Ink jet printer with extended nozzle plate and method
View Patent ↗The invention provides a micro-fluid ejection head for a micro-fluid ejection device and a method for making a micro-fluid ejection head. The micro-fluid ejection head includes a semiconductor substrate containing fluid ejection devices electrically connected to contact pads on a surface thereof. A TAB circuit including lead beams is electrically connected to the contact pads on the semiconductor substrate surface. A nozzle plate structure is provided and installed relative to the TAB circuit so as to substantially cover the lead beams and contact pads in order to protect the lead beams and contact pads from exposure to fluid ejected by the micro-fluid ejection device. The micro-fluid ejection head is effective to reduce contact between electrical components and the fluid without the use of a separate encapsulant material.
1. A micro-fluid ejection device, comprising:
a fluid ejection chip having a first length and a first width and having a first side and a second side, the first side including a plurality of fluid ejection actuators and a plurality of bond pads;
a flexible circuit having a first side and a second side, a window therein, and leads disposed in the window, wherein the window of the flexible circuit circumscribes the chip and each of the leads is electrically connected to corresponding bond pads on the first side of the chip through the window to supply electrical impulses to activate the fluid ejection actuators; and
a nozzle plate structure containing a plurality of nozzle holes therein, the nozzle plate structure having a second length and a second width and being attached to the flexible circuit and chip, wherein the nozzle plate structure overlaps the first side of the chip and at least the leads and bond pads,
wherein the nozzle plate structure is effective to retard fluid contact with the bond pads and leads in the absence of an encapsulant.
2. The device of claim 1 , wherein the nozzle plate structure comprises a polyimide film.
3. The device of claim 1 , wherein the nozzle plate structure comprises a nozzle plate and a protection plate circumscribing the nozzle plate.
4. The device of claim 3 , wherein the protection plate comprises a polyamide material.
5. The device of claim 3 , wherein the second width is greater than the first width.
6. The device of claim 5 , wherein the second length is greater than the first length.
7. The device of claim 3 , wherein the protection plate overlaps the first side of the chip and the leads and bond pads.
8. A printhead comprising the fluid ejection device of claim 3 .
9. The printhead of claim 8 , wherein the nozzle plate comprises a polyimide material.
10. A printhead comprising the fluid ejection device of claim 1 .