Dry etching method for semiconductor device
View Patent ↗The present invention provides a device having an N type polysilicon gate and a P type polysilicon gate disposed therein, wherein when both gates are simultaneously etched, they are disposed in such a manner that the area of a non-doped polysilicon gate corresponding to a dummy electrode becomes larger than the total area of the N type and P type doped polysilicon gates, thereby causing non-doped polysilicon to become dominant over doped polysilicon, whereby the polysilicon gates are dry-etched.
1. A dry etching method for a semiconductor device, comprising:
providing a polysilicon layer formed on a silicon substrate;
implanting a first region of the polysilicon layer with N type ions and a second region of the polysilicon layer with P type ions, a further region of the polysilicon layer being left as a non-doped region;
simultaneously gate-etching an N type polysilicon gate electrode from the first region, a P type polysilicon gate electrode from the second region, and a non-doped polysilicon dummy gate arrangement from the non-doped region of the polysilicon layer during a two-stage etching process;
wherein the N type polysilicon gate electrode has an area that is smaller than the area of the first region of the polysilicon layer and the P type polysilicon gate electrode has an area that is smaller than the area of the second region of the polysilicon layer,
wherein the etched area of the non-doped polysilicon region is larger than the sum of the etched area of the first region of the polysilicon layer and the etched area of the second region of the polysilicon layer, and
wherein an end point detection of one of the stages of the etching process is based on the etching of the non-doped polysilicon dummy gate arrangement.
2. The dry etching method according to claim 1 , wherein the two-stage etching includes a first stage using a mixed gas of HBr and O 2 and a second stage using a mixed gas of HBr, O 2 and He.
3. The dry etching method according to claim 1 , wherein the N type polysilicon gate electrode and the P type polysilicon gate electrode are disposed adjacent one another.
4. The dry etching method of claim 1 , wherein the non-doped polysilicon dummy gate arrangement is disposed adjacent to at least one of the N type polysilicon gate electrode and the P type polysilicon gate electrode.
5. A dry etching method for a semiconductor device, comprising:
providing a polysilicon layer formed on a semiconductor substrate;
implanting a first region of the polysilicon layer with N type ions and a second region of the polysilicon layer with P type ions, a further region of the polysilicon layer being left as a non-doped region; and
simultaneously etching an N type polysilicon gate electrode from the first region, a P type polysilicon gate electrode from the second region, and a non-doped polysilicon dummy gate arrangement from the non-doped region of the polysilicon layer during a multi-stage etching process,
wherein the N type polysilicon gate electrode has an area that is smaller than the area of the first region of the polysilicon layer and the P type polysilicon gate electrode has an area that is smaller than the area of the second region of the polysilicon layer,
wherein the etched area of the non-doped polysilicon region is larger than the sum of the etched area of the first region of the polysilicon layer and the etched area of the second region of the polysilicon layer, and
wherein the etching process includes at least one etching stage in which end point detection is based on the etching of the non-doped polysilicon dummy gate arrangement.
6. The dry etching method according to claim 5 , wherein the non-doped polysilicon dummy gate arrangement is disposed adjacent at least one of the P type polysilicon gate electrode and the N type polysilicon gate electrode.
7. The dry etching method according to claim 5 , wherein the P type polysilicon gate electrode is disposed adjacent to the N type polysilicon gate electrode.
8. The dry etching method according to claim 5 , wherein the at least one etching stage is conducted using a mixed gas of HBr and O 2 .
9. The dry etching method according to claim 5 , wherein the at least one etching stage is conducted using a mixed gas of HBr, O 2 , and He.