Combinations of resin compositions and methods of use thereof
View Patent ↗A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
1. An underfill composition comprising:
a first curable transparent resin composition comprising an aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof; and
a second curable fluxing composition comprising at least one epoxy resin,
wherein the second curable fluxing composition further comprises at least one epoxy hardener, and
wherein the at least one epoxy hardener comprises a difunctional siloxane anhydride of the formula:
where X is from 0 to 50 inclusive, and each R′ and R″ are independently selected from the group consisting of C 1-22 alkyl, C 1-22 alkoxy, C 2-22 alkenyl, C 6-14 aryl, C 6-22 alkyl-substituted aryl, and C 6-22 arylalkyl.
2. The underfill composition of claim 1 , wherein the at least one difunctional siloxane anhydride comprises a mixture of oligomers of formula (3) and wherein X in formula (3) is from 0 to 10 inclusive.
3. The underfill composition of claim 1 , further comprising at least one anhydride epoxy hardener selected from the group consisting of methylhexahydrophthalic anhydride (MHHPA), methyltetrahydrophthalic anhydride, 1,2-cyclohexanedicarboxylic anhydride, bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, phthalic anhydride, pyromellitic dianhydride, hexahydrophthalic anhydride, dodecenylsuccinic anhydride, dichloromaleic anhydride, chlorendic anhydride, tetrachlorophthalic anhydride, and mixtures thereof.
4. The underfill composition of claim 1 , further comprising a liquid epoxy hardener selected from the group consisting of methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride.
5. An underfill composition comprising
a first curable transparent resin composition comprising at least one aromatic epoxy resin in combination with at least one solvent, a functionalized colloidal silica dispersion having a particle size of about 50 nm to about 100 nm, and at least one additional component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, and combinations and mixtures thereof; and
a second curable fluxing composition comprising at least one epoxy resin in combination with at least one epoxy hardener,
wherein the at least one epoxy hardener comprises a difunctional siloxane anhydride of the formula:
where X is from 0 to 50 inclusive, and each R′ and R″ are independently selected from the group consisting of C 1-22 alkyl, C 1-22 alkoxy, C 2-22 alkenyl, C 6-14 aryl, C 6-22 alkyl-substituted aryl, and C 6-22 arylalkyl.
6. The underfill composition of claim 5 , wherein the at least one difunctional siloxane anhydride comprises a mixture of oligomers of formula (3) and wherein X in formula (3) is from 0 to 10 inclusive.
7. The underfill composition of claim 5 , further comprising at least one anhydride epoxy hardener selected from the group consisting of methylhexahydrophthalic anhydride (MHHPA), methyltetrahydrophthalic anhydride, 1,2-cyclohexanedicarboxylic anhydride, bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, phthalic anhydride, pyromellitic dianhydride, hexahydrophthalic anhydride, dodecenylsuccinic anhydride, dichloromaleic anhydride, chlorendic anhydride, tetrachlorophthalic anhydride, and mixtures thereof.
8. The underfill composition of claim 5 , further comprising a liquid epoxy hardener selected from the group consisting of methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride.
9. An underfill composition comprising
a first curable transparent epoxy resin comprising a cresol novolac epoxy resin in combination with at least one solvent, a functionalized colloidal silica dispersion having a particle size of about 50 nm to about 100 nm, and at least one additional component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, and combinations and mixtures thereof; and
a second curable fluxing composition comprising at least one epoxy resin in combination with at least one difunctional siloxane anhydride epoxy hardener of the formula:
where X is from 0 to 50 inclusive, and each R′ and R″ are independently selected from the group consisting of C 1-22 alkyl, C 1-22 alkoxy, C 2-22 alkenyl, C 6-14 aryl, C 6-22 alkyl-substituted aryl, and C 6-22 arylalkyl.
10. A solid state device comprising:
a chip;
a substrate; and
an underfill composition between the chip and the substrate comprising a first curable transparent resin composition comprising at least one aromatic epoxy resin in combination with at least one solvent, a functionalized colloidal silica dispersion having a particle size of about 50 nm to about 100 nm, and at least one additional component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof; and
a second curable fluxing composition comprising at least one epoxy resin in combination with at least one epoxy hardener,
wherein the at least one epoxy hardener comprises a difunctional siloxane anhydride epoxy hardener of the formula:
where X is from 0 to 50 inclusive, and each R′ and R″ are independently selected from the group consisting of C 1-22 alkyl, C 1-22 alkoxy, C 2-22 alkenyl, C 6-14 aryl, C 6-22 alkyl-substituted aryl, and C 6-22 arylalkyl.
11. The solid state device of claim 10 , further comprising at least one anhydride epoxy hardener selected from the group consisting of methylhexahydrophthalic anhydride (MHHPA), methyltetrahydrophthalic anhydride, 1,2-cyclohexanedicarboxylic anhydride, bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride, phthalic anhydride, pyromellitic dianhydride, hexahydrophthalic anhydride, dodecenylsuccinic anhydride, dichloromaleic anhydride, chlorendic anhydride, tetrachlorophthalic anhydride, and mixtures thereof.
12. The solid state device of claim 10 , further comprising a liquid epoxy hardener selected from the group consisting of methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride.
13. A method for producing a solid state device comprising:
applying to a chip a first curable transparent resin composition comprising an aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, to produce a coated chip;
applying a second curable fluxing composition comprising at least one epoxy resin in combination with at least one epoxy hardener to a substrate;
placing the coated chip on a portion of the substrate to which the fluxing composition has been applied; and
curing the first curable transparent resin composition and second curable fluxing composition to form an underfill composition.
14. The method of claim 13 wherein the step of applying the first curable transparent resin composition further comprises applying a first curable transparent resin having colloidal silica possessing a particle size of between about 20 nm and about 100 nm.
15. The method of claim 13 wherein the step of applying the first curable transparent resin composition further comprises removing the solvent to form a hard, transparent B-stage resin film on the chip.
16. The method of claim 13 wherein the step of applying the second curable fluxing composition to the substrate further comprises applying an epoxy resin in combination with at least one epoxy hardener comprising a difunctional siloxane anhydride of the formula:
where X is from 0 to 50 inclusive, and each R′ and R″ are independently selected from the group consisting of C 1-22 alkyl, C 1-22 alkoxy, C 2-22 alkenyl, C 6-14 aryl, C 6-22 alkyl-substituted aryl, and C 6-22 arylalkyl.
17. The method of claim 13 wherein the step of applying the second curable fluxing composition to the substrate comprises applying a second curable fluxing composition which further comprises a colloidal silica dispersion functionalized with at least one organoalkoxysilane and having a particle size of between about 5 nm and about 200 nm.