Method of fabricating a ferroelectric capacitor having a ferroelectric film and a paraelectric film
View Patent ↗A method of fabricating a ferroelectric capacitor that can inhibit ferroelectric characteristics from deteriorating includes forming a lower electrode film over from on a top surface of a plug disposed in a silicon oxide film to on the silicon oxide film; forming a paraelectric film so as to frame-likely cover a periphery of a surface of the lower electrode film with a predetermined width; forming a ferroelectric film over from on the exposed lower electrode film from an opening of the paraelectric film to on the paraelectric film in the surroundings of the exposed lower electrode film; forming an upper electrode film, in a surface of the ferroelectric film, over from on a region that faces a contact surface between the lower electrode film and the ferroelectric film to on a region that faces the paraelectric film; and etching through a mask that covers, in a surface of the upper electrode film, from a region that faces the contact surface to a region that faces the paraelectric film.
1. A method of fabricating a ferroelectric capacitor comprising:
forming a lower electrode film on a top surface of a conductive portion formed in a through hole disposed in an insulating layer and on the insulating layer surrounding the top surface;
forming a paraelectric film on the lower electrode film so as to partially expose a surface of the lower electrode film;
forming a ferroelectric film on the exposed lower electrode film and on the paraelectric film surrounding the exposed lower electrode film;
forming an upper electrode film, on a surface of the ferroelectric film including a first region that faces a contact surface between the lower electrode film and the ferroelectric film and a second region that surrounds the first region and faces the paraelectric film; and
etching the upper electrode film, the ferroelectric film, the paraelectric film and the lower electrode film using a mask that covers a surface of the upper electrode film including over the first region and the second region.
2. The method of fabricating a ferroelectric capacitor as set forth in claim 1 , wherein said forming a paraelectric film comprises forming the paraelectric film so as to cover a periphery of a surface of the lower electrode film as a frame with a predetermined width.
3. The method of fabricating a ferroelectric capacitor as set forth in claim 2 , wherein said etching is carried out so that the paraelectric film remains as having a width in a range of from 0.05 to 0.2 μm.
4. The method of fabricating a ferroelectric capacitor as set forth in claim 1 , wherein said forming a lower electrode film comprises:
forming a barrier metal on the top surface of the conductive portion and on the insulating layer surrounding the top surface; and
forming an oxidation resistant metal film on the barrier metal.
5. The method of fabricating a ferroelectric capacitor as set forth in claim 4 , wherein the barrier metal is titanium nitride and the oxidation resistant metal film is iridium.
6. The method of fabricating a ferroelectric capacitor as set forth in claim 1 , wherein a relative permittivity of the ferroelectric film is substantially 200 and a relative permittivity of the paraelectric film is substantially in a range of from 3.9 to 4.9.
7. The method of fabricating a ferroelectric capacitor as set forth in claim 6 , wherein the ferroelectric film is strontium bismuth tantalite and the paraelectric film is silicon oxide.
8. The method of fabricating a ferroelectric capacitor as set forth in claim 1 , wherein a relative permittivity of the ferroelectric film is substantially 200 and a relative permittivity of the paraelectric film is substantially from 6 to 9.
9. The method of fabricating a ferroelectric capacitor as set forth in claim 8 , wherein the ferroelectric film is strontium bismuth tantalite and the paraelectric film is silicon nitride.
10. The method of fabricating a ferroelectric capacitor as set forth in claim 1 , wherein said forming a paraelectric film comprises a plasma CVD process using ozone-tetraethyl orthosilicate.
11. A method of fabricating a semiconductor device comprising:
forming a transistor that includes a control electrode disposed on a semiconductor substrate, and first and second main electrodes formed at positions that are surface regions of the semiconductor substrate and that sandwich the control electrode;
forming an insulating layer that covers the semiconductor substrate and the transistor;
forming, in the insulating layer, a through hole that reaches any one of the first main electrode or the second main electrode;
forming a conductive portion in the through hole;
forming a lower electrode film on a top surface of the conductive portion and on the insulating layer surrounding the top surface;
forming a paraelectric film on the lower electrode film so as to partially expose a surface of the lower electrode film;
forming a ferroelectric film on the exposed lower electrode film and on the paraelectric film surrounding of the exposed lower electrode film;
forming an upper electrode film, on a surface of the ferroelectric film including a first region that faces a contact surface between the lower electrode film and the ferroelectric film and a second region that surrounds the first region and that faces the paraelectric film; and
etching the upper electrode film, the ferroelectric film, the paraelectric film and the lower electrode film using a mask that covers a surface of the upper electrode film including over the first region and the second region.
12. The method of fabricating a semiconductor device as set forth in claim 11 , wherein said forming a paraelectric film comprises forming the paraelectric film so as to cover a periphery of a surface of the lower electrode film as a frame with a predetermined width.
13. The method of fabricating a semiconductor device as set forth in claim 12 , wherein said etching is carried out so that the paraelectric film remains as having a width in a range of from 0.05 to 0.2 μm.
14. The method of fabricating a semiconductor device as set forth in claim 11 , wherein said forming a lower electrode film comprises:
forming a barrier metal on the top surface of the conductive portion and on the insulating layer surrounding the top surface; and
forming an oxidation resistant metal film on the barrier metal.
15. The method of fabricating a semiconductor device as set forth in claim 14 , wherein the barrier metal is titanium nitride and the oxidation resistant metal film is iridium.
16. The method of fabricating a semiconductor device as set forth in claim 11 , wherein a relative permittivity of the ferroelectric film is substantially 200 and a relative permittivity of the paraelectric film is substantially in a range of from 3.9 to 4.9.
17. The method of fabricating a semiconductor device as set forth in claim 16 , wherein the ferroelectric film is strontium bismuth tantalite and the paraelectric film is silicon oxide.
18. The method of fabricating a semiconductor device as set forth in claim 11 , wherein said forming a paraelectric film comprises a plasma CVD process using ozone-tetraethyl orthosilicate.
19. The method of fabricating a semiconductor device as set forth in claim 11 , wherein a relative permittivity of the ferroelectric film is substantially 200 and a relative permittivity of the paraelectric film is substantially from 6 to 9.
20. The method of fabricating a semiconductor device as set forth in claim 19 , wherein the ferroelectric film is strontium bismuth tantalite and the paraelectric film is silicon nitride.