Electronic apparatus
View Patent ↗A liquid cooling jacket and a system for use in an electronic apparatus, preferable in the cooling capacity or performance, with less in man-hour and manufacturing costs in need of process thereof, and applicable into a narrow space, wherein a plural number of lamination plates, each being formed through the punching process, are piled up in the width direction thereof, for each piece thereof, and are bonded with each other. A cooling liquid flows in a flow passage defined between the laminating plates, and the laminating plates themselves function as a cooling fin.
1. A liquid cooling system comprising:
a heat-receiving element, being thermally connected with a heat-generation part;
a pump for transporting a liquid to said heat-receiving element; and
a radiator for receiving heat from said heat-generation part with an aid of said pump, and for radiating heat of the liquid;
wherein said heat-receiving element is made up with at least one lamination plate, being formed through punching process, and said at least one lamination plate comprises a flow passage, within which the liquid communicates and is provided with a cooling fin surface area; and
wherein said at least one lamination plate includes a plurality of first lamination plates having at least one hole at a central portion thereof, and a plurality of second lamination plates having an opened cut-out portion at one end thereof and a hole at an other end thereof, and said first and second lamination plates are piled up alternately, thereby forming a lamination group of an inlet side of the liquid and another lamination group of an outlet side of the liquid.
2. A liquid cooling system, comprising:
a heat-receiving element, being thermally connected with a heat-generation part;
a pump for transporting a liquid to said heat-receiving element; and
a radiator for receiving heat from said heat-generation part with an aid of said pump, and for radiating heat of the liquid;
wherein said heat-receiving element is made up with at least one lamination plate, being formed through punching process, and said at least one lamination plate comprises a flow passage, within which the liquid communicates and is provided with a cooling fin surface area, and further said pump and said radiator are connected with said heat-receiving member through conduits; and
wherein said at least one lamination plate includes a plurality of first lamination plates having at least one hole at a central portion thereof, and a plurality of second lamination plates having an opened cut-out portion at one end thereof and a hole at an other end thereof, and said first and second lamination plates are piled up alternately, thereby forming a lamination group of an inlet side of the liquid and another lamination group of an outlet side of the liquid.
3. The liquid cooling system, as described in the claim 2 , wherein:
a fin is attached onto said radiator.