Granted Patent B2

US 7,258,263 · App. 10/738,481 · Granted Aug 21, 2007

Abstract

Claims (41)

1. A method for making a current collector plate comprising:

providing a first sheet of material having a first bonding face and a first outer face;

providing a second sheet of material having a second bonding face and a second outer face;

defining a work area on at least one of said first bonding face and said second bonding face;

bonding said first and second sheets together at a bonding area which is different from said work area;

placing said bonded first and second sheet into a die having a pattern defining at least one flow channel; and

injecting fluid between said first and second sheets thereby causing at least one of said first and second sheets to project outward at said work area whereby said work area is expanded outwardly into said die pattern and said bonding area is contacted by said die pattern and precluded from expanding at said bonding area causing a first anode flow channel to be formed on said first outer face, a second self-contained coolant flow channel to be formed between said first and second sheets and a third cathode flow channel to be formed on said second outer face in said work area as defined by said die pattern, wherein said first anode, second self-contained coolant and third cathode flow channels each define a predetermined inlet and outlet.

2. The method of claim 1 wherein defining a work area includes placing an anti-bonding material on at least one of said first bonding face and said second bonding face.

3. The method of claim 2 wherein defining a work area includes placing said anti-bonding material in a generally rectangular pattern on at least one of said first bonding face and said second bonding face.

4. The method of claim 3 wherein placing said anti-bonding material includes leaving predetermined areas along said pattern absent said anti-bonding material; and

bonding said first and second sheets together includes bonding said sheets at said predetermined areas.

5. The method of claim 1 wherein bonding further includes:

contacting said first bonding face with said second bonding face; and

imposing a force onto at least one of said first and second outer faces thereby joining said first and second sheets at said bonding area.

6. The method of claim 5 wherein contacting said first bonding face with said second bonding face defines a first thickness; and

joining said first and second sheets at said bonding area defines a second thickness, said second thickness less than said first thickness.

7. The method of claim 6 wherein imposing a force includes roll bonding said first and second sheets together.

8. The method of claim 1 wherein bonding further includes:

welding said first and second sheets together at said bonding area.

9. The method of claim 1 wherein injecting fluid between said first and second sheet includes forming a flow channel between said first and second sheet.

10. The method of claim 1 , further comprising applying a conductive coating onto said first and second outer face.

11. A method for making a current collector plate comprising:

placing an anti-bonding material onto a first surface of a first sheet of material thereby forming a work area defined by said anti-bonding material and an adjacent non-work area;

contacting a second sheet of material with said anti-bonding material;

forming a metallurgical bond between said first and second sheets at said non-work area thereby creating a two-piece bonded plate;

placing said two-piece bonded plate into a die having a pattern defining at least one flow channel; and

introducing fluid between said two-piece bonded plate to cause at least one of said work area of said first and second sheets to project into said die pattern at said work area and said non-work area to be engaged by and precluded from projecting by said die thereby causing a first anode flow channel to be formed on an outer surface of said first sheet of material, a second self-contained coolant flow channel between said two-piece bonded plate and a third cathode flow channel on an outer surface of said second sheet of material by said pattern of said die, wherein said first anode, second self-contained coolant and third cathode flow channels each define a predetermined inlet and outlet.

12. The method of claim 11 wherein forming a work area includes placing said anti-bonding material in a generally rectangular pattern along one of said first and second sheet.

13. The method of claim 12 wherein placing said anti-bonding material includes leaving predetermined areas along said pattern absent said anti-bonding material; and

bonding said first and second sheets together includes bonding said sheets at said predetermined areas.

14. The method of claim 11 wherein forming a metallurgical bond includes roll bonding said first and second sheet together.

15. The method of claim 11 , further comprising rolling said first and second sheet from a rolled stock of material.

16. The method of claim 11 , further comprising applying a conductive coating onto an outer face of said respective first and second sheets.

17. A method for making a current collector plate comprising:

providing a first sheet of conductive material;

providing a second sheet of conductive material;

placing an anti-bonding material in a desired region over a bonding surface of said first sheet of conductive material, said region of anti-bonding material defining an anti-bonding region along said first sheet, wherein the remaining surface of said bonding surface absent said anti-bonding material defines a bonding area;

contacting said second sheet of conductive material with said anti-bonding material of said first sheet of conductive material;

roll bonding said first and second sheets together whereby said first and second sheets form a metallurgical bond therebetween at said bonding area;

placing said bonded sheets having a first and second outer face into a die having a pattern defining at least one flow channel; and

injecting fluid between said first and second bonded sheets whereby said anti-bonding area is expanded outwardly into said die pattern and said bonding area is contacted by said die pattern and precluded from expanding thereby forming a first anode flow channel on said first outer face, a second self-contained coolant flow channel through said desired region and a third cathode flow channel on said second outer face, wherein said first anode, second self-contained coolant and third cathode flow channels each define a predetermined inlet and outlet.

Assignments (13)