Method for making a multilayer circuit

1. A method for the manufacture of a multilayer circuit, comprising

laminating a stack comprising a first circuit, a second circuit, and a bond ply layer disposed therebetween, the bond ply comprising a liquid crystalline polymer layer having a glass transition temperature and a first crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement; and

subsequent to said laminating, treating the laminated stack at a temperature between the glass transition temperature and the first melting point effective to raise the first melting point to a second crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, wherein the second melting point is at least about 10° C. greater than the first melting point.

2. The method of claim 1 , wherein the second melting point is at least about 15° C. greater than the first melting point.

3. The method of claim 1 , wherein the first melting point is less than or equal to about 250° C.

4. The method of claim 1 , wherein the first melting point is less than or equal to about 290° C.

5. The method of claim 1 , wherein the second melting point is greater than or equal to about 250° C.

6. The method of claim 1 , wherein the second melting point is greater than or equal to about 300° C.

7. The method of claim 1 , wherein the laminating temperature is less than or equal to about 290° C., and the second melting point is greater than or equal to about 300° C.

8. The method of claim 1 , wherein the laminating temperature is less than or equal to about 250° C., and the second melting point is greater than or equal to about 265° C.

9. The method of claim 1 , wherein the laminating temperature is less than or equal to about 235° C., and the second melting point is greater than or equal to about 250° C.

10. The method of claim 1 , further comprising

laminating a second stack comprising the treated laminated stack, a third circuit, and a second bond ply layer disposed therebetween, the second bond ply comprising a liquid crystalline polymer layer having a glass transition temperature and a first crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement; and

subsequent to laminating the second stack, treating the second laminated stack at a temperature between the glass transition temperature of the second bond ply and the first melting point of the second bond ply effective to raise the first melting point of the second bond ply to a second crystalline to nematic melting point of the second bond ply, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, wherein the second melting point of the second bond ply is at least about 10° C. greater than the first melting point of the second bond ply.

11. The method of claim 1 , wherein the first and/or second circuit is a single clad circuit.

12. The method of claim 1 , wherein the first and/or second circuit comprises a dielectric substrate layer disposed between two conductive layers, wherein at least one of the conductive layers is circuitized.

13. The method of claim 1 , wherein the first and/or second circuits is a multilayer circuit.

14. A method for the manufacture of a multilayer circuit, comprising

laminating a stack comprising a double clad circuit and a resin covered conductive layer, wherein the dielectric layer of the resin covered conductive layer is disposed on a circuit layer of the double clad circuit, and further wherein the dielectric laser of the resin covered conductive layer has a Tg and a first crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement; and

subsequent to laminating the stack, treating the laminated stack at a temperature between the glass transition temperature and the first melting point effective to raise the first melting point to a second crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, wherein the second melting point is at least about 10° C. greater than the first melting point.

15. The method of claim 14 , further comprising

disposing a second resin coated conductive layer on a second circuit layer of the double clad circuit, wherein the dielectric layer of the second resin covered conductive layer has a third glass transition temperature and a third crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement; and

treating the laminated stack at a temperature between the glass transition temperature and the third melting point effective to raise the third melting point to a fourth crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, wherein the fourth melting point is at least about 10° C. greater than the first melting point.

16. A method for the manufacture of a multilayer circuit, comprising

laminating a stack comprising a double clad circuit, a first resin covered conductive layer, and a second resin covered conductive layer, wherein

the double clad circuit comprises a dielectric substrate disposed between a first circuit layer and a second circuit layer;

the first resin covered conductive layer comprises a first dielectric layer and a first conductive layer, wherein the first dielectric layer has a first glass transition temperature and a first crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement;

the second resin covered conductive layer comprises a second dielectric layer and a second conductive layer, wherein the second dielectric layer has a second glass transition temperature and a second crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement; and further wherein

the first dielectric layer is disposed on the first circuit layer and the second dielectric layer is disposed on the second circuit layer; and

treating the laminated stack at a temperature between the first glass transition temperature and the first melting point effective to raise the first melting point to a third crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, wherein the third melting point is at least about 10° C. greater than the first melting point.

17. The method of claim 16 , wherein the treating temperature is between the second class transition temperature and the second melting point, and is effective to raise the second melting point to a fourth crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, wherein, the fourth melting point is at least about 10° C. greater than the first melting point.

18. The method of claim 16 , wherein the first and second glass transition temperatures are the same and the first and second melting points are the same.