IP Library Granted Patent US 7,183,588
Granted Patent B2
US 7,183,588 · App. 10/755,047 · Granted Feb 27, 2007

Light emission device

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Quick Facts
Patent No.
US 7,183,588
App. No.
10/755,047
Granted
Feb 27, 2007
Kind
B2
Abstract

A light emission device. A lead frame comprises a first lead frame segment and a second lead frame segment. A light source is coupled to the first lead frame segment. A wire bond is coupled to the light source and coupled to the second lead frame segment. A translucent epoxy cast encases the light source, the wire bond and a portion of the lead frame.

Claims (26)

1. A light emission device comprising:

a lead frame comprising a first lead frame segment and a second lead frame segment, wherein said first lead frame segment comprises a first recess, wherein said first recess is a reflector cup, and wherein said first lead frame segment comprises a second recess;

a light source coupled to said first lead frame segment, wherein said light source resides at least partially within said first recess;

a wire bond coupled to said light source and coupled to said second lead frame segment; and

an epoxy cast encasing said light source, said wire bond, and a portion of said lead frame, such that said epoxy cast fills said second recess for anchoring said epoxy cast to said first lead frame segment.

2. The light emission device as recited in claim 1 wherein said epoxy cast comprises a shaped epoxy portion.

3. The light emission device as recited in claim 2 wherein said shaped epoxy portion is a dome shape.

4. The light emission device as recited in claim 1 wherein said lead frame comprises plating.

5. The light emission device as recited in claim 1 wherein said epoxy cast comprises a color tinting.

6. The light emission device as recited in claim 1 wherein said epoxy cast is operable to diffuse light from said light source.

7. The light emission device as recited in claim 1 further comprising a second wire bond coupled to said first lead frame segment and said light source.

8. The light emission device as recited in claim 1 wherein said light source is a light emitting diode die.

9. The light emission device as recited in claim 1 wherein said second recess is on an opposite side of said first lead frame segment than said first recess, such that at least a portion of said first lead frame segment is completely surrounded by said epoxy cast.

10. A light emission device comprising:

a lead frame comprising a first lead frame segment and a second lead frame segment;

a light emitting diode coupled to said first lead frame segment, said first lead frame segment comprising a first recess such that said light emitting diode resides at least partially within said first recess, and wherein said first lead frame segment comprises a second recess;

a wire bond coupled to said light emitting diode and coupled to said second lead frame segment; and

an epoxy cast encasing said light emitting diode, said wire bond, and a portion of said lead frame, said epoxy cast comprising a shaped epoxy portion, wherein said epoxy cast fills said second recess for anchoring said epoxy cast to said first lead frame segment.

11. The light emission device as recited in claim 10 wherein said first recess is a reflector cup.

12. The light emission device as recited in claim 10 wherein said shaped epoxy portion is incident to said light emitting diode.

13. The light emission device as recited in claim 10 wherein said lead frame comprises plating.

14. The light emission device as recited in claim 10 wherein said epoxy cast comprises a color tinting.

15. The light emission device as recited in claim 10 wherein said epoxy cast is operable to diffuse light from said light emitting diode.

16. The light emission device as recited in claim 10 further comprising a second wire bond coupled to said first lead frame segment and said light emitting diode.

17. The light emission device as recited in claim 10 wherein said shaped epoxy portion is a dome shape.

18. The light emission device as recited in claim 10 wherein said second recess is on an opposite side of said first lead frame segment than said first recess, such that at least a portion of said first lead frame segment is completely surrounded by said epoxy cast.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2016
From: INTELLECTUAL DISCOVERY CO. LTD.
To: DOCUMENT SECURITY SYSTEMS, INC.
Reel/Frame 040744/0174 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.; AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 028972/0733 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0518 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2004
From: CHIA, CHEE WAI; KOAY, HUI PENG; WONG, LYE YEE
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 014367/0780 →