IP Library › Granted Patent US 7,141,441
Granted Patent B2
US 7,141,441 · App. 10/801,821 · Granted Nov 28, 2006

Surface emitting semiconductor laser and manufacturing method thereof

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Quick Facts
Patent No.
US 7,141,441
App. No.
10/801,821
Granted
Nov 28, 2006
Kind
B2
Abstract

There is provided a surface emitting semiconductor laser satisfying a requirement of making a transverse mode stable and having characteristics of high output power, low resistance, high efficiency, and high speed response and a method for manufacturing the surface emitting semiconductor laser. Five holes are formed on the top surface of an upper multilayer reflection film formed in the shape of a post by the use of a focused ion beam (FIB) processing unit. One hole is formed on the surface of an upper multilayer reflection film corresponding to the center position of a square current injection region which is about 8 μm square and the remaining four holes are formed at the corners of the square current injection region, for example, at the positions about 2 μm square away from the one hole to produce four light emitting spots.

Claims (25)

1. A method for manufacturing a surface emitting semiconductor laser, the method comprising:

forming, on the main surface of a semiconductor substrate, a lower reflection layer, an active layer in which a quantum well layer is formed, and an upper reflection layer having a surface layer which forms a light emitting surface of a light emitting region on an inner layer side or an upper layer side of said upper reflection layer;

forming a post portion in the shape of a pillar with at least the upper reflection layer partially remaining;

forming a boundary region for suppressing light emission of oscillation modes except for a single specific oscillation mode; and

substantially forming a light emitting spot corresponding to the specific oscillation mode by processing a part of the region of the surface of the upper reflection layer which is exposed to the surface of the post portion wherein

the surface layer comprises semiconductor material.

2. A method for manufacturing a surface emitting semiconductor laser according to claim 1 , wherein forming the lower reflection layer, the active layer and the upper reflection layer includes forming an etch preventing layer on the lower layer side of the surface layer.

3. The method of claim 1 , wherein forming the lower reflection layer, the active layer and the upper reflection layer comprises laminating the lower reflection layer, the active layer and the upper reflection layer.

4. The method of claim 3 , wherein laminating the lower reflection layer, the active layer and the upper reflection layer comprises laminating in sequence the lower reflection layer, the active layer and the upper reflection layer.

5. A method for manufacturing a surface emitting semiconductor laser, the method comprising:

forming, on the main surface of a semiconductor substrate, a lower reflection layer, an active layer in which a quantum well layer is formed, and an upper reflection layer having a surface layer that comprises semiconductor material and which forms a light emitting surface of a single light emitting region on an inner layer side or an upper layer side of said upper reflection layer;

forming a post portion in the shape of a pillar with at least the upper reflection layer partially remaining;

forming a boundary region for suppressing light emission of oscillation modes except for a specific oscillation mode; and

substantially forming a light emitting spot corresponding to the specific oscillation mode by processing a part of the region of the surface of the upper reflection layer which is exposed to the surface of the post portion,

wherein forming the lower reflection layer, the active layer and the upper reflection layer includes forming an etch preventing layer on the lower layer side of the surface layer, and wherein forming the etch preventing layer comprises laminating the etch preventing layer on the lower layer side of the surface layer.

6. A method for manufacturing a surface emitting semiconductor laser, the method comprising:

forming, on the main surface of a semiconductor substrate, a lower reflection layer, an active layer in which a quantum well layer is formed, and an upper reflection layer having a surface layer which forms a light emitting surface of a light emitting region on an inner layer side or an upper layer side of said upper reflection layer;

forming a post portion in the shape of a pillar with at least the upper reflection layer partially remaining;

forming a boundary region for suppressing light emission of oscillation modes except for a specific oscillation mode; and

substantially forming a light emitting spot corresponding to the specific oscillation mode by processing a part of the region of the surface of the upper reflection layer which is exposed to the surface of the post portion;

wherein the surface layer comprises semiconductor material, and a media of the surface layer which forms the light emitting surface of the light emitting region has a different refractive index than a media of a surface layer of a neighboring light emitting region.

7. A method for manufacturing a surface emitting semiconductor laser according to claim 6 , wherein forming the lower reflection layer, the active layer and the upper reflection layer includes forming an etch preventing layer on the lower layer side of the surface layer.

8. The method of claim 6 , wherein forming the lower reflection layer, the active layer and the upper reflection layer comprises laminating the lower reflection layer, the active layer and the upper reflection layer.

9. The method of claim 8 , wherein laminating the lower reflection layer, the active layer and the upper reflection layer comprises laminating in sequence the lower reflection layer, the active layer and the upper reflection layer.

10. The method of claim 7 , wherein forming the etch preventing layer comprises laminating the etching preventing layer on the lower layer side of the surface layer.