Manufacturing method of electronic components embedded substrate
View Patent ↗A substrate including an electronic component is manufactured by preparing an electronic component having a terminal portion and a first insulative sheet, and mounting the electronic component to a surface of the first insulative sheet so that the terminal portion is opposed to the first insulative sheet. Then an opening portion is formed in the first insulative sheet so that a surface of the terminal portion is exposed and a conductive material is formed that is extended from the terminal portion to an upper portion of the first insulative sheet.
1. A method of manufacturing a substrate including an electronic component, the method comprising:
preparing an electronic component having a terminal portion;
preparing a first insulative sheet;
mounting the electronic component to a surface of the first insulative sheet so that the terminal portion is opposed to the first insulative sheet;
forming an opening portion in the first insulative sheet so that a surface of the terminal portion is exposed; and
forming a conductive material that is extended from the terminal portion to an upper portion of the first insulative sheet,
wherein the first insulative sheet is a photosensitive sheet.
2. A method of manufacturing a substrate including an electronic component, the method comprising:
preparing a first electronic component having a terminal portion on a main surface thereof and having a first thickness;
preparing a second electronic component having a terminal portion on a main surface thereof and having a second thickness that is thicker than the first thickness;
preparing a first insulative sheet;
mounting the first and second electronic components on the first insulative sheet so that the terminal portions thereof are opposed to the first insulative sheet;
forming opening portions in the first insulative sheet so that surfaces of the terminal portions of the first and second electronic components are exposed;
forming wiring patterns each of which is extended from the corresponding terminal portions of the first and second electronic components to the upper portion of the first insulative sheet; and
covering the first and second electronic components with resin,
wherein the forming of the opening portions in the first insulative sheet comprises using a photosensitive sheet as the first insulative sheet, directly exposing and developing the photosensitive sheet, and forming the opening portions through which the surfaces of the terminal portions of the first and second electronic components are exposed.