragm to the semiconductor device, where the working fluid is a silicone-based oil; and the terminal and the housing are sealed by a fluorine-based adhesive, the method comprising
sealing the terminal and the housing with the fluorine-base adhesive; and
producing the pressure sensor of claim 1 .
7. A method of making a pressure sensor including a semiconductor device capable of detecting pressure; a bonding wire; a terminal that is connected to the semiconductor device by the bonding wire; and a housing having an accommodation space accommodating the semiconductor device, the bonding wire and the terminal, where the terminal and the housing are sealed by a fluorine-based adhesive, the method comprising
sealing the terminal and the housing with the fluorine-based adhesive; and
producing the pressure sensor of claim 2 .