IP Library Granted Patent US 7,120,177
Granted Patent B2
US 7,120,177 · App. 10/766,808 · Granted Oct 10, 2006

Laser element, method of producing the laser element, and a laser module employing the laser element

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Quick Facts
Patent No.
US 7,120,177
App. No.
10/766,808
Granted
Oct 10, 2006
Kind
B2
Abstract

In a method for producing a laser element, a brazing material is placed between a nitride-based semiconductor laser bar and a fixation surface of a heat sink, where the brazing material contains gold and one of tin and silicon as main components, the nitride-based semiconductor laser bar has at least three light-emission points formed on a substrate, the heat sink is made of copper or copper alloy, and the fixation surface has a predetermined shape. Then, the nitride-based semiconductor laser bar is fixed to the fixation surface of the heat sink by melting and solidifying the brazing material while pressing the nitride-based semiconductor laser bar toward the heat sink with a tool having a shape corresponding to the predetermined shape of the fixation surface.

Claims (15)

1. A laser element comprising:

a heat sink which is comprised of one of copper and copper alloy, and which comprises a fixation surface having a predetermined shape; and

a nitride-based semiconductor laser bar which comprises a top surface and at least three light-emission points formed on a substrate,

wherein the nitride-based semiconductor laser bar is bonded to said heat sink with a brazing material comprising gold and one of tin and silicon as main components, by pressing the whole top surface of the nitride-based semiconductor laser bar toward said fixation surface with a tool having a shape corresponding to the predetermined shape of the fixation surfaces, during a brazing operation.

2. A laser module comprising:

an optical fiber;

a laser element which comprises:

a heat sink which is comprised of one of copper and copper alloy, and which comprises a fixation surface having a predetermined shape; and

a nitride-based semiconductor laser bar which comprises a top surface and at least three light-emission points formed on a substrate, wherein the nitride-based semiconductor laser bar emits laser beams from the at least three light-emission points, and is bonded to said heat sink with a brazing material comprising gold and one of tin and silicon as main components, by pressing the whole top surface of the nitride-based semiconductor laser bar toward said fixation surface with a tool having a shape corresponding to the predetermined shape of the fixation surfaces, during a brazing operation; and

an optical condensing system which optically multiplexes said laser beams, and directs the optically multiplexed laser beams into said optical fiber.

3. The laser element according to claim 1 , wherein the fixation surface has a predetermined area; and

wherein the tool has an area corresponding to the predetermined area of the fixation surface.

4. The laser element according to claim 1 , wherein the nitride-based semiconductor laser bar is bonded to said heat sink with the brazing material, by pressing the nitride-based semiconductor laser bar, with the tool, on substantially an entire area of a surface of the nitride-based semiconductor laser bar, during the brazing operation.

5. The laser element according to claim 1 , wherein a length of the tool is approximately equal to a longitudinal size of the nitride-based semiconductor laser bar.

6. The laser element according to claim 1 , wherein the nitride-based semiconductor laser bar comprises a plurality of semiconductor layers formed on the substrate so as to realize the at least three light-emission points.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2014
From: FUJIFILM CORPORATION
To: ADTEC ENGINEERING CO., LTD.
Reel/Frame 032163/0521 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2004
From: YAMANAKA, FUSAO; KURAMACHI, TERUHIKO
To: FUJI PHOTO FILM CO., LTD.
Reel/Frame 014944/0814 →