Test circuit and multi-chip package type semiconductor device having the test circuit
View Patent ↗A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.
1. A multi-chip package type semiconductor device having a first semiconductor chip, which has a first internal circuit and a plurality of first internal terminal pads for transmitting signals to or from the first internal circuit, and a second semiconductor chip, which has a second internal circuit and a plurality of second internal terminal pads for transmitting signals to or from the second internal circuit for transmitting signals, and each second internal terminal pad being connected to one of the first internal terminal pads electrically, comprising:
a test circuit, responsive to a voltage level of a test mode signal, selecting one from between operations for prohibiting signal transmission between the first internal circuit and the first internal terminal pads and for allowing signal transmission between the first internal circuit and the first internal terminal pads, and for selecting one from between operations for prohibiting signal transmission between the second internal circuit and the second internal terminal pads and for allowing signal transmission between the second internal circuit and the second internal terminal pads; and
a plurality of an external terminal pads for transmitting signals to and from an external device, each external terminal corresponding to one of the internal terminal pads,
wherein the first semiconductor chip further includes a selection circuit allowing electrical connection between the internal and external terminal pads in the operation for prohibiting signal transmission between the first internal circuit and the first internal terminal pads.
2. A multi-chip package type semiconductor device as claimed in claim 1 , wherein the test circuit further includes a control circuit, the control circuit controlling signal transmission between the external terminal pads and the first internal circuit, responsive to a control signal in the operation for allowing signal transmission between the first internal circuit and the first internal terminal pads.