Ultrasonic probe with a conductive substrate connected to a transducer

1. An ultrasonic probe, comprising:

a piezoelectric transducer configured to send and to receive an ultrasonic wave;

a conductive substrate for applying current to the piezoelectric transducer, wherein the conductive substrate is arranged oppositely to a side face of the piezoelectric transducer and has an end portion that is arranged outside of the side face of the piezoelectric transducer, the substrate further comprising a signal wiring and an earth wiring;

first and second conductive materials arranged in first and second corner portions formed by the piezoelectric transducer and the conductive substrate, the conductive material electrically connecting the piezoelectric transducer to the conductive substrate; and

a nonconductive material arranged on the side face of the piezoelectric transducer between the first and second corner portions, the nonconductive material insulating the first corner portion from the second corner portion.

2. The ultrasonic probe according to claim 1 , wherein

either one of the wirings is electrically connected to a first electrode disposed on a surface side of the piezoelectric transducer by the conductive material arranged in the first corner portion formed by a surface of the piezoelectric transducer and the conductive substrate, and

the other wiring is electrically connected to a second electrode formed on a back side of the piezoelectric transducer by the conductive material arranged in the second corner portion formed by the back of the piezoelectric transducer and the conductive substrate.

3. The ultrasonic probe according to claim 1 ,

wherein the conductive material is coated by a second nonconductive material.

4. The ultrasonic probe according to claim 1 ,

wherein a face of the conductive substrate at a side of the piezoelectric transducer is disposed on a plane equal to a side face of the piezoelectric transducer or a plane spaced from the piezoelectric transducer.

5. The ultrasonic probe according to claim 1 , wherein the conductive substrate is flat in the vicinity of the piezoelectric transducer.

6. The ultrasonic probe according to claim 1 , wherein the conductive material is disposed in a fillet pattern.

7. The ultrasonic probe according to claim 1 , wherein the conductive substrate comprises:

a first substrate having the signal wiring for applying current to the piezoelectric transducer; and

a second substrate having the earth wiring for connecting to the piezoelectric transducer,

wherein the first substrate is arranged oppositely to a first side face of the piezoelectric transducer,

the second substrate is arranged oppositely to a second side face of the piezoelectric transducer,

the earth wiring is electrically connected to a first electrode disposed on a first main-face side of the piezoelectric transducer by the first conductive material arranged in the first corner portion formed by the first substrate,

and the signal wiring is electrically connected to a second electrode formed on a second main-face side of the piezoelectric transducer by the second conductive material arranged in the second corner portion formed by the second substrate.

8. The ultrasonic probe according to claim 7 , wherein the conductive material is coated by a second nonconductive material.

9. The ultrasonic probe according to claim 7 ,

wherein faces of the first and second substrates at a side of the piezoelectric transducer are disposed on a plane equal to the side of the piezoelectric transducer or a plane spaced from the side of the piezoelectric transducer.

10. The ultrasonic probe according to claim 7 , wherein the first and second conductive materials are disposed in a fillet pattern.