IP Library › Granted Patent US 7,233,098
Granted Patent B2
US 7,233,098 · App. 10/795,444 · Granted Jun 19, 2007

Package for electronic device, base substrate, electronic device and fabrication method thereof

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Quick Facts
Patent No.
US 7,233,098
App. No.
10/795,444
Granted
Jun 19, 2007
Kind
B2
Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2010
From: TAIYO YUDEN MOBILE TECHNOLOGY CO., LTD.
To: TAIYO YUDEN CO., LTD.
Reel/Frame 025095/0893 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2010
From: FUJITSU MEDIA DEVICES LIMITED
To: TAIYO YUDEN MOBILE TECHNOLOGY CO., LTD.
Reel/Frame 025095/0167 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2004
From: MASUKO, SHINGO; KAWACHI, OSAMU; KOORIIKE, TAKUMI
To: FUJITSU MEDIA DEVICES LIMITED
Reel/Frame 015556/0287 →