Methods and devices for connecting and grounding an EMI shield to a printed circuit board

1. An electronic device comprising:

a printed circuit board comprising an electronic component and a grounding portion;

an electromagnetic interference (EMI) shield comprising a top surface that includes both a flat portion and one or more features that extend above the flat portion, a plurality of sidewalls that extend from the top surface, and a flange that extends in a direction substantially parallel to a surface of the printed circuit board; and

a housing of the electronic device configured to enclose the printed circuit board and EMI shield,

wherein the features on the top surface of the EMI shield contact an inner surface of the housing so as to compress the flange of the EMI shield against the grounding portion on the printed circuit board while the flat portion of the top surface does not contact the inner surface of the housing.

2. The electronic device of claim 1 wherein the EMI shield comprise a metallized, shaped polymer substrate.

3. The electronic device of claim 1 wherein the features compose semi-circular protrusions that extend toward the inner surface of the housing.

4. The electronic device of claim 1 wherein the features are positioned substantially over the sidewalls.

5. The electronic device of claim 1 wherein the EMI shield further comprises a one or more features that extend from the flange toward the printed circuit board, and the printed circuit board comprises a corresponding feature that mates with the feature on the EMI shield to locate and retain the EMI shield with the grounding portion.

6. The electronic device of claim 5 wherein the feature on the flange of the EMI comprises a protrusion and the feature on the printed circuit board comprises a groove.

7. The electronic device of claim 5 wherein the feature on the printed circuit board is positioned adjacent the grounding portion.

8. An electromagnetic interference (EMI) shield comprising:

a body comprising a top surface that includes both a flat portion and one or more features that extend above the flat portion, a plurality of sidewalls that extend from the top surface, and a flange that extends laterally away from the sidewalls;

wherein the features on the top surface of the EMI shield are shaped to contact an inner surface of a housing of an electronic device when the housing is positioned around the printed circuit board so as to-compress the flange against a grounding portion on the printed circuit board; and

wherein the flat portion of the top surface of the EMI shield is shaped to not contact the inner surface of the housing of the electronic device when the housing is positioned around the printed circuit board so as to-compress the flange against the grounding portion on the printed circuit board.

9. The EMI shield of claim 8 wherein the body comprises a metallized polymer.

10. The EMI shield of claim 8 wherein the features comprise semi-circular protrusions that extend in a direction away from the flange.

11. The EMI shield of claim 8 wherein the features are positioned substantially over the sidewalls.

12. The EMI shield of claim 8 wherein the EMI shield further comprises a one or more features that extend from the flange away from the top surface, the features on the flange being configured to interact with a corresponding feature to locate and retain the EMI shield with the grounding portion.

13. The EMI shield of claim 12 wherein the feature on the flange of the EMI comprises a protrusion and the feature on the printed circuit board comprises a groove.

14. An electronic device comprising:

a printed circuit board comprising an electronic component and a grounding portion;

an electromagnetic interference (EMI) shield comprising a top surface that includes both a flat portion and one or more features that extend above the flat portion, a plurality of sidewalls that extend from the top surface, and a flange that extends in a direction substantially parallel to a surface of the printed circuit board; and

a housing of the electronic device configured to enclose the printed circuit board and EMI shield;

wherein the features on the top surface are dimensionally taller than the space formed between the inside of the housing and the flat portion of the EMI shield when the housing is brought into contact with the EMI shield; and

wherein the features on the top surface of the EMI shield contact an inner surface of the housing so as to compress the flange of the EMI shield against the grounding portion on the printed circuit board while the flat portion of the top surface does not contact the inner surface of the housing.

15. The electronic device of claim 14 wherein the features have a convex shape that protrude towards the inner surface of the housing.

16. The electronic device of claim 14 wherein the features are positioned to apply a force downward along the plurality of sidewalls.

17. The electronic device of claim 16 wherein the features are positioned adjacent and above the plurality of sidewalls.

18. The electronic device of claim 14 wherein the features are spaced over the entire top surface.

19. The electronic device of claim 14 further comprising an adhesive applied to the flange so as to position the EMI shield on the grounding portion on the printed circuit board.