IP Library Granted Patent US 7,170,715
Granted Patent B2
US 7,170,715 · App. 10/789,501 · Granted Jan 30, 2007

Microsuspension assemblies for direct access storage devices

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Quick Facts
Patent No.
US 7,170,715
App. No.
10/789,501
Granted
Jan 30, 2007
Kind
B2
Abstract

Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material. The transfer film with the resin material therein is positioned over the silicon wafer so that at least a portion of the resin material is positioned adjacent to the spacer layer. The resin material is baked to form a glassy carbon material. The spacer layer is etched to form a trench in the silicon wafer adjacent to the glassy carbon material, and a slider is positioned on the glassy carbon material over the trench.

Claims (32)

1. A head suspension assembly comprising:

a suspension arm having a trench formed therein; and

a membrane positioned on the suspension arm and adapted to support a slider thereon, wherein at least a portion of the membrane is positioned adjacent to the trench, and

a slider positioned on the membrane over the trench.

2. A head suspension assembly as in claim 1 , wherein the suspension arm and the membrane are formed from materials having different compositions.

3. A head suspension assembly as in claim 2 , wherein the suspension arm is formed from silicon.

4. A head suspension assembly as in claim 2 , wherein the membrane is formed from a material including carbon.

5. A head suspension assembly as in claim 1 , wherein the membrane comprises a glassy carbon material.

6. A head suspension assembly as in claim 1 , wherein the suspension arm is formed from a silicon wafer and the membrane comprises a glassy carbon material.

7. A head suspension assembly as in claim 1 , wherein the membrane is formed from an electrically conductive material.

8. A head suspension assembly as in claim 1 , further comprising at least one wiring line electrically coupled to slider positioned on the membrane, wherein at least a portion of one wiring line is positioned so that the wiring line extends at least one of (a) into the suspension arm to a depth, and (b) on the surface of the suspension arm.

9. A head suspension assembly comprising:

a suspension arm having a trench formed therein; and

a membrane positioned on the suspension arm and adapted to support a slider thereon, wherein at least a portion of the membrane is positioned adjacent to the trench, and wherein the membrane extends across the trench.

10. A head suspension assembly as in claim 9 , wherein the suspension arm is formed from a silicon wafer and the membrane comprises a glassy carbon material.

11. A disk drive for reading and writing disks, the disk drive including a head suspension assembly, the disk drive comprising:

at least one disk;

a rotatable hub for mounting the disk;

a read/write head adapted to read from and write to the disk;

a slider onto which the read/write head is provided; and

a suspension assembly adapted to support the slider, the suspension assembly including a suspension arm defining a cavity, and a membrane positioned on the suspension arm and adapted to support the slider thereon, wherein at least a portion of the membrane is configured to deflect into the cavity when a suitable force is applied to the read/write head.

12. A disk drive as in claim 11 , wherein the membrane comprises a glassy carbon material and the suspension arm comprises silicon.

13. A disk drive as in claim 11 , wherein the membrane extends over a portion of the cavity.

14. A disk drive as in claim 11 , wherein the membrane extends across the cavity.

15. A head suspension assembly comprising:

a suspension arm having a cavity formed therein; and

a membrane positioned on the suspension arm and adapted to support a slider thereon, wherein at least a portion of the membrane is configured to deflect into the cavity when a suitable force is applied to the membrane.

16. A head suspension assembly as in claim 15 , wherein the suspension arm and the membrane are formed from materials having different compositions.

17. A head suspension assembly as in claim 15 , wherein the membrane comprises a glassy carbon material.

18. A head suspension assembly as in claim 15 , wherein the suspension arm is formed from silicon.

19. A head suspension assembly as in claim 15 , wherein the membrane extends across the cavity.

20. A head suspension assembly as in claim 15 , further comprising a slider positioned on the membrane.

Assignments (4)
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →