Semiconductor device and manufacturing method of semiconductor device
View Patent ↗A manufacturing method of a semiconductor device includes a support member for fixing a semiconductor chip, the support member being formed between leads without applying stress to the leads. The semiconductor device includes a plurality of leads composing a lead frame, a resin island (a support member) that is formed between the leads, a semiconductor chip that is fixed on the resin island and is electrically connected to the leads by bonding wires, and sealing resin for partially sealing the semiconductor chip, the bonding wire, and the lead by resin, wherein a liquid cured resin is formed (filled) between the leads to form the resin island (the support member).
1. A method of manufacturing a semiconductor device comprising:
preparing a lead frame having a plurality of leads;
forming a liquid resin between the leads;
forming a support member between the leads by curing the liquid resin;
fixing a semiconductor chip on the support member;
connecting the semiconductor chip to the leads by bonding wires; and
sealing the semiconductor chip, the bonding wires and portions of the leads by resin.
2. The method according to claim 1 , wherein, for each of the leads, a connection portion of the lead, to which the bonding wire is connected, is thicker than the other portions of the lead.
3. The method according to claim 1 , wherein said forming the support member comprises:
attaching a mold member on one surface of the lead frame;
forming the liquid resin between the leads from a surface of the lead frame opposite to the one surface; and
curing the liquid resin.
4. The method according to claim 1 , wherein said forming the support member comprises:
disposing the lead frame between a pair of mold members;
forming the liquid resin between the leads; and
curing the liquid resin.
5. A method of manufacturing the semiconductor device comprising:
preparing a lead frame having a plurality of leads;
arranging a semiconductor chip between the leads;
forming a liquid resin between the leads and the semiconductor chip;
forming a support member between the leads and the semiconductor chip for supporting the semiconductor chip by curing the liquid resin;
connecting the semiconductor chip to the leads by bonding wires; and
sealing the semiconductor chip, the bonding wires and portions of the leads by resin.
6. The method according to claim 5 , wherein said forming the support member comprises:
attaching a mold member on a first surface of the lead frame;
forming the liquid resin between the leads and the semiconductor chip from a surface of the lead frame opposite to the first surface; and
curing the liquid resin.
7. The method according to claim 5 , wherein a side surface of the semiconductor chip is in direct contact with the support member.
8. The method according to claim 1 , wherein a bottom surface of the semiconductor chip is in direct contact with the support member.