Cooling system for densely packed electronic components
View Patent ↗A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board has a manifold for intake and exhaust of refrigerant, and larger rack manifolds are substituted for rails and are attached to a backplane. A hybrid package including a ceramic hybrid power module and an attached array of cooling assemblies provide even more density of components and improved cooling.
1. A cooling system for electronic equipment enclosures with densely packed components comprising:
an electronic equipment enclosure; a rack mounted within said enclosure;
a plurality of boards mounted to said rack, at least one of said boards having a plurality of heat generating components mounted thereon;
a plurality of microscale cooling assemblies each one of said cooling assemblies being connected to one of said plurality of heat generating components, each cooling assembly including a heat insulative housing, an inlet port formed in said housing for receiving a heat transferring fluid, an outlet port formed in said housing for passing said heat transferring fluid, a thermally conductive element connected to said housing, an evaporator chamber formed by said housing and said thermally conductive element upstream of said outlet port and a capillary passage formed in said housing between said inlet port and said evaporator chamber;
a first intake manifold mounted to said rack;
a first exhaust manifold mounted to said rack;
a second intake manifold mounted to said board and to said first intake manifold;
a second exhaust manifold mounted to said board and to said first exhaust manifold;
a first fluid conduit connecting said board mounted second intake manifold and each of said plurality of cooling assemblies;
a second fluid conduit connecting said board mounted second exhaust manifold and each of said plurality of cooling assemblies;
a compressor;
a third fluid conduit connecting said rack mounted first intake manifold and said compressor; and
a fourth fluid conduit connecting said rack mounted first exhaust manifold and said compressor.
2. The system of claim 1 wherein:
said rack includes a rail; and
said plurality of boards are mounted to said rail.
3. The system of claim 1 including:
a backplane connected to said rack; and wherein
said plurality of boards are mounted to said backplane.
4. The system of claim 1 including:
a backplane connected to said rack; and
said first intake manifold and said first exhaust manifold are connected to said backplane.
5. The system of claim 1 including:
a backplane connected to said rack; and wherein
said rack includes a rail;
said first intake manifold and said first exhaust manifold are connected to said backplane; and
said plurality of boards are mounted to said rail and to said backplane.