Pad architecture for backwards compatibility for bi-directional transceiver module
View Patent ↗Exemplary embodiments of the present invention selectively adapt the pad architecture on bi-directional opto-electronic transceiver modules to connect to legacy unidirectional ports, panels and the like. This allows the bi-directional module to function correctly when connected to either a unidirectional or a bi-directional port. Conversely, exemplary embodiments also selectively adapt the pad architecture on bi-directional patch panels or ports to connect to legacy unidirectional optoelectronic transceiver modules. This allows the port to function correctly when either a bi-directional or a unidirectional transceiver is connected to it.
1. A connector that electrically connects an optoelectronic transceiver module configured for bi-directional communication and a communications device configured for unidirectional communication, the connector comprising:
a first plurality of pads that are used to communicate with a first receiver and a first transmitter of the optoelectronic transceiver module, the first plurality of pads comprising;
first transmitter pads; and
first receiver pads;
a second plurality of pads used to communicate with the communications device; and
a third plurality of pads selectively operable to communicate with a second receiver and a second transmitter when used to connect the optoelectronic transceiver module to a communications device that is configured for bi-directional communication, the third plurality of pads comprising:
second transmitter pads; and
second receiver pads.
2. The connector of claim 1 , wherein said communications device is configured to receive standard form factor pluggable (SFP) modules.
3. The connector of claim 2 , wherein said second plurality of pads conforms to the SFP standard.
4. The connector of claim 1 , wherein said communication device is configured to receive a 10 Gigabit standard form factor pluggable (XFP) module.
5. The connector of claim 1 , wherein at least said first transmitter pads of said first plurality of pads communicate with said first transmitter of said optoelectronic transceiver.
6. The connector of claim 5 , wherein at least said first receiver pads of said first plurality of pads communicate with said first receiver of said optoelectronic transceiver.
7. The connector of claim 1 , wherein at least said second transmitter pads of said third plurality of pads communicate with said second transmitter of said optoelectronic transceiver.
8. The connector of claim 7 , wherein at least said receiver pads of said third plurality of pads communicate with said second receiver of said optoelectronic transceiver.
9. The connector of claim 1 , wherein a sum of the first plurality, the second plurality and the third plurality equals twenty.
10. The connector of claim 1 , wherein a sum of the first plurality, the second plurality and the third plurality equals thirty.
11. A connector that electrically connects an optical transceiver module configured for unidirectional communication and a communications device configured for bi-directional communication, the connector comprising:
a first plurality of pads that are used to communicate with a receiver and a transmitter of the optical transceiver module, the first plurality comprising:
first transmitter pads; and
first receiver pads;
a second plurality of pads used to communicate with the communications device; and
a third plurality of pads that are idle but that can be used to communicate with a second receiver and a second transmitter when used to connect an optical transceiver module configured for bi-directional communication to the communications device, the third plurality of pads comprising:
second transmitter pads; and
second receiver pads.
12. The connector of claim 11 , wherein said transceiver module is selected from the group consisting of a standard form factor pluggable (SFP) module or a 10 Gigabit standard form factor pluggable (XFP) module.
13. The connector of claim 12 , wherein said first plurality of pads conforms to the SFP standard.
14. The connector of claim 11 , wherein at least said second transmitter pads of said third plurality of pads communicate with a second transmitter of an optoelectronic transceiver configured for bi-directional communication.
15. The connector of claim 14 , wherein at least said second receiver pads of said third plurality of pads communicate with a second receiver of an optoelectronic transceiver configured for bi-directional communication.
16. The connector of claim 11 , wherein a sum of the first plurality, the second plurality and the third plurality equals twenty.
17. The connector of claim 11 , wherein a sum of the first plurality, the second plurality and the third plurality equals thirty.
18. An optoelectronic transceiver assembly providing backwards compatibility between a bi-directional component and a legacy unidirectional component, comprising:
an optical transceiver module;
a communications device that communicates electrically with the optical transceiver module, wherein one of the optical transceiver module and the communications device is configured for bi-directional communication and the other of the optical transceiver module and the communications device is configured only for unidirectional communication; and
a connector that electrically connects the optical transceiver module and the communications device, wherein the connector includes:
a first set of pads that are used to communicate with a first receiver and a first transmitter of the optical transceiver module, the first set of pads comprising:
first receiver pads to communicate with the first receiver; and
first transmitter pads to communicate with the first transmitter; and
a second set of pads that are idle but can be used to communicate with a second receiver and a second transmitter when used to connect an optical transceiver module and a communications device that are both configured for bi-directional communication, the second set of pads comprising:
second receiver pads to communicate with the second receiver; and
second transmitter pads to communicate with the second transmitter.
19. The optoelectronic transceiver assembly of claim 18 , wherein said communications device is configured to receive a module selected from the group consisting of a standard form factor pluggable (SFP) module or a 10 Gigabit standard form factor pluggable (XFP) module.
20. The optoelectronic transceiver assembly of claim 19 , wherein said transceiver module is one of a standard form factor pluggable (SFP) module, and a bi-directional transceiver module.
21. The optoelectronic transceiver assembly of claim 18 , wherein said first set of pads conforms to the SFP standard.
22. The optoelectronic transceiver assembly of claim 18 , wherein at least said second transmitter pads of said second set of pads communicate with a second transmitter of an optoelectronic transceiver configured for bi-directional communication.
23. The optoelectronic transceiver assembly of claim 22 , wherein at least said second receiver pads of said second set of pads communicate with a second receiver of an optoelectronic transceiver configured for bi-directional communication.
24. The optoelectronic transceiver assembly of claim 18 , wherein a sum of the first set, and the second set equals twenty.
25. The optoelectronic transceiver assembly of claim 18 , wherein a sum of the first set, and the second set equals thirty.