IP Library Granted Patent US 7,131,768
Granted Patent B2
US 7,131,768 · App. 10/736,766 · Granted Nov 7, 2006

Extended temperature range EMF device

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Quick Facts
Patent No.
US 7,131,768
App. No.
10/736,766
Granted
Nov 7, 2006
Kind
B2
Abstract

A sensor and method of manufacturing an extended temperature range EMF sensor that is cost effective and highly reliable, with a stable EMF output and with an operating range of up to 1700° C. in hostile environments. The sensor is formed of highly stable dispersion hardened materials capable of withstanding mechanical loads and chemical attacks at elevated temperatures while maintaining internal chemical integrity. Electronics are implemented to condition the devices output and convert it to an industry standard.

Claims (100)

1. A sensor which is resistant to degradation at high temperature; such sensor comprising:

a first electrically conductive component;

a second electrically conductive component in contact with said first electrically conductive component;

a pair of leads connected one each to said first and second electrically conductive component for transmitting an electrical signal;

said first electrically conductive component formed from at least one first noble metal and an oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these;

said second electrically conductive component formed from at least at least one second noble metal, different than the first noble metal, and an oxide deposited within grain boundaries and main body portion of the at least one second noble metal, the oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these.

2. The sensor of claim 1 , wherein, said second component further comprises the first noble metal.

3. The sensor of claim 2 , wherein, said second component comprises an alloy of said first and second noble metals.

4. The sensor of claim 1 , wherein, said first noble metal is a platinum group metal.

5. The sensor of claim 4 , wherein, said second noble metal is a platinum group metal.

6. The sensor of claim 4 , wherein, the first noble metal is platinum.

7. The sensor of claim 4 , wherein, the second noble metal is rhodium.

8. The sensor of claim 6 , wherein, the second component comprises a platinum rhodium alloy.

9. The sensor of claim 6 , wherein, the first component comprises platinum and where the oxide is dispersion hardened within grain boundaries and a main body portion of the platinum.

10. The sensor of claim 9 , wherein, the first component comprises yttrium oxide and zirconium oxide.

11. The sensor of claim 8 , wherein, the second component comprises a platinum rhodium alloy and where the oxide is dispersion hardened within grain boundaries and a main body of the platinum rhodium alloy.

12. The sensor of claim 11 , wherein, the second component comprises yttrium oxide and zirconium oxide.

13. The sensor of claim 12 , wherein, the platinum rhodium alloy is Pt-10% Rh.

14. The sensor of claim 1 , wherein, said electrical signal comprises a varying voltage.

15. The sensor of claim 14 , further comprising a transducer and wherein the varying voltage is applied to said transducer.

16. The sensor of claim 15 , further comprising a transducer output, said output correlating to a temperature.

17. The sensor of claim 16 , wherein, said transducer is a temperature measuring device.

18. The sensor of claim 16 , wherein, said transducer output correlates to calibration data.

19. The sensor of claim 16 , wherein, said transducer output correlates to a standard reference output.

20. The sensor of claim 16 , wherein, said transducer output correlates to a National Institute of Standards and Technology reference.

21. The sensor of claim 16 , wherein, said transducer output correlates to an International Electrotechnical Commission reference.

22. The sensor of claim 14 , further comprising a conditioner and wherein the varying voltage is applied to said conditioner.

23. The sensor of claim 22 , further comprising a conditioner output, said output comprising a conditioned varying voltage.

24. The sensor of claim 22 , wherein, said varying voltage is adapted to power electronics.

25. The sensor of claim 23 , wherein said conditioner output is adapted to power electronics.

26. The sensor of claim 1 , wherein, the sensor is a thermocouple.

27. The sensor of claim 1 , wherein, the sensor is a heat flux sensor.

28. The sensor of claim 26 , wherein, the sensor comprises one of a parallel array of sensors to create a thermopile.

29. The sensor of claim 26 , further comprising at least one sheath, said sheath housing at least one component.

30. The sensor of claim 29 , wherein, said sheath is formed from at least one noble metal and an oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these.

31. The sensor of claim 29 , wherein, said sheath is formed of a high temperature alloy.

32. The sensor of claim 29 , further comprising insulation, said insulation insulating at least one component from at least on sheath.

33. The sensor of claim 32 , wherein, said insulation comprises a refractory material.

34. The sensor of claim 32 , wherein, said insulation comprises Al 2 O 3 .

35. The sensor of claim 32 , wherein, said insulation comprises MgO.

36. The sensor of claim 1 , further comprising a substrate, said first or second component formed by depositing on said substrate at least one noble metal and an oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these.

37. The sensor of claim 1 , adapted to operate up to 1700° C.

38. A sensor which is resistant to degradation at high temperature; said sensor comprising:

a first electrically conductive component;

a second electrically conductive component in contact with said first electrically conductive component;

said first and second electrically conductive components adapted to transmitting an electrical signal;

said first electrically conductive component formed from an oxide selected from the group consisting of the transitional metal oxides and the rare earth metal oxides, and combinations of these, said oxide dispersion hardened within a grain boundary and within a main body of a first base metal selected from the group consisting of the noble metals and the precious metals, and combination of these and;

said second electrically conductive component formed from an oxide selected from the group consisting of the transitional metal oxides and the rare earth metal oxides, and combinations of these, said oxide dispersion hardened within a grain boundary and within a main body of a second base metal, different than the first base metal, selected from the group consisting of the noble metals and the precious metals, and combination of these.

39. The sensor of claim 38 , wherein, said second component further comprises the first base metal.

40. The sensor of claim 39 , wherein, said second component comprises an alloy of said first and second base metals.

41. The sensor of claim 38 , wherein, said first base metal is a noble metal.

42. The sensor of claim 38 , wherein, said second base metal is a noble metal.

43. The sensor of claim 41 , wherein, said first base metal is a platinum group metal.

44. The sensor of claim 42 , wherein, said second base metal is a platinum group metal.

45. The sensor of claim 43 , wherein, the first base metal is platinum.

46. The sensor of claim 44 , wherein, the second base metal is rhodium.

47. The sensor of claim 46 , wherein, the second component comprises a platinum rhodium alloy.

48. The sensor of claim 47 , wherein, the first component comprises yttrium oxide and zirconium oxide.

49. The sensor of claim 47 , wherein, the second component comprises yttrium oxide and zirconium oxide.

50. The sensor of claim 38 , wherein, the sensor is a thermocouple, said thermocouple output is calibrated to a standard reference output.

51. The sensor of claim 38 , wherein, the sensor is a thermocouple adapted to measuring localized temperature.

52. The sensor of claim 38 , wherein, the sensor is a thermocouple adapted to generate a voltage to power devices.

53. A method for manufacturing a high temperature resistant sensor comprising:

forming a first electrically conductive component from at least one first noble metal and an oxide deposited within grain boundaries and main body portion of the at least one first noble metal, the oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these;

forming a second electrically conductive component from at least at least one second noble metal, different than the first noble metal, and an oxide deposited within grain boundaries and main body portion of the at least one first noble metal, the oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these;

joining said first and second electrically conductive components to form a junction; and

connecting a first and a second conductor to said first and second electrically conductive components respectively for transmitting electrical signals.

54. The method according to claim 53 , further comprising generating an electrical signal, wherein, the electrical signal is a varying voltage.

55. The method according to claim 54 , comprising transducing the varying voltage to an output.

56. The method according to claim 55 , comprising importing said output to a temperature measurement device.

57. The method according to claim 55 , comprising correlating the output to a calibration data.

58. The method according to claim 55 , comprising conditioning the output to power electronics.

59. The method according to claim 53 , further comprising forming the first component by dispersion hardening the oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these within grain boundaries and a main body portion of the at least one first noble metal.

60. The method according to claim 59 , further comprising forming the second component by dispersion hardening the oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these within grain boundaries and a main body portion of the at least one second noble metal.

61. The method according to claim 53 , comprising assembling the sensor as a thermocouple.

62. The method according to claim 53 , comprising assembling the sensor as a heat flux sensor.

63. The method according to claim 53 , comprising engaging the sensor as one of a parallel array of sensors to create a thermopile.

64. A sensor which is resistant to degradation at high temperature comprising:

a first electrically conductive component formed from an oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these, said oxide dispersion hardened within a grain boundary and within a main body of platinum;

a second electrically conductive component formed from an oxide selected from the group consisting of yttrium oxide, cerium oxide, zirconium oxide, and combinations of these, said oxide dispersion hardened within a grain boundary and within a main body of a platinum rhodium alloy, said second electrically conductive component in contact with said first electrically conductive component to form a junction;

a first conductor electrically connected to said first electrically conductive component;

a second conductor electrically connected to said second electrically conductive component; and

a transducer electrically connected to said first and second conductors.

65. The sensor of claim 64 , wherein, said electrical signal comprises a varying voltage, said varying voltage is applied to said transducer.

66. The sensor of claim 64 , further comprising a transducer output, said output correlating to a temperature.

67. The sensor of claim 64 , wherein, said transducer is a temperature measuring device.

68. The sensor of claim 66 , wherein, said transducer output correlates to calibration data.

69. The sensor of claim 66 , wherein, said transducer output correlates to a standard reference output.

70. The sensor of claim 66 , wherein, said transducer output correlates to a National Institute of Standards and Technology reference.

71. The sensor of claim 66 , wherein, said transducer output correlates to an International Electrotechnical Commission reference.

72. The sensor of claim 64 , wherein the transducer is a conditioner, said varying voltage is applied to said conditioner.

73. The sensor of claim 72 , further comprising a conditioner output, said output comprising a conditioned varying voltage.

74. The sensor of claim 73 , wherein, said varying voltage is adapted to power electronics.

75. The sensor of claim 73 , wherein said conditioner output is adapted to power electronics.

76. The sensor of claim 64 , wherein, the second component comprises yttrium oxide and zirconium oxide.

77. The sensor of claim 64 , wherein, the sensor is a thermocouple.

78. The sensor of claim 64 , wherein, the sensor is a heat flux sensor.

79. The sensor of claim 64 , wherein, the sensor comprises one of a parallel array of sensors to create a thermopile.

80. The sensor of claim 64 , adapted to operate up to 1700° C.

81. The sensor of claim 64 , comprising a pair of leads connected one each to said first and second component for transmitting the electrical signal.

Assignments (14)
SECURITY INTEREST Recorded Aug 26, 2025
From: TRANSDIGM INC.; 17111 WATERVIEW PKWY LLC; 4455 GENESEE PROPERTIES, LLC; 4455 GENESEE STREET, LLC; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC LLC; AIRBORNE ACQUISITION, INC.; AIRBORNE GLOBAL, INC.; AIRBORNE HOLDINGS, INC.; AIRBORNE SYSTEMS NA INC.; AIRBORNE SYSTEMS NORTH AMERICA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF CA INC.; AMSAFE GLOBAL HOLDINGS, INC.; AMSAFE, INC.; ANGUS ELECTRONICS CO.; APICAL INDUSTRIES, INC.; ARKWIN INDUSTRIES, INC.; ARMTEC COUNTERMEASURES CO.; ARMTEC COUNTERMEASURES TNO CO.; ARMTEC DEFENSE PRODUCTS CO.; ASHFORD PROPERTIES, LLC; AUXITROL WESTON USA, INC.; AVIATION TECHNOLOGIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECHTYEE, INC.; BETA TRANSFORMER TECHNOLOGY LLC; BREEZE-EASTERN LLC; BRIDPORT HOLDINGS, INC.; BRIDPORT-AIR CARRIER, INC.; BRUCE AEROSPACE INC.; CALSPAN, LLC; CALSPAN AIR FACILITIES, LLC; CALSPAN AIR SERVICES, LLC; CALSPAN ASE PORTUGAL, INC.; CALSPAN HOLDINGS, LLC; CALSPAN JETS LLC; CALSPAN TECHNOLOGY ACQUISITION LLC; CDA INTERCORP LLC; CEF INDUSTRIES, LLC; CHAMPION AEROSPACE LLC; CHELTON AVIONICS HOLDINGS, INC.; CHELTON AVIONICS, INC.; CHELTON DEFENSE PRODUCTS, INC.; CMC ELECTRONICS AURORA LLC; CPI EDB INTERMEDIATE HOLDINGS, INC.; CPI ELECTON DEVICE BUSINESS, INC.; CTHC LLC; DART AEROSPACE USA, INC.; DART BUYER, INC.; DART HELICOPTER SERVICES, INC.; DART INTERMEDIATE, INC.; DART TOPCO, INC.; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC; ESTERLINE EUROPE COMPANY LLC; ESTERLINE INTERNATIONAL COMPANY; ESTERLINE TECHNOLOGIES CORPORATION; ESTERLINE TECHNOLOGIES SGIP LLC; FPT INDUSTRIES LLC; GENESEE HOLDINGS, LLC; GENESEE HOLDINGS II, LLC; GENESSE HOLDINGS III, LLC; HARCOSEMCO LLC; HARTWELL CORPORATION; HELI TECH, INC.; HYTEK FINISHES CO.; ICEMAN HOLDCO, INC.; ILC HOLDINGS, INC.; JANCO CORPORATION; JOHNSON LIVERPOOL LLC; KING NUTRONICS, LLC; KIRKHILL INC.; KORRY ELECTRONICS CO.; LEACH HOLDING CORPORATION; LEACH INTERNATIONAL CORPORATION; LEACH MEXICO HOLDING LLC; LEACH TECHNOLOGY GROUP, INC.; MARATHONNORCO AEROSPACE, INC.; MASON ELECTRIC CO.; MCKECHNIE AEROSPACE DE, INC.; MCKECHNIE AEROSPACE HOLDINGS, INC.; MCKECHNIE AEROSPACE US LLC; MEDTHERM LABS, LLC; MICROWAVE POWER PRODUCTS, INC.; NAT SEATTLE INC.; NMC GROUP, INC.; NORDISK AVIATION PRODUCTS LLC; NORTH HILLS SIGNAL PROCESSING CORP.; NORTH HILLS SIGNAL PROCESSING OVERSEAS LLC; NORWICH AERO PRODUCTS, INC.; OFFSHORE HELICOPTER SUPPORT SERVICES, INC.; PALOMAR PRODUCTS, INC.; PARAVION TECHNOLOGY, INC.; PEXCO AEROSPACE, INC.; PNEUDRAULICS, INC.; POWER DEVICE CORPORATION; RAPTOR LABS HOLDCO, LLC; RAPTOR LABS INTERMEDIATE, LLC; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SENSOR CONCEPTS, LLC; SERVOTRONICS, INC.; SHIELD RESTRAINT SYSTEMS, INC.; SIMPLEX MANUFACTURING CO.; SKANDIA, INC.; SKURKA AEROSPACE INC.; SPACE ELECTRONICS LLC; SYMETRICS INDUSTRIES, LLC; TA AEROSPACE CO.; TACTIAR FLUID CONTROLS, INC.; TDG ESL HOLDINGS INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR US LLC; TESTVONICS, INC.; TEXAS ROTRONICS, INC.; TRANSICOIL LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; BRIDPORT ERIE AVIATION, INC.; TRANSDIGM GROUP INCORPORATED; TRANSDIGM UK HOLDINGS LIMITED
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE
Reel/Frame 072473/0485 →
SECURITY INTEREST Recorded Sep 20, 2024
From: TRANSDIGM GROUP INCORPORATED; TRANSDIGM INC.; TRANSDIGM UK HOLDINGS LIMITED; 17111 WATERVIEW PKWY LLC; 4455 GENESEE STREET, LLC; 4455 GENESEE PROPERTIES, LLC; 703 CITY CENTER BOULEVARD, LLC; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC LLC; AIRBORNE ACQUISITION, INC.; AIRBORNE GLOBAL, INC.; AIRBORNE HOLDINGS, INC.; AIRBORNE SYSTEMS NA INC.; AIRBORNE SYSTEMS NORTH AMERICA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF CA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; AMSAFE, INC.; AMSAFE GLOBAL HOLDINGS, INC.; ANGUS ELECTRONICS CO.; APICAL INDUSTRIES, INC.; ARKWIN INDUSTRIES, INC.; ARMTEC COUNTERMEASURES CO.; ARMTEC COUNTERMEASURES TNO CO.; ARMTEC DEFENSE PRODUCTS CO.; ASHFORD PROPERTIES, LLC; AUXITROL WESTON USA, INC.; AVIATION TECHNOLOGIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECHTYEE, INC.; BETA TRANSFORMER TECHNOLOGY LLC; BREEZE-EASTERN LLC; BRIDPORT HOLDINGS, INC.; BRIDPORT-AIR CARRIER, INC; BRIDPORT ERIE AVIATION, INC.; BRUCE AEROSPACE, INC.; CALSPAN AERO SYSTEMS ENGINEERING LLC; CALSPAN AIR FACILITIES, LLC; CALSPAN AIR SERVICES, LLC; CALSPAN ASE PORTUGAL, INC.; CALSPAN HOLDINGS, LLC; CALSPAN, LLC; CALSPAN JETS LLC; CALSPAN SYSTEMS LLC; CALSPAN TECHNOLOGY ACQUISITION LLC; CDA INTERCORP LLC; CEF INDUSTRIES, LLC; CHAMPION AEROSPACE LLC; CHELTON AVIONICS, INC.; CHELTON AVIONICS HOLDINGS, INC.; CHELTON DEFENSE PRODUCTS, INC.; CMC ELECTRONICS AURORA LLC; CPI INTERMEDIATE HOLDINGS, INC.; CPI INTERNATIONAL, INC.; CPI SUBSIDIARY HOLDINGS LLC; CTHC LLC; DART AEROSPACE USA, INC.; DART BUYER, INC.; DART HELICOPTER SERVICES, INC.; DART INTERMEDIATE, INC.; DART TOPCO, INC.; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC; ESTERLINE EUROPE COMPANY LLC; ESTERLINE INTERNATIONAL COMPANY; ESTERLINE TECHNOLOGIES CORPORATION; ESTERLINE TECHNOLOGIES SGIP LLC; FPT INDUSTRIES LLC; GENESEE HOLDINGS, LLC; GENESEE HOLDINGS II, LLC; GENESEE HOLDINGS III, LLC; HARCOSEMCO LLC; HARTWELL CORPORATION; HELI TECH, INC.; HYTEK FINISHES CO.; ICEMAN HOLDCO, INC.; ICEMAN INTERMEDIATE MIDCO, LLC; ILC HOLDINGS, INC.; JANCO CORPORATION; JOHNSON LIVERPOOL LLC; KIRKHILL INC.; KING NUTRONICS, LLC; KORRY ELECTRONICS CO.; LEACH HOLDING CORPORATION; LEACH INTERNATIONAL CORPORATION; LEACH MEXICO HOLDING LLC; LEACH TECHNOLOGY GROUP, INC.; MARATHONNORCO AEROSPACE, INC.; MASON ELECTRIC CO.; MCKECHNIE AEROSPACE DE, INC.; MCKECHNIE AEROSPACE HOLDINGS, INC.; MCKECHNIE AEROSPACE US LLC; MEDTHERM LABS, LLC; MICROWAVE POWER PRODUCTS, INC.; NAT SEATTLE INC.; NMC GROUP INC.; NORDISK AVIATION PRODUCTS LLC; NORTH HILLS SIGNAL PROCESSING CORP.; NORTH HILLS SIGNAL PROCESSING OVERSEAS LLC; NORWICH AERO PRODUCTS, INC.; OFFSHORE HELICOPTER SUPPORT SERVICES, INC.; PALOMAR PRODUCTS, INC.; PARAVION TECHNOLOGY, INC.; PEXCO AEROSPACE, INC.; POWER DEVICE CORPORATION; PNEUDRAULICS, INC.; RAPTOR LABS HOLDCO, LLC; RAPTOR LABS INTERMEDIATE, LLC; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SENSOR CONCEPTS, LLC; SHIELD RESTRAINT SYSTEMS, INC.; SIMPLEX MANUFACTURING CO.; SKANDIA, INC.; SKURKA AEROSPACE INC.; SPACE ELECTRONICS LLC; SYMETRICS INDUSTRIES, LLC; TA AEROSPACE CO.; TACTAIR FLUID CONTROLS INC.; TDG ESL HOLDINGS INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR US LLC; TESTVONICS, INC.; TEXAS ROTRONICS, INC.; TRANSICOIL LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 068951/0001 →
RELEASE OF PATENT SECURITY AGREEMENT RECORDED FEBRUARY 19, 2019 AT REEL/FRAME 048365/0499 Recorded Jun 6, 2024
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE
To: TRANSDIGM INC.; TRANSDIGM GROUP INCORPORATED; AEROSONIC LLC; MOUNTAINTOP TECHNOLOGIES, INC.; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; SHIELD RESTRAINT SYSTEMS, INC.; AMSAFE, INC.; ARKWIN INDUSTRIES, INC.; AVIONIC INSTRUMENTS, INC.; AEROSONIC CORPORATION; AVTECHTYEE, INC.; BREEZE-EASTERN LLC; BRUCE AEROSPACE INC.; CEF INDUSTRIES, LLC; CHAMPION AEROSPACE LLC; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; PURE TECHNOLOGIES LTD.; HARCO LABORATORIES, INC.; HARCO LLC; HARCO TECHNOLOGIES CORPORATION; CORRPRO COMPANIES, INC.; HARCO CORPORATION; HARTWELL CORPORATION; MARATHONNORCO AEROSPACE, INC.; PNEUDRAULICS, INC.; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; TACTAIR FLUID CONTROLS, INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR INTERNATIONAL GMBH; TELAIR INTERNATIONAL AB; NORDISK AVIATION PRODUCTS AS; TURNTIME TECHNOLOGIES AB; AEROCONTROLEX GROUP, INC.; TRANSICOIL INC.; SOUTHCO, INC.; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; ARMTEC COUNTERMEASURES CO.; ADVANCED INPUT DEVICES, INC.; ARMTEC