IP Library Granted Patent US 7,364,624
Granted Patent B2
US 7,364,624 · App. 10/759,582 · Granted Apr 29, 2008

Wafer handling apparatus and method of manufacturing thereof

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Quick Facts
Patent No.
US 7,364,624
App. No.
10/759,582
Granted
Apr 29, 2008
Kind
B2
Abstract

A wafer processing device or apparatus, i.e., a heater or an electrostatic chuck, comprises a planar support platen, a support shaft having centrally located bore, and a pair of electrical conductors located in the shaft. In one embodiment, the electrical conductors are concentrically located within the bore of the shaft, with the first electrical lead being in the form of a pyrolytic graphite rod and separated from the outer second graphite electrical lead by means of a pyrolytic boron nitride (pBN) coating. In a second embodiment, the support platen and the support shaft are formed from a single unitary body of graphite. In yet another embodiment of the device of the invention, the connection posts comprise a carbon fiber composite and the exposed ends of the electrical connectors are coated with a protective ceramic paste for extended life in operations.

Claims (36)

1. A wafer processing device comprising:

a platform for supporting an object to be heated, the platform comprises a substrate having upper and lower relatively flat surfaces, the platform is comprised of graphite;

a shaft extending substantially transverse to the platform, the shaft is comprised of graphite;

a first coating on at least one of the flat surfaces, with said first coating composed of at least a material selected from the group consisting of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof;

a second coating layer composed of pyrolytic graphite disposed on the first coating in a patterned arrangement of predetermined geometry, the layer having at least two separate ends adapted for forming at least an electrode; and

a top coating of a dielectric material superimposed on said first and second coatings, the top coating is composed of at least a material selected from the group consisting of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof;

wherein the graphite shaft and the graphite platform form a single unitary body, and wherein the graphite shaft is a rod with a hollow core,

wherein the graphite shaft further includes at least two electrical conductors for connecting the electrode to an external source of power, each electrical conductor being in contact with, and surrounded by, dielectric material,

wherein the two electrical conductors are symmetrically disposed on opposite sides of an exterior surface of the graphite shaft.

2. The wafer processing device of claim 1 , wherein the device is an electrostatic chuck and the electrode is a chuck electrode.

3. The wafer processing device of claim 1 , wherein the device is a heater and the electrode is a heating element electrode.

4. The wafer processing device of claim 1 , wherein the graphite platform is one of a disk, a platen, and a cylinder.

5. The wafer processing device of claim 1 , wherein the second coating is patterned to form a continuous elongated strip of pyrolytic graphite arranged in at least one of electrical flow path has at least one of a spiral pattern, a serpentine pattern, a helical pattern, a zigzag pattern, a continuous labyrinthine pattern, a spirally coiled pattern, a swirled pattern, a randomly convoluted pattern, and combinations thereof.

6. The wafer processing device of claim 5 , wherein the patterned second coating is formed on said lower surface of said platform.

7. The wafer processing device of claim 1 , wherein said pyrolytic graphite second coating layer is encapsulated in at least a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof.

8. The wafer processing device of claim 7 , wherein said pyrolytic graphite second coating layer is encapsulated in AlN or pyrolytic boron nitride.

9. The wafer processing device of claim 1 , wherein:

each electrical conductor has an end adapted for connecting to the external source of power, and the end of each of the electrical conductors is coated with at least a ceramic paste comprising at least one of a piezoelectric ceramic paste, a plasticiser, a conductor, and combinations thereof.

10. A wafer processing device comprising:

a platform for supporting an object to be heated, the platform comprises a substrate having upper and lower relatively flat surfaces, the platform is comprised of graphite;

a shaft extending substantially transverse to the platform, the shaft is comprised of graphite;

a first coating on at least one of the flat surfaces, with said first coating composed of at least a material selected from the group consisting of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof;

a second coating layer composed of pyrolytic graphite disposed on the first coating in a patterned arrangement of predetermined geometry, the layer having at least two separate ends adapted for forming at least an electrode; and

a top coating of a dielectric material superimposed on said first and second coatings, the top coating is composed of at least a material selected from the group consisting of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof;

wherein the graphite shaft and the graphite platform form a single unitary body, and

wherein the graphite shaft further includes at least two electrical conductors for connecting the electrode to an external source of power,

wherein said two electrical conductors are coated layers of pyrolytic graphite symmetrically disposed on opposite sides of said graphite shaft wherein said two electric conductors each extend lengthwise along the graphite shaft and are integral therewith.

