Method for protecting a surface
View Patent ↗The invention includes a method of producing a hard metallic material by forming a mixture containing at least 55% iron and at least one of B, C, Si and P. The mixture is formed into an alloy and cooled to form a metallic material having a hardness of greater than about 9.2 GPa. The invention includes a method of forming a wire by combining a metal strip and a powder. The strip and the powder are rolled to form a wire containing at least 55% iron and from 2–7 additional elements including at lease one of C, Si and B. The invention also includes a method of forming a hardened surface on a substrate by processing a solid mass to form a power, applying the powder to a surface to form a layer containing metallic glass, and converting the glass to a crystalline material having a nanocrystalline grain size.
1. A method of forming a hardened surface on a substrate, comprising:
providing a solid mass comprising a first hardness;
processing the solid mass to form a powder;
combining the powder with a metal strip to form a wire, the wire having a final composition comprising at least 55% iron by weight and at least one element selected from the group consisting of Si, C, P and B;
applying the final composition to a surface of a substrate to initially form a layer having a second hardness, at least some of the layer comprising metallic glass, the applying comprising at least one of twin-roll wire arc deposition, single-roll wire arc deposition and high-velocity wire arc deposition; and
converting at least some of the metallic glass to a crystalline material having a nanocrystalline grain size, the converting hardening the layer to form a hardened layer having a third hardness that is greater than the first hardness and greater than the second hardness.
2. The method of claim 1 wherein the initially-formed layer comprises an amorphous structure.
3. The method of claim 1 wherein the hardened layer comprises a nanocomposite microstructure having a grain size of from about 75 nm to about 125 nm, and having second phase precipitates of about 20 nm at grain boundaries.