IP Library Granted Patent US 6,949,766
Granted Patent B2
US 6,949,766 · App. 10/778,040 · Granted Sep 27, 2005

Method of deforming a pattern and semiconductor device formed by utilizing deformed pattern

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Quick Facts
Patent No.
US 6,949,766
App. No.
10/778,040
Granted
Sep 27, 2005
Kind
B2
Abstract

A method of deforming a pattern comprising the steps of: forming, over a substrate, a layered-structure with an upper surface including at least one selected region and at least a re-flow stopper groove, wherein the re-flow stopper groove extends outside the selected region and separate from the selected region; selectively forming at least one pattern on the selected region; and causing a re-flow of the pattern, wherein a part of an outwardly re-flowed pattern is flowed into the re-flow stopper groove, and then an outward re-flow of the pattern is restricted by the re-flow stopper groove extending outside of the pattern, thereby to form a deformed pattern with at least an outside edge part defined by an outside edge of the re-flow stopper groove.

Claims (10)

1. A semiconductor device, comprising:

a gate electrode structure which comprises a gate electrode and a U-shaped dummy gate electrode substantially coplanar with said gate electrode,

wherein said dummy gate electrode is separated by a gap from said gate electrode and positioned outside of said gate electrode.

2. The semiconductor device as claimed in claim 1 , wherein said dummy gate electrode surrounds a majority of said gate electrode.

3. The semiconductor device as claimed in claim 1 , wherein said dummy gate electrode surrounds said gate electrode completely.

4. The semiconductor device as claimed in claim 1 , wherein said semiconductor device further includes a multi-layer structure comprising plural laminated layers which extend over said gate electrode structure, and surfaces of said plural laminated layers have grooves corresponding to said gap.

5. A semiconductor device, comprising:

a gate electrode structure which includes a gate electrode and a dummy gate electrode,

wherein said dummy gate electrode is separated by a gap from said gate electrode and positioned outside of said gate electrode, and

wherein said gate electrode is substantially circular with one flat side, said dummy gate electrode extends adjacent to and parallel to said flat side of said gate electrode.

Assignments (7)
SECURITY INTEREST Recorded Jul 14, 2022
From: VISTA PEAK VENTURES, LLC
To: GETNER FOUNDATION LLC
Reel/Frame 060654/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2018
From: GETNER FOUNDATION LLC
To: VISTA PEAK VENTURES, LLC
Reel/Frame 045469/0023 →
CONFIRMATORY ASSIGNMENT Recorded Aug 9, 2012
From: NEC CORPORATION
To: NEC LCD TECHNOLOGIES, LTD.
Reel/Frame 028768/0750 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2012
From: NEC CORPORATION
To: NEC LCD TECHNOLOGIES, LTD.
Reel/Frame 027923/0631 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2011
From: KIDO, SHUSAKU
To: NEC CORPORATION
Reel/Frame 026354/0310 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2011
From: NEC CORPORATION
To: GETNER FOUNDATION LLC
Reel/Frame 026254/0381 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2010
From: NEC LCD TECHNOLOGIES, LTD.
To: NEC CORPORATION
Reel/Frame 024492/0176 →