DEFENSE PRODUCTS COMPANY; JOSLYN SUNBANK COMPANY LLC; LEACH INTERNATIONAL CORPORATION; SOURIAU USA, INC.; NMC GROUP, INC.; TA AEROSPACE CO.; MASON ELECTRIC CO.; KORRY ELECTRONICS CO.; PALOMAR PRODUCTS, INC.; ROLLS-ROYCE PLC; MEMTRON TECHNOLOGIES CO.; CHELTON, INC. (N/K/A CHELTON AVIONICS, INC.); SIMPLEX MANUFACTURING CO.; APICAL INDUSTRIES, INC.; AERO-INSTRUMENTS CO., LLC; AIRBORNE SYSTEMS NA, INC.; HARCOSEMCO LLC; HARCO, LLC (N/K/A HARCOSEMCO LLC); PEXCO AEROSPACE, INC.; TELAIR US LLC; CALSPAN AERO SYSTEMS ENGINEERING, INC.; CALSPAN SYSTEMS, LLC; ADAMS RITE AEROSPACE, INC.; ACME AEROSPACE, INC.; SCHNELLER, INC.; CEF INDUSTRIES, INC.
Reel/Frame 067640/0147 →
SECURITY INTEREST Recorded Mar 1, 2024
From: TRANSDIGM INC.; TRANSDIGM GROUP INCORPORATED; TRANSDIGM UK HOLDINGS LIMITED; 17111 WATERVIEW PKWY LLC; 4455 GENESEE STREET, LLC; 4455 GENESEE PROPERTIES, LLC; 703 CITY CENTER BOULEVARD, LLC; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC LLC; AIRBORNE ACQUISITION, INC.; AIRBORNE GLOBAL, INC.; AIRBORNE HOLDINGS, INC.; AIRBORNE SYSTEMS NA INC.; AIRBORNE SYSTEMS NORTH AMERICA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF CA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; AMSAFE, INC.; AMSAFE GLOBAL HOLDINGS, INC.; ANGUS ELECTRONICS CO.; APICAL INDUSTRIES, INC.; ARKWIN INDUSTRIES, INC.; ARMTEC COUNTERMEASURES CO.; ARMTEC COUNTERMEASURES TNO CO.; ARMTEC DEFENSE PRODUCTS CO.; ASHFORD PROPERTIES, LLC; AUXITROL WESTON USA, INC.; AVIATION TECHNOLOGIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECHTYEE, INC.; BETA TRANSFORMER TECHNOLOGY LLC; BREEZE-EASTERN LLC; BRIDPORT HOLDINGS, INC.; BRIDPORT-AIR CARRIER, INC; BRIDPORT ERIE AVIATION, INC.; BRUCE AEROSPACE, INC.; CALSPAN AERO SYSTEMS ENGINEERING LLC; CALSPAN AIR FACILITIES, LLC,; CALSPAN AIR SERVICES, LLC; CALSPAN ASE PORTUGAL, INC.; CALSPAN HOLDINGS, LLC; CALSPAN, LLC; CALSPAN SYSTEMS LLC; CALSPAN TECHNOLOGY ACQUISITION LLC; CDA INTERCORP LLC; CEF INDUSTRIES, LLC; CHAMPION AEROSPACE LLC; CHELTON AVIONICS, INC.; CHELTON AVIONICS HOLDINGS, INC.; CHELTON DEFENSE PRODUCTS, INC.; CMC ELECTRONICS AURORA LLC; CTHC LLC; DART AEROSPACE USA, INC.; DART BUYER, INC.; DART HELICOPTER SERVICES, INC.; DART INTERMEDIATE, INC.; DART TOPCO, INC.; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC; ESTERLINE EUROPE COMPANY LLC; ESTERLINE INTERNATIONAL COMPANY; ESTERLINE TECHNOLOGIES CORPORATION; ESTERLINE TECHNOLOGIES SGIP LLC; GENESEE HOLDINGS, LLC; GENESEE HOLDINGS II, LLC; GENESEE HOLDINGS III, LLC; HARCOSEMCO LLC; HARTWELL CORPORATION; HELI TECH, INC.; HYTEK FINISHES CO.; ILC HOLDINGS, INC.; JANCO CORPORATION; JOHNSON LIVERPOOL LLC; KIRKHILL INC.; KORRY ELECTRONICS CO.; LEACH HOLDING CORPORATION; LEACH INTERNATIONAL CORPORATION; LEACH MEXICO HOLDING LLC; LEACH TECHNOLOGY GROUP, INC.; MARATHONNORCO AEROSPACE, INC.; MASON ELECTRIC CO.; MCKECHNIE AEROSPACE DE, INC.; MCKECHNIE AEROSPACE HOLDINGS, INC.; MCKECHNIE AEROSPACE US LLC; NAT SEATTLE INC.; NMC GROUP INC.; NORDISK AVIATION PRODUCTS LLC; NORTH HILLS SIGNAL PROCESSING CORP.; NORTH HILLS SIGNAL PROCESSING OVERSEAS LLC; NORWICH AERO PRODUCTS, INC.; OFFSHORE HELICOPTER SUPPORT SERVICES, INC.; PALOMAR PRODUCTS, INC.; PARAVION TECHNOLOGY, INC.; PEXCO AEROSPACE, INC.; POWER DEVICE CORPORATION; PNEUDRAULICS, INC.; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SHIELD RESTRAINT SYSTEMS, INC.; SIMPLEX MANUFACTURING CO.; SKANDIA, INC.; SKURKA AEROSPACE INC.; SYMETRICS INDUSTRIES, LLC; TA AEROSPACE CO.; TACTAIR FLUID CONTROLS INC.; TDG ESL HOLDINGS INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR US LLC; TEXAS ROTRONICS, INC.; TRANSICOIL LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE AND NOTES COLLATERAL AGENT
Reel/Frame 066763/0138 →
SECURITY INTEREST Recorded Mar 1, 2024
