High voltage and low on-resistance LDMOS transistor having equalized capacitance
View Patent ↗A high voltage LDMOS transistor according to the present invention includes P-field blocks in the extended drain region of a N-well. The P-field blocks form the junction-fields in the N-well for equalizing the capacitance of parasitic capacitors between the drain region and the source region and fully deplete the drift region before breakdown occurs. A higher breakdown voltage is therefore achieved and the N-well having a higher doping density is thus allowed. The higher doping density reduces the on-resistance of the transistor. Furthermore, the portion of the N-well generated beneath the source diffusion region produces a low-impedance path for the source region, which restricts the transistor current flow in between the drain region and the source region.
1. A transistor comprising:
a P-substrate;
a first diffusion region and a second diffusion region having N conductivity-type ions formed in said P-substrate, wherein said first diffusion region comprises an extended drain region;
a drain diffusion region containing N+ conductivity-type ions, forming a drain region in said extended drain region;
a plurality of spaced apart P-field blocks formed in said extended drain region; wherein said P-field blocks have different sizes; wherein a smallest size P-field block is located nearest to said drain region; wherein said P-field blocks are used for generating junction fields;
a source diffusion region having N+ conductivity-type ions, forming a source region in an N-well formed by said second diffusion region, wherein a largest size P-field block is located nearest to said source region;
a channel, formed between said drain region and said source region;
a polysilicon gate electrode, formed over said channel to control a current flow in said channel;
a contact diffusion region containing P+ conductivity-type ions, forming a contact region in said N-well formed by said second diffusion region; and
an isolated P-well formed in said N-well formed by said second diffusion region for preventing from breakdown; wherein said isolated P-well formed in said second diffusion region encloses said source region and said contact region.
2. The transistor of claim 1 , wherein said N-well formed by said second diffusion region produces a low-impedance path for said source region, and restricts said current flow in between said drain region and said source region.
3. The transistor of claim 1 further comprising:
a thin gate oxide and a thick field oxide, formed underneath said polysilicon gate electrode,
a drain-gap, formed between said drain diffusion region and said thick field oxide to maintain a space between said drain diffusion region and said thick field oxide; and
a source-gap, formed between said thick field oxide and said isolated P-well to maintain a space between said thick field oxide and said isolated P-well, wherein said drain-gap and said source-gap are used to increase breakdown voltage, wherein said drain-gap further reduces an on-resistance of said channel.
4. The transistor of claim 3 , further comprising a silicon dioxide insulation layer, covering said polysilicon gate electrode and said thick field oxide.
5. The transistor of claim 1 , further comprising:
a source metal contact having a first metal electrode, for contacting with said source diffusion region and said contact diffusion region; and
a drain metal contact, having a second metal electrode, for contacting with said drain diffusion region.
6. The transistor of claim 5 , further comprising:
a drain bonding pad, connected to said drain metal contact for a drain electrode;
a source bonding pad, connected to said source metal contact for a source electrode; and
a gate bonding pad, connected to said polysilicon gate electrode.
7. The LDMOS transistor of claim 1 , wherein said P-field blocks are formed in said extended drain region of said N-well, wherein said N-well and said P-field blocks deplete a drift region and equalize the capacitance of parasitic capacitors between said drain region and said source region, and decrease the on-resistance of said channel.