IP Library Granted Patent US 7,104,419
Granted Patent B2
US 7,104,419 · App. 10/776,043 · Granted Sep 12, 2006

Dispenser package arrangement; and, methods

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Quick Facts
Patent No.
US 7,104,419
App. No.
10/776,043
Granted
Sep 12, 2006
Kind
B2
Abstract

A package arrangement is provided. The package arrangement in general includes a blister pack having a backing construction secured thereto. In preferred arrangements, a removable header is provided. The backing construction preferably includes a flexible film having resealable pressure sensitive adhesive on a side thereof, by which the backing portion is secured to the blister pack. A portion of the backing construction is formed as a hinged cover portion, by two cuts, preferably parallel, extending through the backing construction portion and overlapping a selected section of the blister pack. In a preferred arrangement, each cut terminates at a stop structure.

Claims (47)

1. A package arrangement comprising:

(a) a receptacle having an outer peripheral rim thereon, the receptacle defining a cavity enclosed on all sides except an open side; and,

(b) a backing construction secured to the outer peripheral rim and in covering relation to the open side of the receptacle;

(i) the backing construction comprising a flexible film having a resealable pressure sensitive adhesive on a first side thereof by which the backing portion is secured to the outer peripheral rim; and

(ii) the backing construction including an openable and reclosable hinged cover portion therein; said hinged cover portion comprising a portion bordered along opposite side edges by cuts through the flexible film of the backing construction.

2. A package arrangement according to claim 1 wherein:

(a) said receptacle includes a transparent material.

3. A package arrangement according to claim 1 including:

(a) a removable reinforced header portion comprising a rigid piece secured to said flexible film of said backing construction, in extension beyond a front edge of said outer peripheral rim.

4. A package arrangement according to claim 3 wherein:

(a) said rigid piece of said header is secured to pressure sensitive adhesive on said first side of said flexible film.

5. A package arrangement according to claim 4 including:

(a) an area of covered adhesive that is not tacky on said first side of said flexible film of said backing construction in covering relation to said receptacle.

6. A package arrangement according to claim 5 wherein:

(a) the area of covered adhesive comprises a deadening film.

7. A package arrangement according to claim 3 wherein:

(a) said backing construction is rectangular.

8. A package arrangement according to claim 7 wherein:

(a) said backing construction includes opposite side edges each of which includes a v-notch therein positioned between said outer peripheral rim and said header.

9. A package arrangement according to claim 8 wherein:

(a) said first and second cuts in said backing construction each terminate in a curved stop.

10. A package arrangement according to claim 1 wherein:

(a) said receptacle comprises material about 7 to 15 mils thick.

11. A package arrangement according to claim 9 wherein:

(a) each curved stop comprises a circle.

12. A package arrangement according to claim 9 wherein:

(a) prior to removal of said header, said backing construction has a perimeter definition no greater than 2 inches by 4 inches.

13. A package arrangement according to claim 12 wherein:

(a) after removal of said header, said remaining portion of said backing construction has a perimeter area no greater than 2 inches by 3.25 inches.

14. A package arrangement according to claim 13 wherein:

(a) after removal of said header, the remaining package includes a tab projecting peripherally beyond a front edge of said outer peripheral rim;

(i) said tab comprising a portion of said flexible film of said backing construction.

15. A package arrangement according to claim 14 wherein:

(a) said tab including a deadening, reinforcing piece secured to said first side by pressure sensitive adhesive.

16. A package according to claim 3 including:

(a) a tamper evident seal strip secured in position over a joint between said header portion and said outer peripheral rim on said receptacle.

17. A method of manufacturing a package arrangement; said method including steps of:

(a) forming plastic material to provide a receptacle having an outer perimeter rim thereon;

(b) securing a backing construction to the outer peripheral rim in covering relation to the receptacle, wherein;

(i) the backing construction comprises a flexible film having a resealable pressure sensitive adhesive on a first side thereof by which the backing portion is secured to the outer peripheral rim; and

(ii) the backing construction includes an openable and reclosable hinged cover portion therein; said hinged cover portion comprising a portion bordered along opposite side edges by cuts through the flexible film of the backing construction.

18. The method according to claim 17 further including the step of:

(a) providing a removable reinforced header portion comprising a rigid piece to said flexible film of said backing construction, in extension beyond a front edge of said outer peripheral rim.

19. The method according to claim 17 wherein:

(a) the step of forming plastic material to provide a receptacle includes the step of thermoforming.

20. The method according to claim 17 wherein:

(a) the step of forming plastic material to provide a receptacle includes the step of vacuum forming.