Thin sheet mica wedges with semi-conducting properties
View Patent ↗The present invention provides for thin sheet wedges that comprise a mica matrix impregnated with a conductive resin. The mica matrix is composed of mica flakes. The thin sheet wedge has a semi-conductive property of 500–500,000 ohms per square. In one embodiment the thin sheet wedge further comprises at least one glass fiber layer. In a particular embodiment the glass fiber layer is a backing for the mica matrix. In another particular embodiment the glass fiber is interwoven with the mica matrix. The glass fiber layer may itself be impregnated with a conductive resin.
1. Semi-conducting thin sheet wedges comprising:
a mica matrix, wherein said mica matrix comprises mica flakes; and
a conductive resin impregnated within said mica matrix;
wherein said thin sheet wedges have a semi-conductive property of between 500–500,000 ohms per square, wherein said conductive resin comprises a resin and conductive particles.
2. The semi-conducting thin sheet wedges of claim 1 , wherein said thin sheet wedges have a thickness of between about 15–80 mils (0.38–2.0 mm).
3. The semi-conducting thin sheet wedges of claim 1 , wherein said mica flakes comprise at least one of muscovite, phlogopite and combinations thereof.
4. The semi-conducting thin sheet wedges of claim 1 , wherein said resin comprises approximately 15–40% by weight of said thin sheet wedges.
5. The semi-conducting thin sheet wedges of claim 1 , wherein said resin comprises C-black.
6. The semi-conducting thin sheet, wedges of claim 1 , wherein said thin sheet wedges have a tensile modulus of between 1–8 million PSI.
7. The semi-conducting thin sheet wedges of claim 1 , wherein said thin sheet wedges further comprises at least one glass fiber layer.
8. The semi-conducting thin sheet wedges of claim 7 , wherein the ratio of the mica in said mica matrix to the glass fiber is approximately between 2:1 and 7:1 by weight.
9. The semi-conducting thin sheet wedges of claim 7 , wherein said at least one glass fiber layer forms a backing for said mica matrix.
10. The semi-conducting thin sheet wedges of claim 7 , wherein said at least one glass fiber layer is interwoven with said mica matrix.
11. The semi-conducting thin sheet wedges of claim 10 , wherein said at least one glass fiber layer is interwoven in a half-lap manner.
12. Semi-conducting thin sheet wedges comprising:
a mica matrix, wherein said mica matrix comprises mica flakes;
at least one layer of glass fiber; and
a conductive resin impregnated within at least one of said mica matrix and said at least one layer of glass fiber, wherein said conductive resin comprises a resin and conductive particles;
wherein said thin sheet wedges have a semi-conductive property of between 500–500,000 ohms per square;
wherein said thin sheet wedges have a tensile modulus of between 1–8 million PSI.
13. The semi-conducting thin sheet wedges of claim 12 , wherein the ratio of the mica in said mica matrix to the glass fiber is approximately between 2:1 and 7:1 by weight.
14. The semi-conducting thin sheet wedges of claim 12 , wherein said at least one glass fiber layer forms a backing for said mica matrix.
15. The semi-conducting thin sheet wedges of claim 12 , wherein said at least one glass fiber layer is interwoven with said mica matrix.
16. The semi-conducting thin sheet wedges of claim 15 , wherein said at least one glass fiber layer is interwoven in a half-lap manner.
17. The semi-conducting thin sheet wedges of claim 12 , wherein said mica flakes comprise at least one of muscovite, phlogopite and combinations thereof.
18. The semi-conducting thin sheet wedges of claim 12 , wherein said resin comprises approximately 15–40% by weight of said thin sheet wedges.
19. The semi-conducting thin sheet wedges of claim 12 , wherein said resin comprises C-black.
20. A method for making semi-conductive thin sheet wedges comprising:
layering a mica matrix onto a glass fiber backing, wherein said mica matrix comprises mica flakes;
impregnating into said mica matrix and said glass fiber a conductive resins,
wherein said conductive resin comprises a resin and conductive particles; and
curing said conductive resin.