Header assembly for optoelectronic devices
View Patent ↗A header assembly is provided that includes a base having a device side and a connector side. The header assembly further includes a platform attached to the base and positioned in a predetermined orientation with respect to the base. The device side of the base cooperates with a cap to define a hermetic chamber wherein one or more optoelectronic components, such as optical transmitters and optical receivers, are disposed. The platform includes an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform further includes at least one conductive pathway extending substantially through the platform so as to facilitate electrical communication between components disposed on the device side of the base, and circuits, devices and systems disposed on the connector side of the base.
1. A header assembly, comprising:
a base having a first side and a second side; and
a platform attached to the base and disposed in a predetermined orientation with respect to the base, the platform having an inside portion proximate the first side of the base and an outside portion proximate the second side of the base, and the platform including at least one conductive pathway extending substantially through the platform.
2. The header assembly as recited in claim 1 , wherein the base substantially comprises a metallic material.
3. The header assembly as recited in claim 1 , wherein when the platform is disposed in the predetermined orientation, the platform is substantially perpendicular to the base.
4. The header assembly as recited in claim 1 , wherein the platform extends through at least one side of the base.
5. The header assembly as recited in claim 1 , wherein the platform substantially comprises a ceramic material.
6. The header assembly as recited in claim 1 , wherein the platform has a thermal conductivity that is different than a thermal conductivity of the base.
7. The header assembly as recited in claim 1 , wherein the platform has a thermal conductivity that is relatively higher than a thermal conductivity of the base.
8. The header assembly as recited in claim 1 , wherein the at least one conductive pathway of the platform extends through the base.
9. The header assembly as recited in claim 1 , wherein the platform substantially comprises one of: aluminum nitride; and, beryllia.
10. The header assembly as recited in claim 1 , wherein the platform defines a recessed pocket configured and arranged to at least partly receive an optical component.
11. The header assembly as recited in claim 1 , wherein the platform is hermetically sealed to the base.
12. The header assembly as recited in claim 1 , further comprising a device mounted to the platform on the first side of the base.
13. The header assembly as recited in claim 12 , wherein the device comprises at least one of: an optical transmitter; and, an optical receiver.
14. The header assembly as recited in claim 1 , wherein the platform further comprises a connector located on the outside portion of the platform and connected at least indirectly with the at least one conductive pathway.
15. A header assembly, comprising:
a base having a first side and a second side;
a platform attached to the base and disposed in a predetermined orientation with respect to the base, the platform having an inside portion proximate the first side of the base and an outside portion proximate the second side of the base, and the platform including at least one conductive pathway extending substantially through the platform; and
a thermal control element attached at least indirectly to the platform.
16. The header assembly of claim 15 , wherein the thermal control element is mounted at least indirectly to the inside portion of the platform.
17. The header assembly of claim 15 , wherein the thermal control element comprises a thermoelectric cooler.
18. The header assembly as recited in claim 15 , wherein the base substantially comprises a metallic material.
19. The header assembly as recited in claim 15 , wherein when the platform is disposed in the predetermined orientation, the platform is substantially perpendicular to the base.
20. The header assembly as recited in claim 15 , wherein the platform extends through at least one side of the base.
21. The header assembly as recited in claim 15 , wherein the platform substantially comprises a ceramic material.
22. The header assembly as recited in claim 15 , wherein the thermal control element is configured to facilitate transfer of heat to, and from, an optical device mounted at least indirectly to the platform.
23. The header assembly as recited in claim 15 , further comprising at least one optical device mounted at least indirectly to the platform, the optical device being arranged for thermal communication with the thermal control element.
24. The header assembly as recited in claim 15 , further comprising a cap that cooperates with the base to define a hermetic chamber substantially enclosing the inside portion of the platform and the thermal control element.
25. The header assembly as recited in claim 15 , wherein the platform further comprises a connector located on the outside portion of the platform and connected at least indirectly with the at least one conductive pathway.
26. A header assembly, comprising:
a base substantially having a device side and a connector side;
a platform attached to the base and disposed in a predetermined orientation with respect to the base, the platform having an inside portion proximate the first side of the base and an outside portion proximate the second side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
a device mounted indirectly to the inside portion of the platform; and
means for transferring heat, the means for transferring heat being thermally coupled with the device.
27. The header assembly as recited in claim 26 , wherein the means for transferring heat facilitates removal of heat from the device.
28. The header assembly as recited in claim 26 , wherein the means for transferring heat facilitates the transfer of heat to the device.
29. The header assembly as recited in claim 26 , wherein the means for transferring heat facilitates positioning of the device.
30. The header assembly as recited in claim 26 , wherein the means for transferring heat aids in controlling performance of the device.
31. The header assembly as recited in claim 26 , wherein the device comprises at least one of: an optical transmitter; and, an optical receiver.
32. An optoelectronic device, comprising:
a header assembly, comprising:
a base having a first side and a second side;
a platform attached to the base and disposed in a predetermined orientation with respect to the base, the platform having an inside portion proximate the first side of the base and an outside portion proximate the second side of the base, and the platform including at least one conductive pathway extending substantially through the platform; and
at least one optical device at least indirectly attached to the platform; and
a printed circuit board electrically connected with the header assembly.
33. The optoelectronic device as recited in claim 32 , wherein the electrical connection between the printed circuit board and the header assembly is implemented by way of a flex circuit in electrical communication with the printed circuit board and with the platform.
34. The optoelectronic device as recited in claim 32 , wherein the at least one optical device comprises at least one of: an optical transmitter; and, an optical receiver.
35. The optoelectronic device as recited in claim 32 , wherein the base of the header assembly substantially comprises a metallic material.
36. The optoelectronic device as recited in claim 32 , wherein when the platform of the header assembly is disposed in the predetermined orientation, the platform is substantially perpendicular to the base.
37. The optoelectronic device as recited in claim 32 , wherein the platform of the header assembly extends through at least one side of the base.
38. The optoelectronic device as recited in claim 32 , wherein the platform of the header assembly substantially comprises a ceramic material.
39. The optoelectronic device as recited in claim 32 , wherein the platform of the header assembly further comprises a connector located on the outside portion of the platform and connected at least indirectly with the at least one conductive pathway and with the printed circuit board.
40. The optoelectronic device as recited in claim 32 , wherein the platform has a thermal conductivity that is relatively higher than a thermal conductivity of the base.
41. The optoelectronic device as recited in claim 32 , wherein the at least one conductive pathway of the platform extends through the base.
42. The optoelectronic device as recited in claim 32 , further comprising a thermal control element attached at least indirectly to the platform and arranged for thermal communication with the at least one optical device.