IP Library › Granted Patent US 6,928,723
Granted Patent B2
US 6,928,723 · App. 10/746,021 · Granted Aug 16, 2005

Method for making a magnetoresistive sensor having a cobalt-ferrite pinning layer

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Quick Facts
Patent No.
US 6,928,723
App. No.
10/746,021
Granted
Aug 16, 2005
Kind
B2
Abstract

An exchange-coupled magnetic structure of a cobalt-ferrite layer adjacent a magnetic metal layer is used in magnetorestive sensors, such as spin valves or tunnel junction valves. The exchange-coupled magnetic structure is used in a pinning structure pinning the magnetization of a ferromagnetic pinned layer, or in an AP pinned layer. A low coercivity ferrite may be used in an AP free layer. Cobalt-ferrite layers may be formed by co-sputtering of Co and Fe in an oxygen/argon gas mixture, or by sputtering of a CoFe 2 composition target in an oxygen/argon gas mixture. Alternatively, the cobalt-ferrite layer may be formed by evaporation of Co and Fe from an alloy source or separate sources along with a flux of oxygen atoms from a RF oxygen atom beam source. Magnetoresistive sensors including cobalt-ferrite layers have small read gaps and produce large signals with high efficiency.

Claims (27)

1. A method for making a magnetoresistive sensor having a cobalt-ferrite pinning layer comprising:

a) depositing a first cobalt-ferrite layer;

b) depositing a ferromagnetic pinned layer proximate the first cobalt-ferrite layer;

c) depositing a spacer layer; and

d) depositing a ferromagnetic free layer;

wherein the spacer layer is disposed between the ferromagnetic pinned layer and the ferromagnetic free layer.

2. The method of claim 1 further comprising depositing an antiparallel (AP) spacer layer, wherein the AP spacer layer is disposed between the first cobalt-ferrite layer and the ferromagnetic pinned layer.

3. The method of claim 2 further comprising depositing a second cobalt-ferrite layer, wherein the first and second cobalt-ferrite layers sandwich the AP spacer layer.

4. The method of claim 3 further comprising depositing a first metal layer, wherein the first metal layer is disposed between the first cobalt-ferrite layer and the AP spacer layer.

5. The method of claim 4 further comprising depositing a second metal layer, wherein the second metal layer is disposed between the second cobalt-ferrite layer and the AP spacer layer.

6. The method of claim 5 , wherein the first and second cobalt-ferrite layer are deposited by co-sputtering of Co and Fe in an atmosphere consisting of oxygen and an inert gas.

7. The method of claim 6 , wherein the inert gas is a gas selected from the group consisting of argon, xenon, krypton, and their mixture.

8. The method of claim 5 , wherein the first and second cobalt-ferrite layer is deposited by sputtering Co x Fe targets in an atmosphere consisting of oxygen and an inert gas, wherein x is greater than zero and less than three.

9. The method of claim 8 , wherein the inert gas is a gas selected from the group consisting of argon, xenon, krypton, and their mixture.

10. The method of claim 5 , wherein the first and second cobalt-ferrite layers are deposited by evaporation of Co and Fe from a Co/Fe alloy source and a flux of oxygen atoms from an oxygen-atom beam source on substrate.

11. The method of claim 1 , wherein d) comprises:

i) depositing a first magnetic metal layer adjacent to the spacer layer;

ii) depositing a magnetically soft ferrite layer;

iii) depositing a second magnetic metal layer adjacent to the magnetically soft ferrite layer; and

iv) depositing an AP spacer layer, wherein the AP spacer layer is disposed between the first and the second magnetic metal layer.

12. The method of claim 1 , wherein d) comprises:

i) depositing a first magnetically soft ferrite layer;

ii) depositing a second magnetically soft ferrite layer;

iii) depositing a first magnetic metal adjacent to the first magnetically soft ferrite layer;

iv) depositing a second magnetic metal layer adjacent to the second magnetically soft ferrite layer; and

v) depositing an antiparallel (AP) spacer layer, wherein the AP spacer layer is disposed between the first and the second magnetic metal layers.

13. The method of claim 1 , further comprising a step of depositing an anti-ferromagnetic (AF) layer, wherein the AF layer is disposed between the first cobalt-ferrite layer and the ferromagnetic pinned layer.