IP Library Granted Patent US 7,376,294
Granted Patent B2
US 7,376,294 · App. 10/741,745 · Granted May 20, 2008

Optoelectronic component with an adjustable optical property and method for producing the layer structure

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Quick Facts
Patent No.
US 7,376,294
App. No.
10/741,745
Granted
May 20, 2008
Kind
B2
Abstract

The invention relates to an optoelectronic component and a method for producing it, in particular a waveguide structure, featuring at least one irradiation-sensitive structure in a layer structure of the optoelectronic component, the refractive index of the irradiation-sensitive structure being able to be permanently altered in a manner dependent on an irradiation. It is thus possible to change the properties of at least one layer, in particular of an optical waveguide, in a targeted manner by means of a simple method step.

Claims (35)

1. An optoelectronic component with a layer structure, the optoelectronic component comprising:

at least one irradiation-sensitive structure in the layer structure having a first refractive index that is able to be permanently altered by irradiation comprising a particle radiation to a second refractive index, and at least one non-irradiation sensitive layer being arranged above the irradiation-sensitive structure, wherein the layer structure in which the irradiation-sensitive structure is embedded comprises SiO 2 , SiO 2 -B 2 O 3 or SiO 2- B 2 O 3- P 2 O 5 ;

wherein the second refractive index substantially matches a third refractive index of a particular layer in the layer structure and wherein the at least one irradiation-sensitive structure forms part of a vertical coupler such that light couples between the particular layer and the at least one irradiation-sensitive structure.

2. The optoelectronic component of claim 1 , wherein the irradiation-sensitive structure comprises a doping made of germanium oxide.

3. The optoelectronic component of claim 1 , wherein the irradiation-sensitive structure comprises a doping made of hydrogen.

4. The optoelectronic component of claim 1 , wherein the irradiation-sensitive structure comprises a doping, wherein the doping comprises

a) germanium oxide and hydrogen,

b) tin oxide,

c) tin oxide and germanium oxide, or

d) germanium oxide.

5. The optoelectronic component of claim 1 , wherein the irradiation-sensitive structure is arranged in a core layer of a waveguide structure.

6. The optoelectronic component of claim 1 , wherein the irradiation-sensitive structure is arranged in a buffer layer or a covering layer of a waveguide structure.

7. The optoelectronic component of claim 1 , wherein the irradiation-sensitive structure is arranged over the whole area in a layer or locally in a layer as a grating structure.

8. The optoelectronic component of claim 1 , wherein the optoelectronic component is a vertical coupler or a laser diode.

9. The optoelectronic component of claim 1 , wherein the irradiation-sensitive structure is part of one of a plurality of SiO 2 layers with different layer dopings.

10. A method for producing an optoelectronic semiconductor component, the method comprising:

a) applying an irradiation-sensitive structure to a layer of a layer structure or to a substrate, wherein the layer or the substrate to which the irradiation-sensitive structure is applied includes one or more of SiO 2 , SiO 2 -B 2 O 3 or SiO 2- B 2 O 3- P 2 O 5 ;

b) irradiating the irradiation-sensitive structure in order to permanently alter a refractive index of the irradiation-sensitive structure in a targeted manner such that the refractive index of the irradiation-sensitive structure is the same as a refractive index of a particular layer of the layer structure; and

c) depositing a non-irradiation sensitive layer above the irradiation-sensitive structure, wherein the irradiation-sensitive structure forms a vertical coupler with respect to the particular layer.

11. The method of claim 10 , wherein irradiation includes particle radiation comprising an ion radiation, an electron radiation, or a neutron radiation.

12. An optoelectronic component, comprising:

a substrate;

a buffer layer positioned above the substrate;

a core layer positioned above the buffer layer;

a covering layer positioned above the core layer; and

an irradiation sensitive structure disposed a particular distance from the core layer, wherein a refractive index of the irradiation sensitive structure after irradiation matches a refractive index of the core layer to form a vertical coupler.

13. The optoelectronic component as recited in claim 12 , wherein the optoelectronic component comprises a laser diode, wherein the irradiation sensitive structure comprises dimensions that substantially the same dimensions as the core layer and wherein light coupled out is provided to a monitor diode that is used to measure a power of the light.

14. The optoelectronic component as recited in claim 12 , wherein the core layer comprises SiO 2 , SiO 2 -B 2 O 3 or SiO 2- B 2 O 3- P 2 O 5 .

15. The optoelectronic component as recited in claim 12 , wherein the irradiation-sensitive structure comprises a doping, wherein the doping comprises:

a) germanium oxide and hydrogen,

b) tin oxide,

c) tin oxide and germanium oxide, or

d) germanium oxide.

16. The optoelectronic component as recited in claim 12 , wherein the irradiation-sensitive structure is sensitive to at least one of: ion radiation; electron radiation; and neutron radiation.

17. The optoelectronic component as recited in claim 12 , wherein the irradiation-sensitive structure comprises a grating.

Assignments (6)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2006
From: INFINEON TECHNOLOGIES AG
To: FINISAR CORPORATION
Reel/Frame 017425/0874 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2004
From: ALBRECHT, HELMUT; SCHNEIDER, HARTMUT
To: INFINEON TECHNOLOGIES AG
Reel/Frame 015463/0321 →