IP Library Granted Patent US 7,108,360
Granted Patent B2
US 7,108,360 · App. 10/801,560 · Granted Sep 19, 2006

Structure of stacked inkjet head

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Quick Facts
Patent No.
US 7,108,360
App. No.
10/801,560
Granted
Sep 19, 2006
Kind
B2
Abstract

A structure of the stacked inkjet head is composed of a stacked fluid structure and an actuator. At least one of the several plates in the stacked fluid structure has a junction with a tuning hole for enhancing the connection strength of the junction, accommodating overflown adhesive, and reducing structural deformation resulted from the temperature. The invention also avoids the troubles of inhomogeneous etching speeds when making nozzles or channels.

Claims (8)

1. A stacked inkjet head structure comprising:

a stacked fluid structure, which is formed by stacking a plurality of plates and has at least one fluid channels, ink cavities, and nozzles, each of the plates having at least one through holes connected with one another to form the fluid channels, the ink cavities, and the nozzles and at least one of the plates has a at least one adjusting holes, the fluid channels provide passages for a fluid to enter the ink cavities and the ink cavities eject the fluid out of the nozzles; and

an actuator, which is connected to the stacked fluid structure to impose a pressure on the ink cavities,

the adjusting holes are blind holes that do not penetrate through the plate.

2. The stacked inkjet head structure of claim 1 , further containing an adhesive coated on the junction surface of the plate with adjusting holes.

3. The stacked inkjet head structure of claim 1 , wherein the adjusting holes and the through holes on the plate with adjusting holes are formed by wet etching.

4. The stacked inkjet head structure of claim 1 , wherein the plate is a silicon substrate.

5. The stacked inkjet head structure of claim 1 , wherein the plate is a ceramic substrate.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2024
From: TRANSPACIFIC IP LTD.
To: CHINCHIKO KO GROUP LTD., LLC
Reel/Frame 068786/0563 →
MERGER Recorded Jun 19, 2016
From: TRANSPACIFIC IP I LTD.
To: TRANSPACIFIC IP LTD
Reel/Frame 039078/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2009
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: TRANSPACIFIC IP I LTD.
Reel/Frame 023419/0985 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2004
From: LU, CHUN-FU; HSU, FA-YUAN; LIU, HOWARD; WANG, CHENG-YI; CHEN, HUEN-LING; LO, CHI-BIN
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 015106/0004 →