Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
View Patent ↗To easily determine an orientation of a semiconductor device, a semiconductor device includes a substrate including electrode electrically connected to an integrated circuit, an external terminal electrically connected to the electrode, and a light transmissive insulation layer provided on the external terminal side of the substrate, and a mark provided on the substrate and covered by the insulation layer and recognizable through the insulation layer.
1. A semiconductor device, comprising:
a substrate including an electrode electrically connected to at least one integrated circuit;
a resin layer formed on the side of the substrate where the electrode is formed, avoiding the location of the electrode;
an interconnection layer extending from the electrode to an upper surface of the resin layer and including at least one land formed on the resin layer;
an external terminal being provided on the land and electrically connected to the electrode;
a light transmissive insulation layer disposed on the external terminal side of the substrate, the insulation layer being formed to cover the interconnection layer with at least a part of the external terminal exposed; and
a mark provided on the substrate and covered by the light transmissive insulation layer so as to be visible through the insulation layer,
wherein the substrate is a semiconductor substrate, and the integrated circuit is formed on the semiconductor substrate.
2. The semiconductor device according to claim 1 , the mark being provided on the resin layer.
3. The semiconductor device according to claim 1 , further comprising:
a passivation film provided on the semiconductor substrate,
the mark being provided on the passivation film.
4. The semiconductor device according to claim 1 , the mark being made of the same material as at least a part of the material which the interconnection layer is made of.
5. The semiconductor device according to claim 1 , the mark being provided on an area not in contact with the interconnection layer.
6. The semiconductor device according to claim 1 , the interconnection layer having a plurality of lands including a first land having a shape incorporating the mark and a second land having a shape different from the shape of the first land.
7. The semiconductor device according to claim 1 , the external terminal being a solder ball, and the insulation layer being a solder resist.
8. The semiconductor device according to claim 1 , the semiconductor substrate being a semiconductor wafer including the integrated circuit for each of plural areas.
9. The semiconductor device according to claim 1 , the semiconductor substrate being a semiconductor chip.
10. The semiconductor device according to claim 9 , the mark being provided on at least one of the four corners of the semiconductor chip.
11. A circuit board, comprising a semiconductor device, the semiconductor device, comprising:
a substrate including an electrode electrically connected to at least one integrated circuit;
a resin layer formed on the side of the substrate where the electrode is formed, avoiding the location of the electrode;
an interconnection layer extending from the electrode to an upper surface of the resin layer and including at least one land formed on the resin layer;
an external terminal being provided on the land and electrically connected to the electrode;
a light transmissive insulation layer disposed on the external terminal side of the substrate, the insulation layer being formed to cover the interconnection layer with at least a part of the external terminal exposed; and
a mark provided on the substrate and covered by the light transmissive insulation layer so as to be visible through the insulation layer.
12. An electronic apparatus, comprising a circuit board according to claim 11 .
13. A method of mounting a semiconductor device, comprising a substrate including an electrode electrically connected to at least one integrated circuit; a resin layer formed on the side of the substrate where the electrode is formed, avoiding the location of the electrode; an interconnection layer extending from the electrode to an upper surface of the resin layer and including at least one land formed on the resin layer; an external terminal being provided on the land and electrically connected to the electrode; a light transmissive insulation layer disposed on the external terminal side of the substrate, the insulation layer being formed to cover the interconnection layer with at least a part of the external terminal exposed; and a mark provided on the substrate and covered by the light transmissive insulation layer so as to be visible through the insulation layer, onto a circuit board, the method comprising:
determining a mounting orientation of the semiconductor device by recognizing the mark through the insulation layer.