IP Library Granted Patent US 7,038,559
Granted Patent B2
US 7,038,559 · App. 10/785,525 · Granted May 2, 2006

Vertically separated acoustic filters and resonators

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Quick Facts
Patent No.
US 7,038,559
App. No.
10/785,525
Granted
May 2, 2006
Kind
B2
Abstract

An apparatus including vertically separated acoustic resonators are disclosed. The apparatus includes a first acoustic resonator on a substrate and a second acoustic resonator vertically separated above the first acoustic resonator. Because the resonators are vertically separated above another, total area required to implement the resonators is reduced thereby savings in die size and cost are realized. The vertically separated resonators are supported by standoffs that are fabricated on the substrate, or on a resonator.

Claims (34)

1. An apparatus comprising:

a first acoustic resonator on a substrate;

a second acoustic resonator above said first acoustic resonator, said second acoustic resonator vertically separated from said first acoustic resonator such that little or no acoustic energy is coupled between said first acoustic resonator and said second acoustic resonator;

wherein said first acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer;

wherein said second acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer;

a standoff between the top electrode of said first acoustic resonator and the bottom electrode of said second acoustic resonator; and

wherein the top electrode of said first acoustic resonator and the bottom electrode of said second acoustic resonator are electrically connected by the standoff.

2. An apparatus comprising:

a first acoustic resonator on a substrate;

a second acoustic resonator above said first acoustic resonator, said second acoustic resonator vertically separated from said first acoustic resonator such that little or no acoustic energy is coupled between said first acoustic resonator and said second acoustic resonator;

wherein said first acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer;

wherein said second acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer;

a standoff between the top electrode of said first acoustic resonator and the bottom electrode of said second acoustic resonator; and

wherein the top electrode of said first acoustic resonator and the bottom electrode of said second acoustic resonator are at different electrical potential relative to each other thereby creating a capacitive potential between the top electrode of said first acoustic resonator and the bottom electrode of said second acoustic resonator.

3. An apparatus comprising:

a first acoustic resonator on a substrate;

a second acoustic resonator above said first acoustic resonator, said second acoustic resonator vertically separated from said first acoustic resonator such that little or no acoustic energy is coupled between said first acoustic resonator and said second acoustic resonator;

standoffs separating said first acoustic resonator from said second acoustic resonator; and

wherein said standoffs comprise tungsten.

4. An apparatus comprising:

a plurality of resonators fabricated on a substrate, the apparatus including a first acoustic resonator and a second acoustic resonator vertically separated above said first acoustic resonator, said second acoustic resonator acoustically separated from said first acoustic resonator;

wherein said first acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer;

wherein said second acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer; and

a standoff fabricated on the top electrode of said first acoustic resonator connected to the bottom electrode of said second acoustic resonator.

5. An apparatus comprising:

a plurality of resonators fabricated on a substrate, the apparatus including a first acoustic resonator and a second acoustic resonator vertically separated above said first acoustic resonator, said second acoustic resonator acoustically separated from said first acoustic resonator;

wherein said first acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer;

wherein said second acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer; and

a standoff between the top electrode of said first acoustic resonator and the bottom electrode of said second acoustic resonator.

6. An apparatus comprising:

a plurality of resonators fabricated on a substrate, the apparatus including a first acoustic resonator and a second acoustic resonator vertically separated above said first acoustic resonator, said second acoustic resonator acoustically separated from said first acoustic resonator;

wherein said first acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer;

wherein said second acoustic resonator includes a bottom electrode and a top electrode sandwiching a piezoelectric layer; and standoffs separating said first acoustic resonator from said second acoustic resonator,

wherein said standoffs comprise tungsten.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0703 →
RELEASE OF SECURITY INTEREST Recorded Aug 2, 2012
From: CITICORP NORTH AMERICA, INC.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. SUCCESSOR IN INTEREST TO AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 028713/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0434 →
SECURITY AGREEMENT Recorded Feb 24, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: CITICORP NORTH AMERICA, INC.
Reel/Frame 017207/0882 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2004
From: RUBY, RICHARD C.; LARSON, JOHN D., III
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 014668/0759 →