Method of manufacturing magneto-resistance effect type head
View Patent ↗A method of manufacturing a magneto-resistance effect type head that includes an element portion of magneto-resistance effect type and reproduces a read signal of data from a recording medium by the element portion, is proposed. The method includes applying a predetermined DC current to the element portion; and performing heat treatment on a part of the element portion that has been thermally deformed due to application of the DC current.
1. A method of manufacturing a magneto-resistance effect type head, the magneto-resistance effect type head that includes an element portion of magneto-resistance effect type and reproduces a read signal of data from a recording medium by the element portion, comprising:
applying a predetermined DC current to deform the element portion thermally; and
performing heat treatment on a deformed part of the element portion.
2. The method according to claim 1 , wherein the performing includes causing a surface of a bump disk to collide with the deformed part of the element portion.
3. The method according to claim 2 , wherein the bump disk is a laser bump disk.
4. The method according to claim 3 , wherein the laser bump disk and the deformed element portion are made to collide for five minutes.
5. The method according to claim 2 , wherein a plurality of bumps each having a ring-shaped protrusion and a recess is spirally formed on the bump disk.
6. The method according to claim 1 , further comprising:
forming the magneto-resistance effect type head with a write element and a read element; and
applying a weak current to the read element.
7. A method of manufacturing a magneto-resistance effect type head, the magneto-resistance effect type head that includes an element portion of magneto-resistance effect type and reproduces a read signal of data from a recording medium by the element portion, comprising:
applying a predetermined DC current to the element portion;
performing heat treatment on a part of the element portion that has been thermally deformed due to application of the DC current; and
wherein the performing includes causing a surface of a bump disk to collide with the part of the element portion.
8. The method according to claim 7 , wherein the bump disk is a laser bump disk.
9. The method according to claim 8 , wherein the laser bump disk and the element portion are made to collide for approximately five minutes.
10. The method according to claim 7 , wherein a plurality of bumps each having a ring-shaped protrusion and a recess is spirally formed on the bump disk.