Method for forming pattern using printing process
View Patent ↗A pattern and method for forming a pattern includes providing a substrate on which a plurality of unit panels and etching object layers on the respective unit panel areas are formed, dividing the substrate into at least two or more areas, providing a cliché on which multiple grooves are formed, filling resist in the grooves, applying the resist filled in the groove of the cliché onto the etching object layer of the substrate by the divided area unit.
1. A method for forming a pattern, comprising:
providing a substrate on which a plurality of unit panels and etching object layers on the respective unit panel areas are formed, each of the unit panels including a plurality of gate lines and data lines defining a plurality of pixels, a thin film transistor in each pixel, and a pixel electrode in each pixel;
providing a cliché on which a plurality of grooves are formed, the cliché being divided into a plurality of portions corresponding in number and size to the plurality of unit panels of the substrate;
filling resist in the grooves;
transferring the resist in the grooves of at least one divided portion of the plurality of divided portions of the cliché but less than the total number of the plurality of the divided portions of the cliché onto substantially the whole area of a blanket applied on a surface of a printing roll by contacting and rotating the printing roll with respect to said at least one divided portion but less than the total number of the plurality of the divided portions of the cliché, the whole area of the blanket applied on the surface of the printing roll corresponding in size to (1) the area of said at least one divided portion of the plurality of divided portions of, but less than the total number of, the plurality of divided portions of the unit panels and (2) the area of at least one divided portion of the plurality of divided portions of, but less than the total number of, the plurality of divided portions of the cliché;
applying the resist transferred on the whole area of the surface of the blanket of the printing roll on to the etching object layer on said at least one divided portion of the plurality of divided portions of, but less than the total number of, the plurality of divided portions of the unit panels of the substrate; and
repeating the transferring process and applying process to the etching object layer on at least one other unit panel of the substrate from at least one other divided portion of the cliché using the printing rolling.
2. The method of claim 1 , wherein the printing roll has a same width as that of the corresponding unit panel of the substrate.
3. The method of claim 2 , wherein a length of the blanket of the printing roll is the same as a length of a circumference of the printing roll, which is same as a length of the unit panel of the substrate.
4. The method of claim 1 , wherein the printing roll is formed to have a same size as that of the unit panel of the substrate.
5. The method of claim 1 , wherein the etching object layer includes a metal layer.
6. The method of claim 1 , wherein the etching object layer includes an insulating layer comprised of SiOx or SiNx.
7. The method of claim 1 , wherein the etching object layer is a semiconductor layer.
8. The method of claim 1 , wherein the blanket improves adhesive force with the resist.
9. The method of claim 1 , wherein a total number of the plurality of unit panels is at least six, and the number of unit panels to which resist is transferred is three or fewer.