From: TRANSDIGM INC.; TRANSDIGM GROUP INCORPORATED; TRANSDIGM UK HOLDINGS LIMITED; 17111 WATERVIEW PKWY LLC; 4455 GENESEE STREET, LLC; 4455 GENESEE PROPERTIES, LLC; 703 CITY CENTER BOULEVARD, LLC; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC LLC; AIRBORNE ACQUISITION, INC.; AIRBORNE GLOBAL, INC.; AIRBORNE HOLDINGS, INC.; AIRBORNE SYSTEMS NA INC.; AIRBORNE SYSTEMS NORTH AMERICA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF CA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; AMSAFE, INC.; AMSAFE GLOBAL HOLDINGS, INC.; ANGUS ELECTRONICS CO.; APICAL INDUSTRIES, INC.; ARKWIN INDUSTRIES, INC.; ARMTEC COUNTERMEASURES CO.; ARMTEC COUNTERMEASURES TNO CO.; ARMTEC DEFENSE PRODUCTS CO.; ASHFORD PROPERTIES, LLC; AUXITROL WESTON USA, INC.; AVIATION TECHNOLOGIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECHTYEE, INC.; BETA TRANSFORMER TECHNOLOGY LLC; BREEZE-EASTERN LLC; BRIDPORT HOLDINGS, INC.; BRIDPORT-AIR CARRIER, INC; BRIDPORT ERIE AVIATION, INC.; BRUCE AEROSPACE, INC.; CALSPAN AERO SYSTEMS ENGINEERING LLC; CALSPAN AIR FACILITIES, LLC; CALSPAN AIR SERVICES, LLC; CALSPAN ASE PORTUGAL, INC.; CALSPAN HOLDINGS, LLC; CALSPAN, LLC; CALSPAN SYSTEMS LLC; CALSPAN TECHNOLOGY ACQUISITION LLC; CDA INTERCORP LLC; CEF INDUSTRIES, LLC; CHAMPION AEROSPACE LLC; CHELTON AVIONICS, INC.; CHELTON AVIONICS HOLDINGS, INC.; CHELTON DEFENSE PRODUCTS, INC.; CMC ELECTRONICS AURORA LLC; CTHC LLC; DART AEROSPACE USA, INC.; DART BUYER, INC.; DART HELICOPTER SERVICES, INC.; DART INTERMEDIATE, INC.; DART TOPCO, INC.; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC; ESTERLINE EUROPE COMPANY LLC; ESTERLINE INTERNATIONAL COMPANY; ESTERLINE TECHNOLOGIES CORPORATION; ESTERLINE TECHNOLOGIES SGIP LLC; GENESEE HOLDINGS, LLC; GENESEE HOLDINGS II, LLC; GENESEE HOLDINGS III, LLC; HARCOSEMCO LLC; HARTWELL CORPORATION; HELI TECH, INC.; HYTEK FINISHES CO.; ILC HOLDINGS, INC.; JANCO CORPORATION; JOHNSON LIVERPOOL LLC; KIRKHILL INC.; KORRY ELECTRONICS CO.; LEACH HOLDING CORPORATION; LEACH INTERNATIONAL CORPORATION; LEACH MEXICO HOLDING LLC; LEACH TECHNOLOGY GROUP, INC.; MARATHONNORCO AEROSPACE, INC.; MASON ELECTRIC CO.; MCKECHNIE AEROSPACE DE, INC.; MCKECHNIE AEROSPACE HOLDINGS, INC.; MCKECHNIE AEROSPACE US LLC; NAT SEATTLE INC.; NMC GROUP INC.; NORDISK AVIATION PRODUCTS LLC; NORTH HILLS SIGNAL PROCESSING CORP.; NORTH HILLS SIGNAL PROCESSING OVERSEAS LLC; NORWICH AERO PRODUCTS, INC.; OFFSHORE HELICOPTER SUPPORT SERVICES, INC.; PALOMAR PRODUCTS, INC.; PARAVION TECHNOLOGY, INC.; PEXCO AEROSPACE, INC.; POWER DEVICE CORPORATION; PNEUDRAULICS, INC.; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SHIELD RESTRAINT SYSTEMS, INC.; SIMPLEX MANUFACTURING CO.; SKANDIA, INC.; SKURKA AEROSPACE INC.; SYMETRICS INDUSTRIES, LLC; TA AEROSPACE CO.; TACTAIR FLUID CONTROLS INC.; TDG ESL HOLDINGS INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR US LLC; TEXAS ROTRONICS, INC.; TRANSICOIL LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE AND NOTES COLLATERAL AGENT
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SECURITY INTEREST Recorded Nov 29, 2023
From: TRANSDIGM INC.; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC LLC; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; AMSAFE, INC.; APICAL INDUSTRIES, INC.; AVTECHTYEE, INC.; BREEZE-EASTERN LLC; BRUCE AEROSPACE, INC.; CALSPAN AERO SYSTEMS ENGINEERING, INC.; CALSPAN SYSTEMS, LLC; CEF INDUSTRIES, LLC; CHAMPION AEROSPACE LLC; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; HARCO LABORATORIES, INCORPORATED (N/K/A HARCOSEMCO LLC); HARCO, LLC (N/K/A HARCOSEMCO LLC); HARTWELL CORPORATION; MARATHONNORCO AEROSPACE, INC.; PALOMAR PRODUCTS, INC.; PEXCO AEROSPACE, INC.; SCHNELLER LLC; SHIELD RESTRAINT SYSTEMS, INC.; SIMPLEX MANUFACTURING CO.; TACTAIR FLUID CONTROLS, INC.; TELAIR INTERNATIONAL LLC (N/K/A NORDISK AVIATION PRODUCTS LLC); TELAIR US LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; ARMTEC DEFENSE PRODUCTS CO.; NMC GROUP, INC.; LEACH INTERNATIONAL CORPORATION; TA AEROSPACE CO.; KORRY ELECTRONICS CO.; MASON ELECTRIC CO.; AIRBORNE SYSTEMS NA INC.; HARCOSEMCO LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE AND NOTES COLLATERAL AGENT
