Method and apparatus for polishing a workpiece
View Patent ↗A carrier has openings for holding workpieces during polishing. Upper and lower polishing pads push against upper and lower surfaces of the workpieces, respectively. A ring is provided within the openings. This ring surrounds the workpieces, and prevents or reduces roll-off.
1. Structure comprising:
a generally planar workpiece carrier comprising at least one opening for holding a generally disk-shaped workpiece; and
a ring movably placed within said at least one opening, said ring having a top surface, a bottom surface, and a discontinuity extending from said top surface through said bottom surface for adjusting the diameter of said ring.
2. Structure of claim 1 wherein said ring is rotatable within said opening.
3. Structure of claim 1 further comprising a workpiece within said opening and surrounded by said ring, wherein said workpiece can rotate with respect to said carrier.
4. Structure of claim 3 wherein said carrier is within polishing apparatus, said polishing apparatus comprising one or more pads for polishing said workpiece, said ring having a thickness such that said ring prevents or reduces roll-off in said workpiece.
5. Structure of claim 1 wherein said workpiece comprises a centrally defined opening therein, said structure further comprising a member inserted into said centrally defined opening.
6. Structure of claim 1 wherein said workpiece is rotatable with respect to said ring.
7. A combination of a workpiece and apparatus, wherein said workpiece has an opening therein and said apparatus comprises:
a generally planar workpiece carrier comprising at least one opening for holding said workpiece;
a member inserted into said opening of said workpiece; and
at least one polishing pad for polishing at least one surface of said workpiece, said polishing pad extending over said workpiece, said opening of said workpiece and said member, and wherein said member prevents or reduces roll-off in said workpiece near the opening of said workpiece when said workpiece is being polished by said polishing pad.
8. Combination of claim 7 wherein said member comprises either a disk or a first ring, said combination further comprising a second ring within the opening of said carrier and surrounding said workpiece.
9. A combination of a workpiece and apparatus, wherein said workpiece has an opening therein and said apparatus comprises:
a generally planar workpiece carrier comprising at least one opening for holding said workpiece;
a member inserted into said opening of said workpiece; and
at least one polishing pad for polishing at least one surface of said workpiece, said pad extending over said opening of said workpiece, said workpiece and said member,
wherein said member prevents or reduces roll-off near the opening of said workpiece.
10. Method comprising:
providing a structure comprising a generally planar workpiece carrier comprising at least one opening:
providing a ring within said at least one opening, said ring having a top surface, a bottom surface and a discontinuity extending from said top surface through said bottom surface for adjusting the diameter of said ring;
placing a generally disk-shaped workpiece within said ring, said workpiece being rotatable within said opening; and
polishing said workpiece by applying at least one polishing pad surface against said workpiece.
11. Method of claim 10 wherein said workpiece can rotate during polishing.
12. Method of claim 10 wherein said ring prevents or reduces roll-off in said workpiece during polishing.
13. Method of claim 10 wherein said polishing comprises applying two generally planar polishing pads against upper and lower surfaces of said workpiece, and applying a polishing slurry between said pads and said workpiece during polishing.
14. Method of claim 10 wherein said workpiece comprises a centrally defined opening therein, said structure further comprising a member inserted into said centrally defined opening.
15. Method of claim 10 wherein said workpiece is rotatable with respect to said ring.
16. Method comprising:
providing a structure comprising a generally planar workpiece carrier comprising at least one opening;
placing a generally disk-shaped workpiece within said opening of said carrier, said workpiece having an opening therein;
providing a member within said opening of said workpiece; and
polishing said workpiece by applying at least one polishing pad against said workpiece, wherein said workpiece carrier, member and polishing pad act as at least a portion of polishing apparatus, said polishing pad extending over said workpiece, said opening of said workpiece and said member during at least part of said act of polishing, and wherein said member prevents or reduces roll-off in said workpiece near the opening of said workpiece when said workpiece is being polished by said polishing pad.
17. Method of claim 16 wherein said member comprises either a first ring or a disk within the opening of said workpiece, said method further comprising providing a second ring between said workpiece and said carrier, said second ring preventing or reducing roll-off in said workpiece during polishing.
18. Method comprising:
providing a structure comprising a generally planar workpiece carrier comprising at least one opening;
placing a generally disk-shaped workpiece within said opening of said carrier, said workpiece having an opening therein;
providing a member within said opening of said workpiece; and
polishing said workpiece by applying at least one polishing pad against said workpiece, wherein said workpiece carrier, member and polishing pad act as at least a portion of polishing apparatus, wherein said member prevents or reduces roll-off of said workpiece near said opening of said workpiece, said pad extending over said opening of said workpiece, said workpiece and said member.
19. Structure comprising:
a generally planar workpiece carrier comprising at least one opening for holding a generally disk-shaped workpiece; and
a ring movably placed within said at least one opening, said ring having a break therein, wherein the material of said ring on one side of said break is not rigidly affixed to the material of said ring on the other side of said break, wherein said workpiece is rotatable with respect to said opening.
20. Structure of claim 19 wherein said break comprises a gap in said ring.
21. Structure of claim 19 wherein material of said ring on one side of said break contacts the material of said ring on the other side of said break.
22. Method comprising:
providing a structure comprising a generally planar workpiece carrier comprising at least one opening:
providing a ring within said at least one opening, said ring having a break therein;
placing a generally disk-shaped workpiece within said ring; and
polishing said workpiece by applying at least one polishing pad surface against said workpiece, wherein material of said ring on one side of said break is not rigidly affixed to the material of said ring on the other side of said break, wherein said workpiece is rotatable with respect to said opening.
23. Method of claim 22 wherein said break comprises a gap in said ring.
24. Method of claim 22 wherein the material of said ring on one side of said break contacts the material of said ring on the other side of said break.