Granted Patent B2

US 7,985,524 · App. 10/765,146 · Granted Jul 26, 2011

Abstract

Claims (50)

1. An emulsion aggregation process for forming curable powder, comprising:

a) mixing curable resin particles comprising an epoxy resin and an aggregating agent in an aqueous dispersion, the aqueous dispersion comprising an anionic surfactant;

b) heating the dispersion to a temperature below the glass transition temperature of the resin to form aggregated particles;

c) heating the dispersion containing the aggregated particles to a temperature at or above the glass transition temperature of the resin to form coalesced particles in the dispersion;

d) adding at least one curing agent to the coalesced particles, the curing agent being selected from the group consisting of polyfunctional amines, dicyanodiamide, bisphenol A, bisphenol S, hydrogenated bisphenol, polyphenolics, imidazoles, beta-hydroxy-alkylamide, urethdione, and polyfunctional isocyanates, and

e) removing the coalesced particles from the dispersion to form a curable powder.

2. The process of claim 1 , wherein the epoxy resin is a polyfunctional epoxy resin.

3. The process of claim 1 , wherein during b) the curable resin particles are aggregated with at least one component selected from the group consisting of colorants, fillers, and leveling agents.

4. The process of claim 3 , wherein the colorant comprises at least one pigment.

5. The process of claim 1 , wherein, after removing the coalesced particles from the dispersion, the coalesced particles are dry-blended with at least one additional additive to form the curable powder.

6. The process of claim 5 , wherein the at least one additional additive is selected from the group consisting of surface additives, fluidity assisting additives, flow-promoting agents, flow-control agents, curing agents, fillers, and charge additives.

7. The process of claim 1 , wherein the aggregating agent is selected from the group consisting of calcium sulfate, barium sulfate, magnesium sulfate, polyaluminum chloride, dialkyl benzenealkyl ammonium chloride, lauryl trimethyl ammonium chloride, alkylbenzyl methyl ammonium chloride, alkyl benzyl dimethyl ammonium bromide, benzalkonium chloride, cetyl pyridinium bromide, C 12 , C 15 , C 17 trimethyl ammonium bromides, halide salts of quaternized polyoxyethylalkylamines and dodecylbenzyl triethyl ammonium chloride, beryllium chloride, beryllium bromide, beryllium iodide, beryllium acetate, beryllium sulfate, magnesium chloride, magnesium bromide, magnesium iodide, magnesium acetate, magnesium sulfate, calcium chloride, calcium bromide, calcium iodide, calcium acetate, calcium sulfate, strontium chloride, strontium bromide, strontium iodide, strontium acetate, strontium sulfate, barium chloride, barium bromide, barium iodide, acetates, acetoacetates, aluminum acetate, aluminum halides, and sulfates of vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, ruthenium, cobalt, nickel, copper, zinc, cadmium, and silver.

8. An emulsion aggregation process for forming curable powder, comprising:

a) mixing curable resin particles comprising an epoxy resin and at least one curing agent with an aggregating agent in an aqueous dispersion, the aqueous dispersion comprising an anionic surfactant, the curing agent being selected from the group consisting of polyfunctional amines, dicyanodiamide, bisphenol A, bisphenol S, hydrogenated bisphenol, polyphenolics, imidazoles, beta-hydroxy-alkylamide, urethdione and polyfunctional isocyanates;

b) heating the dispersion to a temperature below the glass transition temperature of the resin to form aggregated particles comprising the curable resin and the curing agent;

c) heating the dispersion containing the aggregated particles to a temperature at or above the glass transition temperature of the resin to form coalesced particles in the dispersion; and

d) removing the coalesced particles from the dispersion to form a curable powder.

9. The process of claim 1 , wherein the aggregating agent is selected from the group consisting of zinc acetate and polyaluminum chlorides.

10. A curable powder comprising powder particles formed by the process of claim 1 .

11. The powder of claim 10 , wherein the powder contains resin in an amount of at least about 50 percent by weight.

12. The powder of claim 10 , wherein the powder contains colorant in an amount of from about 1 to about 20 percent by weight.

13. The powder of claim 10 , wherein the powder has a geometric size distribution of about 1.10 to about 1.25.

14. The powder of claim 10 , wherein the powder comprises styrene-acrylate resin.

15. The powder of claim 10 , wherein the powder comprises at least one colorant selected from the group consisting of cyan colorants, magenta colorants, and yellow colorants.

16. The powder of claim 10 , comprising at least one polyfunctional epoxy resin.

17. A process for powder coating, comprising:

a) applying a powder according to claim 10 to a conductive surface or to a layer on said conductive surface; and

b) curing the powder.

18. The process of claim 17 , wherein said conductive surface is a metallic surface.

19. A process comprising:

applying a powder according to claim 10 over a conductive surface; and

curing the powder.

20. The process of claim 19 , wherein said conductive surface is a metallic surface.

21. The process of claim 19 , wherein the powder comprises at least one polyfunctional epoxy resin.

22. The process of claim 8 , wherein the aggregating agent is selected from the group consisting of calcium sulfate, barium sulfate, magnesium sulfate, polyaluminum chloride, dialkyl benzenealkyl ammonium chloride, lauryl trimethyl ammonium chloride, alkylbenzyl methyl ammonium chloride, alkyl benzyl dimethyl ammonium bromide, benzalkonium chloride, cetyl pyridinium bromide, C 12 , C 15 , C 17 trimethyl ammonium bromides, halide salts of quaternized polyoxyethylalkylamines and dodecylbenzyl triethyl ammonium chloride, beryllium chloride, beryllium bromide, beryllium iodide, beryllium acetate, beryllium sulfate, magnesium chloride, magnesium bromide, magnesium iodide, magnesium acetate, magnesium sulfate, calcium chloride, calcium bromide, calcium iodide, calcium acetate, calcium sulfate, strontium chloride, strontium bromide, strontium iodide, strontium acetate, strontium sulfate, barium chloride, barium bromide, barium iodide, acetates, acetoacetates, aluminum acetate, aluminum halides, and sulfates of vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, ruthenium, cobalt, nickel, copper, zinc, cadmium, and silver.

23. The process of claim 8 , wherein the epoxy resin is a polyfunctional epoxy resin.

24. The process of claim 8 , wherein during b) the curable resin particles are aggregated with the curing agent and at least one component selected from the group consisting of colorants, fillers, and leveling agents.

25. The process of claim 24 , wherein the colorant comprises at least one pigment.

26. The process of claim 8 , wherein the aggregating agent is selected from the group consisting of zinc acetate and polyaluminum chlorides.

27. A curable powder comprising powder particles formed by the process of claim 22 .

28. The powder of claim 27 , wherein the powder particles have a volume average diameter of less than or equal to about 30 microns.

29. The powder of claim 27 , comprising at least one polyfunctional epoxy resin.

30. A process comprising applying a powder according to claim 27 over a conductive surface; activating the curing agent to initiate curing the powder; and allowing the powder to cure.

31. The process of claim 30 , wherein said conductive surface is a metallic surface.

32. The process of claim 30 , wherein the powder comprises at least one polyfunctional epoxy resin.

33. A process for powder coating, comprising:

a) applying a powder according to claim 27 to a conductive surface or to a layer on said conductive surface;

b) activating the curing agent to initiate curing the powder; and

c) allowing the powder to cure.

34. The process of claim 33 , wherein said conductive surface is a metallic surface.

Assignments (12)