Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus
View Patent ↗The present invention provides an electronic circuit in which functional elements are formed on a first substrate, wiring lines are formed on a second substrate, element chips including at least one functional element are peeled from the first substrate and transferred onto the second substrate, and the second substrate is curved, a thin film transistor circuit substrate in which a thin film transistor is used as the functional element in the electronic circuit, and an active matrix display device in which the thin film transistor is used as an active matrix device in the thin film transistor circuit substrate. In cases where it is desirable to obtain a flexible electronic circuit substrate, a flexible thin film transistor circuit substrate, or a flexible active matrix display device by forming the second substrate or the wiring lines to be curved, the element chip is not peeled from the second substrate and is not split. The element chips are rectangular, and the short sides of the element chips are arranged along the curving direction of the second substrate.
1. A method of manufacturing element chips, comprising:
forming element chips including at least one of a plurality of thin film transistor circuits on a first substrate through a peel layer;
adhering a second flexible substrate onto the element chips through an adhesive layer;
transferring the element chips onto the second flexible substrate peeled from the first substrate, the element chips being rectangular; and
arranging short sides of the element chips along a curving direction of the second substrate.
2. An electronic apparatus, comprising:
element chips including at least one of a plurality of the electronic apparatus; and
the electronic apparatus including thin film transistor circuits manufactured by the method of manufacturing the element chips according to claim 1 .