11. A wafer processing device comprising:

a platform for supporting an object to be heated, the platform comprises a substrate having upper and lower relatively flat surfaces, the platform is comprised of graphite;

a shaft extending substantially transverse to the platform, the shaft is comprised of graphite;

a first coating on at least one of the flat surfaces, with said first coating composed of at least a material selected from the group consisting of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof;

a second coating layer composed of pyrolytic graphite disposed on the first coating in a patterned arrangement of predetermined geometry, the layer having at least two separate ends adapted for forming at least an electrode; and

a top coating of a dielectric material superimposed on said first and second coatings, the top coating is composed of at least a material selected from the group consisting of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof;

wherein the graphite shaft and the graphite platform form a single unitary body, and wherein the graphite shaft is a rod with a hollow core,

wherein the graphite shaft further includes at least two electrical conductors for connecting the electrode to an external source of power, each electrical conductor being in contact with, and surrounded by, dielectric material,

wherein said first electrical conductor is in a form of a graphite rod, the second electrical conductor is a hollow graphite rod, and wherein the first and second electrical conductors are separated by means of a coating layer comprising a material selected from the group of least a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Dec 24, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 054883/0855 →
RELEASE OF SECURITY INTEREST Recorded Nov 11, 2020
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MOMENTIVE PERFORMANCE MATERIALS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH & CO KG; MOMENTIVE PERFORMANCE MATERIALS JAPAN HOLDINGS GK
Reel/Frame 054387/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded May 21, 2019
From: JPMORGAN CHASE BANK, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 050304/0555 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049194/0085 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049249/0271 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY - SECOND LIEN Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035137/0263 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035136/0457 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 30, 2014
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034113/0331 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 30, 2014
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034113/0252 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0662 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0570 →
SECURITY AGREEMENT Recorded Apr 29, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 030311/0343 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 030185/0001 →
SECURITY AGREEMENT Recorded May 31, 2012
From: MOMENTIVE PERFORMANCE MATERIALS INC
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 028344/0208 →
SECURITY AGREEMENT Recorded Jul 1, 2009
From: MOMENTIVE PERFORMANCE MATERIALS, INC.; JUNIPER BOND HOLDINGS I LLC; JUNIPER BOND HOLDINGS II LLC; JUNIPER BOND HOLDINGS III LLC; JUNIPER BOND HOLDINGS IV LLC; MOMENTIVE PERFORMANCE MATERIALS CHINA SPV INC.; MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.; MOMENTIVE PERFORMANCE MATERIALS SOUTH AMERICA INC.; MOMENTIVE PERFORMANCE MATERIALS USA INC.; MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC.; MPM SILICONES, LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL TRUSTEE
Reel/Frame 022902/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2008
From: GENERAL ELECTRIC COMPANY
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 020424/0277 →
SECURITY AGREEMENT Recorded Jul 3, 2007
From: MOMENTIVE PERFORMANCE MATERIALS HOLDINGS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH & CO. KG; MOMENTIVE PERFORMANCE MATERIALS JAPAN HOLDINGS GK
To: JPMORGAN CHASE BANK, N.A. AS ADMINISTRATIVE AGENT
Reel/Frame 019511/0166 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2004
From: MARINER, JOHN THOMAS; HEJL, TIMOTHY J.; LONGWORTH, DOUGLS ALAN; LENNARTZ, JEFFREY; SANE, AJIT; MACEY, ANDREW JOHN; LEIST, JON; DEVAN, THOMAS EDWARD
To: GENERAL ELECTRIC COMPANY
Reel/Frame 015105/0091 →