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 064961 FRAME: 0671. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF PATENT AND TRADEMARK SECURITY INTEREST. Recorded Oct 5, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS PREDECESSOR COLLATERAL AGENT
To: GOLDMAN SACHS BANK USA, AS SUCCESSOR COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS PREDECESSOR COLLATERAL AGENT
To: GOLDMAN SACHS BANK USA, AS SUCCESSOR COLLATERAL AGENT
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SECURITY INTEREST Recorded Aug 22, 2023
From: TRANSDIGM INC.; HARTWELL CORPORATION; MARATHONNORCO AEROSPACE, INC.; PALOMAR PRODUCTS, INC.; PEXCO AEROSPACE, INC.; SCHNELLER LLC; SHIELD RESTRAINT SYSTEMS, INC.; SIMPLEX MANUFACTURING CO.; TACTAIR FLUID CONTROLS, INC.; TELAIR INTERNATIONAL LLC (N/K/A NORDISK AVIATION PRODUCTS LLC); TELAIR US LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; ARMTEC DEFENSE PRODUCTS CO.; NMC GROUP, INC.; LEACH INTERNATIONAL CORPORATION; TA AEROSPACE CO.; KORRY ELECTRONICS CO.; MASON ELECTRIC, CO.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE AND NOTES COLLATERAL AGENT
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RELEASE OF SECURITY INTEREST Recorded Apr 19, 2023
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE
To: TA AEROSPACE CO.; TRANSDIGM, INC.; TRANSDIGM GROUP INCORPORATED; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC CORPORATION; AIRBORNE HOLDINGS, INC.; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; AMSAFE COMMERCIAL PRODUCTS INC.; AMSAFE, INC.; ARKWIN INDUSTRIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECH TYEE, INC.; BEAM'S INDUSTRIES; BREEZE EASTERN CORPORATION; BRUCE AEROSPACE, INC.; CEF INDUSTRIES, INC.; CHAMPION AEROSPACE LLC; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC; HARCO LABORATORIES, INC.; HARCO LLC; HARTWELL CORPORATION; MARATHONNORCO AEROSPACE, INC.; PEXCO AEROSPACE, INC.; PNEUDRAULICS, INC.; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SHIELD RESTRAINT SYSTEMS, INC.; TACTAIR FLUID CONTROLS INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR INTERNATIONAL LLC; TRANSCOIL LLC; WESTERN SKY INDUSTRIES, LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; ARMTEC COUNTERMEASURES CO.; ARMTEC DEFENSE PRODUCTS COMPANY; LEACH INTERNATIONAL CORPORATION; NMC GROUP INC.; MASON ELECTRIC CO.; KORRY ELECTRONICS CO.; PALOMAR PRODUCTS, INC.; CHELTON, INC. (N/K/A CHELTON AVIONICS, INC.); SIMPLEX MANUFACTURING CO.; APICAL INDUSTRIES, INC.
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SECURITY INTEREST Recorded Feb 27, 2023
From: TRANSDIGM INC.; TRANSDIGM GROUP INCORPORATED; 17111 WATERVIEW PKWY LLC; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC LLC; AIRBORNE ACQUISITION, INC.; AIRBORNE GLOBAL, INC.; AIRBORNE HOLDINGS, INC.; AIRBORNE SYSTEMS NA INC.; AIRBORNE SYSTEMS NORTH AMERICA INC.; AIRBORNE SYSTEMS NORTH AMERICA OF CA INC.; AMSAFE GLOBAL HOLDINGS, INC.; AMSAFE, INC.; ANGUS ELECTRONICS CO.; APICAL INDUSTRIES, INC.; ARKWIN INDUSTRIES, INC.; ARMTEC COUNTERMEASURES CO.; ARMTEC COUNTERMEASURES TNO CO.; ARMTEC DEFENSE PRODUCTS CO.; AUXITROL WESTON USA, INC.; AVIATION TECHNOLOGIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECHTYEE, INC.; BETA TRANSFORMER TECHNOLOGY LLC; BREEZE-EASTERN LLC; BRIDPORT HOLDINGS, INC.; BRIDPORT-AIR CARRIER, INC.; BRUCE AEROSPACE INC.; CDA INTERCORP LLC; CEF INDUSTRIES, LLC; CENTURY HELICOPTERS, INC.; CHAMPION AEROSPACE LLC; CHELTON AVIONICS HOLDINGS, INC.; CHELTON AVIONICS, INC.; CHELTON DEFENSE PRODUCTS, INC.; CMC ELECTRONICS AURORA LLC; DART AEROSPACE USA, INC.; DART BUYER, INC.; DART HELICOPTER SERVICES, INC.; DART INTERMEDIATE, INC.; DART TOPCO, INC.; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC; ESTERLINE EUROPE COMPANY LLC; ESTERLINE INTERNATIONAL COMPANY; ESTERLINE TECHNOLOGIES CORPORATION; ESTERLINE TECHNOLOGIES SGIP LLC; HARCOSEMCO LLC; HARTWELL CORPORATION; HELI TECH, INC.; HYTEK FINISHES CO.; ILC