Manufacturing method of thin-film transistor, thin-film transistor sheet, and electric circuit
View Patent ↗A thin-film transistor, a thin-film transistor sheet, an electric circuit, and a manufacturing method thereof are disclosed, the method comprising the steps of forming a semiconductor layer by providing a semiconductive material on a substrate, b) forming an isolating area, which is electrode material-repellent, by providing an electrode material-repellent material on the substrate, and c) forming a source electrode on one end of the insulating area and a drain electrode on the other end of the insulating area, by providing an electrode material.
1. A method of manufacturing a thin-film transistor comprising a substrate, and provided thereon, a gate electrode, a gate insulating layer, a semiconductor layer, a source electrode and a drain electrode, the method comprising:
a) forming the gate insulating layer on the substrate;
b) providing a semiconductive material on the gate insulating layer to form the semiconductor layer on the gate insulating layer;
c) providing an electrode material-repellent material onto the semiconductor layer to form on the semiconductor layer a first area on which the electrode material-repellent material is provided and second and third areas on which the electrode material-repellent material is not provided, whereby an insulating area comprised of the electrode material-repellent material is formed on the first area, the second area being on one end of the first area and the third area on the other end of the first area; and then
d) providing an electrode material onto the insulating area, whereby the electrode material is separated by the insulating area to form a source electrode on the second area of one end of the insulating area and a drain electrode on the third area of the other end of the insulating area.
2. The method of claim 1 , wherein the insulating area is comprised of a silicone rubber layer.
3. The method of claim 1 , wherein the thickness of the insulating area is from 0.05 to 10 μm.
4. The method of claim 1 , wherein the providing of the electrode material-repellent material is carried out by an ink jet method.
5. The method of claim 1 , wherein the providing of the electrode material is carried out by an ink jet method.
6. The method of claim 5 , wherein the electrode material is contained in a solvent or a dispersion medium containing 50% by weight of water.
7. The method of claim 1 , wherein the semiconductor layer is an organic semiconductor layer containing an organic semiconductive material.
8. The method of claim 1 , wherein the substrate is a resin sheet comprised of a resin.