Multi-layer printed circuit board inductor winding with added metal foil layers
View Patent ↗The present invention provides an electromagnetic component formed from adjacent conducting layers of a multi-layer PCB and two additional conducting layers in contact with the PCB. The inventive component includes one or more winding turns formed by connecting the multiple layers of the multi-layer PCB with conductive vias and by connecting the additional conducting layers to respective top and bottom surfaces of the PCB. In one embodiment, one of the conducting layers is soldered to a top conducting layer of the PCB and the other of the conductive layers is soldered to a bottom conducting layer of the PCB, effectively increasing the cross-sectional area of the top and bottom winding layers. In another embodiment, the additional conducting layers are separated from the adjacent conducting PCB layers by a layer of insulation, permitting the additional conducting layers to form separate winding turns. The inventive winding stack can be surface mounted to a PCB, and can be used as an inductor, or in other electromagnetic devices. The winding thus constructed is capable of accepting larger currents with lower resulting temperature increases than windings formed only from PCBs, and are less expensive to manufacture than PCB-only windings.
1. An electromagnetic component comprising:
a plurality of conductive traces having a curved shape and two terminal ends, each conductive trace formed on an insulating layer and positioned such that said conductive traces form a multi-layer PCB stack, wherein a first one of said conductive traces is formed on the top surface of said PCB stack and a second one of said conductive traces is formed on the bottom surface of said PCB stack;
a plurality of conductors for interconnecting the terminal ends of each said conductive trace to form at least one turn of a winding;
a first separate conductive layer attached to a first outer surface of said PCB stack in a position at the top of said PCB stack and having two terminal ends and approximately the same shape as said conductive traces;
a first additional conductor for connecting at least one of said first separate conductive layer terminal ends to a terminal end of at least one of said conductive traces;
a second separate conductive layer attached to a second outer surface of said PCB stack in a position at the bottom of said PCB stack and having two terminal ends and approximately the same shape as said conductive traces; and
a second additional conductor for connecting at least one of said second separate conductive layer terminal ends to a terminal end of at least one of said conductive traces.
2. The component of claim 1 , wherein said first separate conductive layer is in conductive contact with said top conductive trace and said second separate conductive layer is in conductive contact with said bottom conductive trace.
3. The component of claim 2 , wherein said first and second separate conductive layers are soldered directly onto, respectively, said top conductive trace and said bottom conductive trace.
4. The component of claim 1 , wherein each said conductive layer is a metal foil.
5. The component of claim 1 , wherein each said insulating layer defines an aperture, wherein each said conductive trace is in the shape of a loop positioned adjacent to the perimeter of a respective one of said apertures, and wherein said conductive layers are each shaped to define an aperture that corresponds to the shape of the apertures formed in said insulating layers, said component further comprising a core positioned in the space defined by said apertures.
6. The component of claim 1 , wherein the component is an inductor.
7. The component of claim 1 , wherein a plurality of conductive traces are connected by said conductors to form a first turn of said winding, and wherein at least one of said plurality of conductive traces is connected by said conductors to form a second turn of said winding.
8. The component of claim 7 , wherein said second turn of said winding includes at least two of said plurality of conductive traces.
9. The component of claim 7 , wherein at least one of said plurality of conductive traces is connected by said conductors to form a third turn of said winding.
10. The component of claim 9 , wherein said third turn of said winding includes at least two of said plurality of conductive traces.
11. The component of claim 1 , wherein said electromagnetic component further comprises an insulator disposed between said first one of said conductive traces formed on the top surface of said PCB stack and said first separate conductive layer, wherein said insulator is separate from any other structure of said component.
12. The component of claim 11 , wherein each said insulating layer defines an aperture, wherein each said conductive trace is shaped to substantially surround the perimeter of a respective one of said apertures, and wherein said first separate conductive layer and said insulator define an aperture that corresponds to the shape of the apertures formed in said insulating layers, said component further comprising a core positioned in the space defined by said apertures.
13. The component of claim 11 , wherein said first separate conductive layer forms a first turn of said winding, and wherein a plurality of conductive traces are connected by said conductors to form a second turn of said winding.
14. The component of claim 13 , wherein at least one of said plurality of conductive traces is connected by said conductors to form a third turn of said winding.
15. The component of claim 14 , wherein said third turn of said winding includes at least two of said plurality of conductive traces.
16. The component of claim 1 wherein said plurality of conductors comprise at least one plated through hole formed in each said insulating layer.
17. An electromagnetic component comprising:
a plurality of conductive traces having a curved shape and two terminal ends, each conductive trace formed on an insulating layer and positioned such that said conductive traces form a multi-layer PCB stack, and wherein a first one of said conductive traces is formed on the top surface of said PCB stack and a second one of said conductive traces is formed on the bottom surface of said PCB stack;
a plurality of conductors for interconnecting the terminal ends of each said conductive trace to form at least one turn of a winding;
a first separate conductive layer conductively attached to said first one of said conductive traces; and
a second separate conductive layer conductively attached to said second one of said conductive traces.
18. The component of claim 4 , wherein each said metal foil has a thickness that is greater than the thickness of each of said conductive traces of the multi-layer PCB stack.