IP Library Granted Patent US 7,484,887
Granted Patent B2
US 7,484,887 · App. 10/783,491 · Granted Feb 3, 2009

Digitally modified resistive output for a temperature sensor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,484,887
App. No.
10/783,491
Granted
Feb 3, 2009
Kind
B2
Abstract

A method for digitally controlling the resistive output of a temperature probe is disclosed. The system is comprised of a temperature sensor, a processor and a means under the control of the processor for modifying the resistive output such as a digital potentiometer. In one embodiment, the processor reads the temperature sensor and adjusts the potentiometer based on a correlative or predictive technique so as to provide a modified output that matches that of a standard resistive temperature probe and is compatible for display on a multiparameter monitor.

Claims (40)

1. An interface for a monitor and a temperature probe including a temperature sensor comprising:

a logic circuit for determining a modified resistive output for the temperature sensor and

a means for providing the modified resistive output, wherein the means for providing the modified resistive output is compatible with the monitor such that the monitor can display a temperature that corresponds to the modified resistive output from the temperature probe, said means including a FET coupled to said logic circuit via a first terminal and via a feedback arrangement, said means providing a FET resistance corresponding to the modified resistive output.

2. The interface of claim 1 wherein the logic circuit is programmed to execute a predictive or a correlative algorithm.

3. The interface of claim 2 wherein the logic circuit is a microprocessor.

4. A temperature probe comprising:

a temperature sensor having a resistive output,

a processor for determining a modified resistive output for the temperature sensor, the processor being programmed to execute a predictive or a correlative algorithm, and

a FET for providing the modified resistive output in response to a signal from the processor,

wherein the algorithm is a predictive algorithm that converts the resistive output of the temperature sensor during a thermally unstable condition to a modified resistive output representative of a predicted temperature during a condition of thermal stability.

5. The temperature probe of claim 4 wherein the processor executes an algorithm to convert the resistive output of the temperature sensor to a modified resistive output that can be displayed by a monitor.

6. The temperature probe of claim 4 wherein the probe includes two FETs.

7. A method for digitally modifying the resistive output of a temperature sensor which comprises inputting the resistive output from the temperature sensor to a logic circuit, implementing a predictive or a correlative algorithm using the logic circuit to determine a modified resistive output, controlling a gate of a FET to adopt a setting corresponding to the modified resistive output, and outputting a resistance corresponding to the modified resistive output.

8. The method of claim 7 further including measuring a FET voltage with a first amplifier, measuring a resistor voltage of a first resistor having a first resistance, calculating a FET current using the first resistance and the resistor voltage, calculating a FET resistance using the FET voltage and the FET current, comparing the FET resistance to the modified resistive output and applying a difference between the FET resistance and the modified resistive output as a negative feedback to the gate.

9. A temperature probe comprising:

a temperature sensor that provides a resistive output,

a logic circuit for determining a modified resistive output for the temperature sensor, and

a means for providing the modified resistive output including a FET,

wherein the logic circuit is a microprocessor programmed to execute a predictive or a correlative algorithm, and

wherein the microprocessor includes an output and the FET includes a gate, where the output of the microprocessor controls the gate of the FET such that the FET provides a FET resistance corresponding to the modified resistive output.

10. The temperature probe of claim 9 wherein the microprocessor further includes:

a first input from a first amplifier, where the first amplifier measures a FET voltage of the FET, and

a second input from a second amplifier, where the second amplifier measures a resistor voltage of a resistor having a first resistance,

where the microprocessor calculates a FET current using the first resistance and the resistor voltage from the second input, calculates a FET resistance using the FET voltage from the first input and the FET current, compares the FET resistance to the modified resistive output and applies a difference between the FET resistance and the modified resistive output as a negative feedback to the gate.

11. An interface for a monitor and a temperature probe including a temperature sensor comprising:

a logic circuit for determining a modified resistive output for the temperature sensor and

a means for providing the modified resistive output, wherein the means for providing the modified resistive output includes a FET, and

wherein the logic circuit includes an output and the FET includes a gate, where the output of the logic circuit controls the gate of the FET such that the FET provides a FET resistance corresponding to the modified resistive output.

12. The interface of claim 11 wherein the logic circuit further includes:

a second input from a second amplifier, where the second amplifier measures a resistor voltage of a resistor having a first resistance,

where the logic circuit calculates a FET current using the first resistance and the resistor voltage from the second input, calculates a FET resistance using the FET voltage from the from the first input and the FET current, compares the FET resistance to the modified resistive output and applies a difference between the FET resistance and the modified resistive output as a negative feedback to the gate.

13. A temperature probe comprising:

a temperature sensor having a resistive output,

a processor for determining a modified resistive output for the temperature sensor, the processor being programmed to execute a predictive or a correlative algorithm, and

a FET for providing the modified resistive output in response to a signal from the processor,

wherein the processor includes an output and the FET includes a gate, where the output of the processor controls the gate of the FET such that the FET provides a FET resistance corresponding to the modified resistive output.

14. temperature probe of claim 13 wherein the processor further includes:

a first input from a first amplifier, where the first amplifier measure a FET voltage of the FET, and

a second input from a second amplifier, where the second amplifier measures a resistor voltage of a resistor having a first resistance,

where the processor calculates a FET current using the first resistance and the resistor voltage from the second input, calculates a FET resistance using the FET voltage from the first input and the FET current, compares the FET resistance to the modified resistive output and applies a difference between the FET resistance and the modified resistive output as a negative feedback to the gate.

Assignments (7)
RELEASE OF PATENT SECURITY INTEREST Recorded Oct 30, 2014
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 034104/0256 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2010
From: YSIS INCORPORATED
To: MEASUREMENT SPECIALITIES, INC.
Reel/Frame 025380/0870 →
RELEASE OF SECURITY INTEREST Recorded Jun 3, 2010
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: MEASUREMENT SPECIALTIES, INC.; IC SENSORS, INC.; ELEKON INDUSTRIES USA, INC.; ENTRAN DEVICES LLC; MEASUREMENT SPECIALTIES FOREIGN HOLDINGS CORPORATION; YSIS INCORPORATED; MREHTATEB, LLC LIMITED LIABILITY COMPANY - MASSACHUSETTS
Reel/Frame 024474/0377 →
SECURITY AGREEMENT Recorded Jun 1, 2010
From: MEASUREMENT SPECIALTIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024463/0953 →
SECURITY AGREEMENT Recorded May 30, 2006
From: MEASUREMENT SPECIALTIES, INC.; IC SENSORS, INC.; ELEKON INDUSTRIES USA, INC.; ENTRAN DEVICES LLC; MEASUREMENT SPECIALTIES FOREIGN HOLDING CORPORATION; YSIS INCORPORATED; MREHTATEB, LLC LIMITED LIABILITY COMPANY - MASSACHUSETTS
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT
Reel/Frame 017931/0294 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2006
From: YSI INCORPORATED
To: YSIS INCORPORATED
Reel/Frame 017335/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2004
From: SHIDEMANTLE, JACK P.; KILL, ROBERT A.
To: YSI INCORPORATED
Reel/Frame 014490/0187 →