IP Library Granted Patent US 6,976,854
Granted Patent B2
US 6,976,854 · App. 10/773,964 · Granted Dec 20, 2005

Arrangement for connecting the terminal contacts of an electronic component to a printed circuit board and conductor support for such an arrangement

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Quick Facts
Patent No.
US 6,976,854
App. No.
10/773,964
Granted
Dec 20, 2005
Kind
B2
Abstract

An arrangement for connecting the terminal contacts of an electronic component to electrical contacts formed on a printed circuit board. An at least partly flexible conductor support having a plurality of interconnects provides an electrical connection between the terminal contacts of the electronic component and the electrical contacts of the printed circuit board such that a portion of the conductor support that is connected to the printed circuit board is arranged on an end face of the printed circuit board and extends perpendicularly in relation to the upper and lower surfaces of the printed circuit board. Furthermore, a conductor support formed with relatively narrow middle portion is provided to facilitate such an arrangement.

Claims (32)

1. An arrangement comprising:

an electronic component with terminal contacts,

a printed circuit board with electrical contacts that are formed on a surface of the printed circuit board and extend toward an end face of the printed circuit board, and

an at least partly flexible conductor support with a plurality of interconnects, the conductor support providing an electrical connection between the terminal contacts of the electronic component and the electrical contacts of the printed circuit board, wherein a portion of the conductor support extends next to and adjacent to the end face of the printed circuit board and extends perpendicularly in relation to the surface of the printed circuit board, and wherein said portion is connected to the electrical contacts of the printed circuit board wherein the electrical contacts formed on the printed circuit board include a first electrical contact formed on a surface of the printed circuit board at an end of the end face, and wherein the portion of the conductor support is connected to the electrical contact by way of a solder structure.

2. The arrangement as claimed in claim 1 , the flexible conductor support comprising a flexible conductor.

3. The arrangement as claimed in claim 1 , the electrical components being an optoelectronic component comprising at least one of a light-generating element and a light-receiving element.

4. The arrangement as claimed in claim 1 ,

wherein the electrical contacts formed on the printed circuit board include a first electrical contact formed on a first surface of the printed circuit board at a first end of the end face, and a second electrical contact formed on a second surface of the printed circuit board at a second end of the end face, and

wherein the portion of the conductor support is connected to both the first and second electrical contacts by way of first and second solder structures, respectively.

5. The arrangement as claimed in claim 1 , wherein the conductor support includes a first portion with first contact regions for the connection to associated electrical contacts of the printed circuit board and a second portion with second contact regions for the electrical connection to the terminal contacts of the electronic component, and the first contact regions being in connection with electrical contacts of the printed circuit board, which on the surface of the printed circuit board are led up to the end face and are adjacent to the latter.

6. The arrangement as claimed in claim 5 , wherein the conductor support is bent approximately 180° between the first portion and the second portion.

7. The arrangement as claimed in claim 1 , the printed circuit board having adjusting structures and the conductor support having adjusting structures corresponding to them in the portion that is connected to the printed circuit board.

8. The arrangement as claimed in claim 7 , the printed circuit board having at least one projection on the end face.

9. The arrangement as claimed in claim 7 , the conductor support having in the portion that is connected to the printed circuit board at least one clearance corresponding to a projection of the printed circuit board.

10. An arrangement comprising:

an electronic component including a terminal contact;

a printed circuit board having parallel upper and lower surfaces, and a peripheral edge extending between the upper and lower surfaces, the printed circuit board also including an electrical contact formed on one of the upper and lower surfaces; and

an at least partially flexible conductor support including an elongated conductor having a first contact region connected to the electrical contact formed on the printed circuit board, and a second contact region connected to the terminal contact of the electronic component,

wherein a first portion of the conductor support including the first contact region abuts the peripheral edge of the printed circuit board and extends perpendicular to the upper and lower surfaces wherein the electrical contacts formed on the printed circuit board include a first electrical contact formed on a surface of the printed circuit board at an end of the end face, and wherein the first portion of the conductor support is connected to the electrical contact by way of a solder structure.

11. The arrangement as claimed in claim 10 ,

wherein the electrical contacts formed on the printed circuit board include a first electrical contact formed on the upper surface of the printed circuit board, and a second electrical contact formed on the lower surface of the printed circuit board, and

wherein the first portion of the conductor support is connected to both the first and second electrical contacts by way of first and second solder structures, respectively.

12. The arrangement according to claim 10 , wherein the conductor support further comprises:

a second portion including second contact region connected to the electronic component; and

a third portion extending between the first and second portions,

wherein the first and second portions define parallel planes.

13. The arrangement according to claim 12 , wherein the third portion is bent approximately 180°.

14. An arrangement comprising:

an electronic component with terminal contacts,

a printed circuit board with electrical contacts, and

an at least partly flexible conductor support with a plurality of interconnects, the conductor support providing an electrical connection between the terminal contacts of the optoelectronic component and the electrical contacts of the printed circuit board, wherein a portion of the conductor support that is connected to the printed circuit board is arranged on an end face of the printed circuit board and extends perpendicularly in relation to the surface of the printed circuit board,

the first portion of the conductor support having two rows of first contact regions, the contact regions of the first row being connected to electrical contacts on the one surface of the printed circuit board and the contact regions of the second row being connected to electrical contacts on the other surface of the printed circuit board.

Assignments (6)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2006
From: INFINEON TECHNOLOGIES AG
To: FINISAR CORPORATION
Reel/Frame 017425/0874 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2004
From: STOCKHAUS, ANDREAS; CARSTENS, CHRISTIAN
To: INFINEON TECHNOLOGIES AG
Reel/Frame 014982/0664 →