Method of protecting a semiconductor integrated circuit from plasma damage
View Patent ↗In the design of an integrated circuit having a semiconductor substrate and metal interconnecting lines, including a core ring with metal power and ground lines that supply power to a core area inside the core ring, one or more metal-oxide-semiconductor capacitor units are laid out below the core ring. Each unit has an active area and an insulated gate electrode, which are connected by contacts to the core ring. These capacitor units protect transistors in the core area that have gate electrodes connected to the power or ground line from plasma damage during the fabrication of the integrated circuit. Additional capacitor units laid out below the core ring may be connected to a surrounding input-output ring to protect transistors in input-output circuits, and similar units may be connected to the core ring and input-output ring as protection transistors.
1. A method of laying out an integrated circuit having a semiconductor substrate and metal interconnecting lines disposed above the semiconductor substrate, the metal interconnecting lines including a core ring with a first power line and a first around line, the first power line and the first ground line being mutually adjacent, core ring supplying power to circuits surrounded by the core ring, the method comprising:
routing a plurality of the metal interconnecting lines across the core ring, for use as input-output (I/O) signal lines;
identifying a part of the core ring crossed by comparatively few of the I/O signal lines;
laying out at least one metal-oxide-semiconductor (MOS) capacitor unit below said part of the core ring, the MOS capacitor unit having an active area disposed in the semiconductor substrate and an insulated gate electrode disposed on the semiconductor substrate, at least part of the insulated gate electrode being disposed above part of the active area;
laying out first contacts connecting the active area to one of the first power line and the first ground line, and;
laying out second contacts connecting the insulated gate electrode to another one of the first power line and the first around line.
2. A method of laying out an integrated circuit having a semiconductor substrate and metal interconnecting lines disposed above the semiconductor substrate, the metal interconnecting lines including a core ring with a first power line and a first around line, the first power line and the first ground line being mutually adjacent, the core ring supplying power to circuits surrounded by the core ring, the method comprising:
calculating an antenna ratio of the first power line;
calculating an antenna ratio of the first ground line;
laying out at least one metal-oxide-semiconductor (MOS) capacitor unit below the core ring, the MOS capacitor unit having an active area disposed in the semiconductor substrate and an insulated gate electrode disposed on the semiconductor substrate, at least part of the insulated gate electrode being disposed above part of the active area;
laying out first contacts connecting the active area to one of the first power line and the first ground line, and;
laying out second contacts connecting the insulated gate electrode to another one of the first power line and the first ground line;
wherein laying out said second contacts includes
connecting the insulated gate electrode to the first power line if the antenna ratio of the first power line is greater than the antenna ratio of the first ground line; and
connecting the insulated gate electrode to the first ground line if the antenna ratio of the first ground line is greater than the antenna ratio of the first power line.
3. A method of laying out an integrated circuit having a semiconductor substrate and metal interconnecting lines disposed above the semiconductor substrate, the metal interconnecting lines including a core ring with a first power line and a first ground line and an input-output (I/O) ring with a second power line and a second ground line, the first power line and the first ground line being mutually adjacent, the second power line and the second ground line being mutually adjacent, the I/O ring and the core ring being mutually adjacent, the I/O ring surrounding the core ring, the core ring supplying power to circuits surrounded by the core ring, the I/O ring supplying power to I/O circuits disposed outside the core ring, the method comprising:
routing a plurality of the metal interconnecting lines from the circuits surrounded by the core ring to the I/O circuits, for use as I/O signal lines;
identifying a part of the core ring crossed by comparatively few of the I/O signal lines;
laying out a plurality of MOS units below said part of the core ring and below the I/O ring, each MOS unit having an active area disposed in the semiconductor substrate and an insulated gate electrode disposed on the semiconductor substrate, the active area underlying the first power line, the first around line, the second power line, and the second ground line, the insulated gate electrode paralleling the active area and having a plurality of branches overlying the active area; and
laying out contacts connecting the MOS units to the core ring and the I/O ring, the contacts causing at least a first one of the MOS units to function as a MOS capacitor connected to the core ring, and at least a second one of the MOS units to function as a protection transistor connected to both the core ring and the I/O ring.
4. A method of laying out an integrated circuit having a semiconductor substrate and metal interconnecting lines disposed above the semiconductor substrate, the metal interconnecting lines including a core ring with a first power line and a first ground line and an input-output (I/O) ring with a second power line and a second ground line, the first power line and the first ground line being mutually adjacent, the second power line and the second around line being mutually adjacent, the I/O ring and the core ring being mutually adjacent, the I/O ring surrounding the core ring, the core ring supplying power to circuits surrounded by the core ring, the I/O ring supplying power to I/O circuits disposed outside the core ring, the method comprising:
laying out a plurality of MOS units below the core ring and the I/O ring, each MOS unit having an active area disposed in the semiconductor substrate and an insulated electrode disposed on the semiconductor substrate, the active area underlying the first power line, the first ground line, the second power line, and the second ground line, the insulated gate electrode paralleling the active area and having a plurality of branches overlying the active area;
calculating an antenna ratio of the first power line;
calculating an antenna ratio of the first ground line; and
laying out contacts connecting the MOS units to the core ring and the I/O ring, the contacts causing at least a first one of the MOS units to function as a MOS capacitor connected to the core ring, and at least a second one of the MOS units to function as a protection transistor connected to both the core ring and the I/O ring;
wherein
if the antenna ratio of the first power line is greater than the antenna ratio of the first ground line, the contacts connect the insulated gate electrode of the first MOS unit to the first power line and connect the active area of the first one of the MOS units to the first ground line; and
if the antenna ratio of the first ground line is greater than the antenna ratio of the first power line, the contacts connect the insulated gate electrode of the first one of the MOS units to the first ground line and connect the active area of the first MOS unit to the first power line.