Inkjet printhead with CMOS drive circuitry close to ink supply passage
View Patent ↗An inkjet printhead with nozzles 4 and liquid passages 31, 32 leading to each nozzle. The nozzles, ejection actuators 14 , associated drive circuitry 22 and liquid passage 31, 32 being formed on and through a wafer 21 using lithographically masked etching technique, such that the wafer has a droplet ejection side and a liquid supply side. Each of the liquid passage is formed by etching a hole 31 partially through the wafer 21 from the droplet ejection side, and etching a passage from the liquid supply side of the wafer 21 to the hole 31 . Etching a hole 31 into the wafer 21 from the droplet ejection side means the ink supply passage 32 can stop short of the interface between the dielectric 23 and the wafer 21 to prevent the etchant from tracking sideways and damaging the drive circuitry 22 . As the inlet hole 31 is relatively shallow, the removal of the resist is not overly difficult. This allows the distance between the drive circuitry 22 and the inlet hole 31 to be reduced to less than 20 microns. This permits a more compact overall design and higher nozzle packing density.
1. An inkjet printhead comprising:
a wafer providing a supporting substrate, the wafer having a drop ejection side and a liquid supply side;
a plurality of nozzles, each nozzle having a liquid passage leading to it from the liquid supply side of the wafer for providing ejectable liquid to the nozzle;
drop ejection actuators and associated drive circuitry corresponding to each nozzle respectively;
the nozzles, ejection actuators, associated drive circuitry and liquid passage being formed on and through the wafer using lithographically masked etching techniques; wherein,
the liquid passage is partially etched from the drop ejection side such that the distance between the drive circuitry and the passage is less than 20 microns.
2. An inkjet printhead according to claim 1 wherein the distance between the drive circuitry and the liquid passage is less than 10 microns.
3. An inkjet printhead according to claim 1 wherein the distance between the drive circuitry and the liquid passage is less than 5 microns.
4. An inkjet printhead according to claim 1 wherein the width of the liquid passage is greater than 10 microns and less than 28 microns.
5. An inkjet printhead according to claim 1 wherein the drop ejection actuators are thermal bend actuators.
6. An inkjet printhead according to claim 1 wherein the drop ejection actuators are gas bubble generating heater elements.
7. An inkjet printhead according to claim 6 further including a plurality of nozzle chambers, each nozzle chamber corresponding to a respective nozzle; wherein,
at least one the of the gas bubble generating heater elements are disposed in each of the nozzle chambers respectively, such that,
a bubble forming liquid can be supplied to the nozzle chamber for thermal contact with at least one of the bubble generating heater elements so that a bubble of the bubble forming liquid generated by one of the heater elements causes a droplet of the ejectable liquid to be ejected from the nozzle.
8. An inkjet printhead according to claim 7 wherein the bubble forming liquid is the same as the ejected liquid.
9. An inkjet printhead according to claim 1 wherein the printhead is a pagewidth printhead.
10. A method of ejecting drops of an ejectable liquid from an inkjet printhead, the printhead comprising a wafer providing a supporting substrate, the wafer having a drop ejection side and a liquid supply side, a plurality of nozzles, each nozzle having a liquid passage leading to it from the liquid supply side of the wafer for providing ejectable liquid to the nozzle, drop ejection actuators and associated drive circuitry corresponding to each nozzle respectively, the nozzles, ejection actuators, associated drive circuitry and liquid passage being formed on and through the wafer using lithographically masked etching techniques; wherein,
the liquid passage is partially etched from the drop ejection side such that the distance between the drive circuitry and the passage is less than 20 microns; the method of ejecting drops comprising the steps of:
providing the ejectable liquid to each of the nozzles using the associated liquid passage; and
actuating the drop ejection actuator to eject drops of the ejectable liquid from the nozzle.
11. A method according to claim 10 wherein the distance between the drive circuitry and the liquid passage is less than 10 microns.
12. A method according to claim 10 wherein the distance between the drive circuitry and the liquid passage is less than 5 microns.
13. A method according to claim 10 wherein the width of the liquid passage is greater than 10 microns and less than 28 microns.
14. A method according to claim 10 wherein the drop ejection actuators are thermal bend actuators.
15. A method according to claim 10 wherein the droplet ejection actuators are gas bubble generating heater elements.
16. A method according to claim 15 further including a plurality of nozzle chambers, each nozzle chamber corresponding to a respective nozzle; wherein,
at least one the of the gas bubble generating heater elements are disposed in each of the nozzle chambers respectively; such that,
a bubble forming liquid can be supplied to the nozzle chamber for thermal contact with at least one of the bubble generating heater elements so that a bubble of the bubble forming liquid generated by one of the heater elements causes a drop of the ejectable liquid to be ejected from the nozzle.
17. A method according to claim 16 wherein the bubble forming liquid is the same as the ejected liquid.
18. A method according to claim 10 wherein the printhead is a pagewidth printhead.
19. A printer system incorporating an inkjet printhead comprising:
a wafer providing a supporting substrate, the wafer having a drop ejection side and a liquid supply side;
a plurality of nozzles, each nozzle having a liquid passage leading to it from the liquid supply side of the wafer for providing ejectable liquid to the nozzle;
drop ejection actuators and associated drive circuitry corresponding to each nozzle respectively;
the nozzles, ejection actuators, associated drive circuitry and liquid passage being formed on and through the wafer using lithographically masked etching techniques; wherein,
the liquid passage is partially etched from the drop ejection side such that the distance between the drive circuitry and the passage is less than 20 microns.
20. A printer system according to claim 19 wherein the distance between the drive circuitry and the liquid passage is less than 10 microns.
21. A printer system according to claim 19 wherein the distance between the drive circuitry and the liquid passage is less than 5 microns.
22. A printer system according to claim 19 wherein the width of the liquid passage is greater than 10 microns and less than 28 microns.
23. A printer system according to claim 19 wherein the droplet ejection actuators are thermal bend actuators.
24. A printer system according to claim 19 wherein the droplet ejection actuators are gas bubble generating heater elements.
25. A printer system according to claim 24 further including a plurality of nozzle chambers, each nozzle chamber corresponding to a respective nozzle; wherein,
at least one the of the gas bubble generating heater elements are disposed in each of the nozzle chambers respectively; such that,
a bubble forming liquid can be supplied to the nozzle chamber for thermal contact with at least one of the bubble generating heater elements so that a bubble of the bubble forming liquid generated by one of the heater elements causes a drop of the ejectable liquid to be ejected from the nozzle.
26. A printer system according to claim 25 wherein the bubble forming liquid is the same as the ejected liquid.
27. A printer system according to claim 19 wherein the printhead is a pagewidth printhead.