IP Library Granted Patent US 6,987,415
Granted Patent B2
US 6,987,415 · App. 10/765,923 · Granted Jan 17, 2006

Semiconductor integrated circuit

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Quick Facts
Patent No.
US 6,987,415
App. No.
10/765,923
Granted
Jan 17, 2006
Kind
B2
Abstract

In order to provide a semiconductor IC unit such as a microprocessor, etc., which satisfies both fast operation and lower power consumption properties with its high quality kept, the semiconductor IC unit of the present invention is composed so as to include a main circuit (LOG) provided with transistors, which is formed on a semiconductor substrate, and a substrate bias controlling circuit (VBC) used for controlling a voltage to be applied to the substrate, and the main circuit includes switching transistors (MN 1 and MP 1 ) used for controlling a voltage to be applied to the substrate and control signals output from the substrate bias controlling circuit is entered to the gate of each of the switching transistors and the control signal is returned to the substrate bias controlling circuit.

Claims (29)

1. A semiconductor integrated circuit device comprising:

a logic circuit including a plurality of areas, each of the areas including at least a first MOS transistor of a first conductivity type;

a substrate bias control circuit to control a state of the logic circuit, an output impedance to drive a substrate bias voltage of the first MOS transistor in a first state being lower than the output impedance to drive the substrate bias voltage of the first MOS transistor in a second state;

first and second power supply lines to supply the logic circuit with the supply voltage;

a first substrate bias voltage supply line; and

a plurality of second MOS transistors of the first conductivity type, at least one of the second MOS transistors being provided to the plural areas;

wherein the control circuit controls the logic circuit to be in the first state when a supply voltage of the logic circuit is activated,

wherein a source of the first MOS transistors is connected to the first power supply line, a drain of the first MOS transistor is connected to the second power supply line and the substrate bias voltage of the first MOS transistor is supplied via the first substrate bias voltage supply line,

wherein a source-drain path of each of the second MOS transistors are provided between the first power supply line and the first substrate bias voltage supply line, and

wherein the plurality of the second MOS transistors are controlled to be ON state when the logic circuit is in the first state.

2. The semiconductor integrated circuit device according to claim 1 ,

wherein the substrate bias control circuit includes a power-on resetting circuit to generate a reset signal in accordance with the supply voltage of the logic circuit, and

wherein the control circuit controls the logic circuit to be in the first state in response to the reset signal.

3. The semiconductor integrated circuit device according to claim 1 ,

wherein when the logic circuit is in the first state, an absolute value of a threshold voltage of the first MOS transistor is a first value by controlling the substrate voltage, and

wherein when the logic circuit is in the second state, the absolute value of the threshold voltage of the first MOS transistor is a second value higher than the first value by controlling the substrate voltage.

4. The semiconductor integrated circuit device according to claim 1 , further comprising:

a second substrate bias voltage supply line;

a plurality of fourth MOS transistors of a second conductivity type, at least one of the fourth MOS transistors being provided to the plural areas;

wherein each of the areas includes at least a third MOS transistor of the second conductivity type,

wherein a source of the third MOS transistor is connected to the second power supply line, a drain of the third MOS transistor is connected to the first power supply line and the substrate bias voltage of the third MOS transistor is supplied via the second substrate bias voltage supply line;

wherein a source-drain path of each of the fourth MOS transistor is provided between the second power supply line and the second substrate bias voltage supply line; and

wherein the plurality of the fourth MOS transistors are controlled to be ON state when the logic circuit is in the first state.

5. The semiconductor integrated circuit device according to claim 1 , further comprising:

a first substrate bias voltage generator to generate a first voltage;

wherein when the logic circuit is in the second state, the plurality of the second MOS transistors are controlled to be OFF state and the first voltage is supplied to the first MOS transistors via the first substrate bias voltage supply line from the first substrate bias voltage generator.

6. The semiconductor integrated circuit device according to claim 4 , further comprising:

a second substrate bias voltage generator to generate a second voltage;

wherein when the logic circuit is in the second state, the plurality of the fourth MOS transistors are controlled to be OFF state and the second voltage is supplied to the third MOS transistors via the second substrate bias voltage supply line from the second substrate bias voltage generator.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 053654 FRAME: 0254. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED ON REEL 052853 FRAME 0153. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC; INNOVATIVE DISPLAY TECHNOLOGIES LLC; LIFEPORT SCIENCES LLC; LIMESTONE MEMORY SYSTEMS LLC; MOBILE ENHANCEMENT SOLUTIONS LLC; MONARCH NETWORKING SOLUTIONS LLC; NEXUS DISPLAY TECHNOLOGIES LLC; PARTHENON UNIFIED MEMORY ARCHITECTURE LLC; R2 SOLUTIONS LLC; SAINT LAWRENCE COMMUNICATIONS LLC; STINGRAY IP SOLUTIONS LLC; SUPER INTERCONNECT TECHNOLOGIES LLC; TELECONFERENCE SYSTEMS LLC; UNIFICATION TECHNOLOGIES LLC
Reel/Frame 053654/0254 →
PATENT SECURITY AGREEMENT Recorded Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC; INNOVATIVE DISPLAY TECHNOLOGIES LLC; LIFEPORT SCIENCES LLC; LIMESTONE MEMORY SYSTEMS LLC; MERTON ACQUISITION HOLDCO LLC; MOBILE ENHANCEMENT SOLUTIONS LLC; MONARCH NETWORKING SOLUTIONS LLC; NEXUS DISPLAY TECHNOLOGIES LLC; PARTHENON UNIFIED MEMORY ARCHITECTURE LLC; R2 SOLUTIONS LLC; SAINT LAWRENCE COMMUNICATIONS LLC; STINGRAY IP SOLUTIONS LLC; SUPER INTERCONNECT TECHNOLOGIES LLC; TELECONFERENCE SYSTEMS LLC; UNIFICATION TECHNOLOGIES LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
MERGER Recorded Aug 26, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024892/0272 →