IP Library Granted Patent US 7,042,076
Granted Patent B2
US 7,042,076 · App. 10/797,322 · Granted May 9, 2006

Vacuum sealed microdevice packaging with getters

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Quick Facts
Patent No.
US 7,042,076
App. No.
10/797,322
Granted
May 9, 2006
Kind
B2
Abstract

One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.

Claims (8)

1. A vacuum microdevice package comprising:

a fist cover, the first cover having a first surface including a recessed portion with one or more bond pads;

a second dielectric cover, the second dielectric cover aligned with the first dielectric cover;

a center layer sealed between the first surface of the first dielectric cover and the second dielectric cover, the center layer including a microelectronic device and one or more vias aligned with the bond pads on the recessed portion of the first dielectric cover; and

one or more getters deposited through the vias in the center layer and coupled to the one or more bond pads on the first surface of the first dielectric cover to maintain a constant vacuum level within the sealed microdevice package.

2. The package of claim 1 wherein the bond pads on the first surface of the one or more getters are symmetrically distributed on the microelectronic device.

3. The package of claim 1 wherein the first dielectric cover, second dielectric cover and center layer are sealed with a bond.

4. The package of claim 1 wherein the microelectronic device includes a gyroscope.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2011
From: NORTHROP GRUMMAN CORPORATION
To: NORTHROP GRUMMAN SYSTEMS CORPORATION
Reel/Frame 025597/0505 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2006
From: NORTHROP GRUMMAN CORPORATION
To: LITTON SYSTEMS, INC.
Reel/Frame 018148/0388 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2004
From: GEOSLING, CHRISTINE
To: NORTHROP GRUMMAN CORPORATION
Reel/Frame 015146/0193 →