HOLDINGS, INC.; JANCO CORPORATION; JOHNSON LIVERPOOL LLC; KIRKHILL INC.; KORRY ELECTRONICS CO.; LEACH HOLDING CORPORATION; LEACH INTERNATIONAL CORPORATION; LEACH MEXICO HOLDING LLC; LEACH TECHNOLOGY GROUP, INC.; MARATHONNORCO AEROSPACE, INC.; MASON ELECTRIC CO.; MCKECHNIE AEROSPACE DE, INC.; MCKECHNIE AEROSPACE HOLDINGS, INC.; MCKECHNIE AEROSPACE US LLC; NAT SEATTLE INC.; NMC GROUP, INC.; NORDISK AVIATION PRODUCTS LLC; NORTH HILLS SIGNAL PROCESSING CORP.; NORTH HILLS SIGNAL PROCESSING OVERSEAS LLC; NORWICH AERO PRODUCTS, INC.; OFFSHORE HELICOPTER SUPPORT SERVICES, INC.; PALOMAR PRODUCTS, INC.; PARAVION TECHNOLOGY, INC.; PEXCO AEROSPACE, INC.; PNEUDRAULICS, INC.; POWER DEVICE CORPORATION; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SHIELD RESTRAINT SYSTEMS, INC.; SIMPLEX MANUFACTURING CO.; SKANDIA, INC.; SKURKA AEROSPACE INC.; SYMETRICS INDUSTRIES, LLC; TA AEROSPACE CO.; TACTAIR FLUID CONTROLS, INC.; TDG ESL HOLDINGS INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR US LLC; TEXAS ROTRONICS, INC.; TRANSICOIL LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; BRIDPORT ERIE AVIATION, INC.; TRANSDIGM UK HOLDINGS PLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE
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PATENT SECURITY AGREEMENT Recorded Apr 9, 2020
From: AIRBORNE SYSTEMS NORTH AMERICA OF NJ INC.; ACME AEROSPACE, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC CORPORATION/LLC; AIRBORNE HOLDINGS, INC.; AMSAFE COMMERCIAL PRODUCTS INC.; AMSAFE, INC.; ARKWIN INDUSTRIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECHTYEE, INC.; BEAM’S INDUSTRIES; BREEZE-EASTERN CORPORATION; BRUCE AEROSPACE, INC.; CEF INDUSTRIES, INC.; CHAMPION AEROSPACE LLC; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC; HARCO LABORATORIES, INCORPORATED; HARCO LLC; HARTWELL CORPORATION; MARATHONNORCO AEROSPACE, INC.; PEXCO AEROSPACE, INC.; PNEUDRAULICS, INC.; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SHIELD RESTRAINT SYSTEMS, INC.; TACTAIR FLUID CONTROLS, INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR INTERNATIONAL LLC; TRANSDIGM, INC.; TRANSCOIL LLC; WESTERN SKY INDUSTRIES, LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; ARMTEC COUNTERMEASURES CO.; ARMTEC DEFENSE PRODUCTS COMPANY; ARMTEC DEFENSE PRODUCTS CO.; LEACH INTERNATIONAL CORPORATION; NMC GROUP, INC.; TA AEROSPACE CO.; MASON ELECTRIC COMPANY; KORRY ELECTRONICS CO.; PALOMAR PRODUCTS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS TRUSTEE AND NOTES COLLATERAL AGENT
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SECURITY INTEREST Recorded Feb 19, 2019
From: TRANSDIGM, INC.; ADAMS RITE AEROSPACE, INC.; AEROCONTROLEX GROUP, INC.; AEROSONIC LLC (F/K/A AEROSONIC CORPORATION); AIRBORNE HOLDINGS, INC.; AIRBORNE SYSTEMS OF NORTH AMERICA OF NJ INC.; AMSAFE, INC.; ARKWIN INDUSTRIES, INC.; AVIONIC INSTRUMENTS LLC; AVIONICS SPECIALTIES, INC.; AVTECHTYEE, INC.; BREEZE-EASTERN LLC (F/K/A BREEZE-EASTERN CORPORATION); BRUCE AEROSPACE, INC.; CEF INDUSTRIES, LLC (F/K/A CEF INDUSTRIES, INC.); CHAMPION AEROSPACE LLC; DATA DEVICE CORPORATION; DUKES AEROSPACE, INC.; ELECTROMECH TECHNOLOGIES LLC (F/K/A WESTERN SKY, INDUSTRIES, LLC); HARCOSEMCO LLC (F/K/A HARCO LABORATORIES, INCORPORATED) (F/K/A HARCO LLC); HARTWELL CORPORATION; MARATHONNORCO AEROSPACE, INC.; PEXCO AEROSPACE, INC.; PNEUDRAULICS, INC.; SCHNELLER LLC; SEMCO INSTRUMENTS, INC.; SHIELD RESTRAINT SYSTEMS, INC. (F/K/A AMSAFE COMMERCIAL PRODUCTS INC.) (F/K/A BEAM'S INDUSTRIES, INC.); TACTAIR FLUID CONTROLS, INC.; TEAC AEROSPACE TECHNOLOGIES, INC.; TELAIR INTERNATIONAL LLC; TRANSICOIL LLC; WHIPPANY ACTUATION SYSTEMS, LLC; YOUNG & FRANKLIN INC.; ACME AEROSPACE, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.,
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SECURITY AGREEMENT Recorded Dec 12, 2011
From: HARCO LABORATORIES, INCORPORATED
To: CREDIT SUISSE AG, AS ADMINISTRATIVE AGENT
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