Printed wiring board with improved impedance matching
View Patent ↗To provide a printed wiring board where the impedance between pads through which differential signals pass has been set to a predetermined standard value. The printed wiring board includes a first conductor layer extending over an area excluding a hole formed for each pad group and filled with a dielectric, and a second conductor layer extending over an area containing areas facing the hole. The hole encompasses a plurality of areas facing predetermined respective pads which are adjacent to each other and which form the pad group from among the plurality of pads.
1. A printed wiring board, comprising:
at least two conductor layers spaced from each other in a thickness direction and parallel to a top surface of the printed wiring board, and embedded in a dielectric;
a plurality of pads formed on the top surface with a plurality of wires extending from the pads,
wherein at least two of the plurality of pads are adjacent to each other to form a pad group where differential signals pass and each of the at least two of the plurality of pads have an impedance value, and
a hole formed in the dielectric and filled with the dielectric to define a first area below the pad group;
wherein a first conductor layer of the at least two conductor layers is closest to the top surface and extends over a second area of the dielectric outside of the first area,
a second conductor layer of the at least two conductor layers is formed below the first conductor layer and extends below the first area,
a sum of the impedance values for each of the at least two of the plurality of pads is a predetermined impedance, and
the predetermined impedance is set by the differential signals sent by the at least two of the plurality of pads to the second conductor layer.
2. The printed wiring board according to claim 1 , comprising:
an internal wire formed in the second area, and
extending parallel to the top surface between the first conductor layer and the second conductor layer.
3. The printed wiring board according to claim 1 , wherein the predetermined impedance is adjusted by displacing a distance between the at least two of the plurality of pads in the first area.
4. The printed wiring board according to claim 1 , wherein the predetermined impedance is adjusted by varying a width of the hole in the first area.
5. A printed wiring board, comprising:
at least two conductor layers spaced from each other in a thickness direction of the printed wiring board and embedded in a dielectric;
a plurality of pads arranged with a plurality of wires extending from the plurality of pads formed on a top surface of the printed wiring board,
wherein at least two of the plurality of pads form a pad group in a first area of the printed wiring board;
a first conductor layer of the at least two conductor layers includes a first portion extending parallel to a top surface of the printed wiring board in a second area outside the first area and at a first distance from the top surface and a second portion of the first conductor layer extending parallel to the top surface in the first area and at a second, greater distance from the top surface and;
a second conductor layer of the at least two conductor layers formed below the first conductor layer and parallel to the top surface of the printed wiring board and formed in the second area at a third distance from the top surface that is greater than the second distance.
6. The printed wiring board according to claim 5 , wherein the second conductor layer is formed at a bottom surface of the dielectric substrate.