IP Library Granted Patent US 7,015,393
Granted Patent B2
US 7,015,393 · App. 10/795,744 · Granted Mar 21, 2006

Device and method for preventing magnetic-resonance imaging induced damage

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Quick Facts
Patent No.
US 7,015,393
App. No.
10/795,744
Granted
Mar 21, 2006
Kind
B2
Abstract

An electromagnetic shield has a first patterned or apertured layer having non-conductive materials and conductive material and a second patterned or apertured layer having non-conductive materials and conductive material. The conductive material may be a metal, a carbon composite, or a polymer composite. The non-conductive materials in the first patterned or apertured layer may be randomly located or located in a predetermined segmented pattern such that the non-conductive materials in the first patterned or apertured layer are located in a predetermined segmented pattern with respect to locations of the non-conductive materials in the second patterned or apertured layer.

Claims (33)

1. An electromagnetic shielded lead, comprising:

an electrical lead; and

a shielding formed around said electrical lead to shield said electrical lead from electromagnetic interference;

said shielding being an apertured conductive material with non-conductive material positioned within said apertures;

said apertures in said conductive material of said shielding being located in a predetermined pattern.

2. The electromagnetic shielded lead as claimed in claim 1 , wherein said conductive material is a metal to shield said electrical lead from electromagnetic interference.

3. The electromagnetic shielded lead as claimed in claim 1 , wherein said conductive material includes metal-coated carbon filaments to shield said electrical lead from electromagnetic interference.

4. The electromagnetic shielded lead as claimed in claim 1 , wherein said conductive material is a polymer composite to shield said electrical lead from electromagnetic interference.

5. The electromagnetic shielded lead as claimed in claim 1 , further comprising a non-permeable diffusion resistant biocompatible material covering said shielding.

6. The electromagnetic shielded lead as claimed in claim 1 , wherein said shielding is constructed of two apertured sheaths, each apertured sheath having non-conductive materials and conductive material.

7. The electromagnetic shielded lead as claimed in claim 6 , wherein locations of said non-conductive materials in a first sheath of said two apertured sheaths is random with respect to locations of said non-conductive materials in a second sheath of said two apertured sheaths.

8. The electromagnetic shielded lead as claimed in claim 6 , wherein said non-conductive materials in said two apertured sheaths are located in a predetermined segmented pattern with respect to a direction substantially parallel with an axis of said lead system.

9. The electromagnetic shielded lead as claimed in claim 6 , wherein said non-conductive materials in said two apertured sheaths are located in a predetermined segmented pattern with respect to a direction substantially perpendicular with an axis of said lead system.

10. The electromagnetic shielded lead as claimed in claim 1 , wherein said conductive material comprises nanotubes to shield said electrical lead from electromagnetic interference.

11. An electromagnetic shielded lead, comprising:

an electrical lead; and

a shielding formed around said electrical lead to shield said electrical lead from electromagnetic interference;

said shielding being patterned with non-conductive materials and conductive material;

said shielding being constructed of two patterned sheaths, each patterned sheath having non-conductive materials and conductive material;

said non-conductive materials in said two patterned sheaths are located in a predetermined segmented pattern.

12. An electromagnetic shielded lead, comprising:

an electrical lead; and

a shielding formed around said electrical lead to shield said electrical lead from electromagnetic interference;

said shielding being an apertured conductive material;

said apertured conductive material having a maximum aperture dimension of 0.01 millimeters to 10 millimeters.

13. The electromagnetic shielded lead as claimed in claim 12 , wherein said conductive material is a metal to shield said electrical lead from electromagnetic interference.

14. The electromagnetic shielded lead as claimed in claim 12 , wherein said conductive material includes metal-coated carbon filaments to shield said electrical lead from electromagnetic interference.

15. The electromagnetic shielded lead as claimed in claim 12 , wherein said conductive material is a polymer composite to shield said electrical lead from electromagnetic interference.

16. The electromagnetic shielded lead as claimed in claim 12 , further comprising a non-permeable diffusion resistant biocompatible material covering said shielding.

17. The electromagnetic shielded lead as claimed in claim 12 , wherein apertures of said apertured conductive material of shielding are constructed from non-conductive materials being dispersed in said conductive material.

18. The electromagnetic shielded lead as claimed in claim 17 , wherein said non-conductive materials are randomly located.

19. The electromagnetic shielded lead as claimed in claim 17 , wherein said non-conductive materials are located in a predetermined segmented pattern.

20. The electromagnetic shielded lead as claimed in claim 12 , wherein said conductive material comprises nanotubes to shield said electrical lead from electromagnetic interference.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2008
From: BIOPHAN TECHNOLOGIES, INC.
To: MEDTRONIC, INC.
Reel/Frame 020919/0132 →
RELEASE OF SECURITY INTEREST Recorded May 8, 2008
From: IROQUOIS MASTER FUND, LTD
To: MEDTRONIC, INC.
Reel/Frame 020919/0146 →
SECURITY AGREEMENT Recorded Oct 17, 2006
From: BIOPHAN TECHNOLOGIES, INC.
To: IROQUOIS MASTER FUND LTD.
Reel/Frame 018398/0155 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2004
From: WEINER, MICHAEL L.; MILLER, VICTOR R.; CONNELLY, PATRICK R.; HELFER, JEFFREY L.
To: BIOPHAN TECHNOLOGIES, INC.
Reel/Frame 014919/0647 →